US5291371A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Thermal joint
Assignee: International Business Machines Corp
•
Filing: 1990-04-27
•
Granted: 1994-03-01
•
Expires: 2010-04-27
Abstract
Abstract A thermal joint for transferring heat from a first object to a second object contains a first relatively thick layer of high bulk thermal conductivity material and a second relatively thin layer of lubricant. In a preferred embodiment an anti-adhesion coating is also present in the joint. The thermal joint completely fills the gap between the first and second objects while enabling relative sliding motion to compensate for any lateral distortion.
Inventors
- 👤 Peter A. Gruber
- 👤 Arthur R. Zingher
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 15:10
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/70; H10W40/77; F; F28; F28F; F28F13/00; H10W40/20; H10W40/25; H10W40/251; H10W40/258; F28F2013/005; F28F2013/006; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20; H10W72/851; H10W72/874; H10W72/877
Claims Analysis
Total Claims: 69
Claim 1
Independent Claim
127 words
A thermal joint adapted to be disposed between a first heat emitting object and second heat removing object for transferring heat from the first object to the second object while providing compliance for object dimensional variation and thermally induced object variations, the thermal joint comprising: a first layer of high bulk thermal conductivity material adapted to be located in thermal contact with the heat emitting object, and a second layer in contact with said first layer, said second layer being a lubricant having a thickness thinner than said first layer, and said second layer being adapted to be located in thermal contact with the heat removing object; wherein said first layer is a solder having a melting temperature in the range between 85° C. and 183° C.
Claim 2
Dependent Claim
127 words
A thermal joint adapted to be disposed between a first heat emitting object and second heat removing object for transferring heat from the first object to the second object while providing compliance for object dimensional variation and thermally induced object variations, the thermal joint comprising: a first layer of high bulk thermal conductivity material adapted to be located in thermal contact with the heat emitting object, and a second layer in contact with said first layer, said second layer being a lubricant having a thickness thinner than said first layer, and said second layer being adapted to be located in thermal contact with the heat removing object; wherein said first layer is a solder having a melting temperature in the range between 85° C. and 183° C.
Claim 3
Dependent Claim
16 words
A thermal joint as set forth in claim 1, wherein said first layer is a metal.
Claim 4
Dependent Claim
24 words
A thermal joint as set forth in claim 1, wherein said second layer is less than one-third of the thickness of said first layer.
Claim 5
Dependent Claim
29 words
A thermal joint as set forth in claim 1, wherein said first layer is greater than 10 microns thick and said second layer is less than 3 microns thick.
Claim 6
Dependent Claim
16 words
A thermal joint as set forth in claim 1, wherein said first layer is eutectic solder.
Claim 7
Dependent Claim
34 words
A thermal joint as set forth in claim 1, wherein said second layer is selected from the group consisting of low viscosity poly-alyphatic olefin, mineral oil, silicone oil, synthetic oil, gallium and liquid metal.
Claim 8
Dependent Claim
24 words
A thermal joint as set forth in claim 1, further comprising retainer means adapted for positioning said first layer relative to said first object.
Claim 9
Dependent Claim
122 words
A thermal joint adapted to be disposed between a first heat emitting object and a second heat removing object for transferring heat from the first object to the second object while providing compliance for object dimensional variation and thermally induced object variations, the thermal joint comprising: a first layer of high bulk thermal conductivity material adapted to be located in thermal contact with the heat emitting object; and a second layer in contact with said first layer, said second layer being a lubricant having a thickness thinner than said first layer, and said second layer being adapted to be located in thermal contact with the heat removing object; wherein said first layer is Bi/Sn solder and said second layer is poly-alyphatic oil.
Claim 10
Dependent Claim
122 words
A thermal joint adapted to be disposed between a first heat emitting object and a second heat removing object for transferring heat from the first object to the second object while providing compliance for object dimensional variation and thermally induced object variations, the thermal joint comprising: a first layer of high bulk thermal conductivity material adapted to be located in thermal contact with the heat emitting object; and a second layer in contact with said first layer, said second layer being a lubricant having a thickness thinner than said first layer, and said second layer being adapted to be located in thermal contact with the heat removing object; wherein said first layer is Bi/Sn solder and said second layer is poly-alyphatic oil.
Claim 11
Dependent Claim
111 words
A thermal joint adapted to be disposed between a first heat emitting object and a second heat removing object for transferring heat from the first object to the second object while providing compliance for object dimensional variation and thermally induced object variations, the thermal joint comprising: a first layer of high bulk thermal conductivity material adapted to be located in thermal contact with the heat emitting object; a second layer in contact with said first layer, said second layer being a lubricant having a thickness thinner than said first layer, and said second layer being adapted to be located in thermal contact with the heat removing object; and an anti-adhesion coating.
Claim 12
Dependent Claim
111 words
A thermal joint adapted to be disposed between a first heat emitting object and a second heat removing object for transferring heat from the first object to the second object while providing compliance for object dimensional variation and thermally induced object variations, the thermal joint comprising: a first layer of high bulk thermal conductivity material adapted to be located in thermal contact with the heat emitting object; a second layer in contact with said first layer, said second layer being a lubricant having a thickness thinner than said first layer, and said second layer being adapted to be located in thermal contact with the heat removing object; and an anti-adhesion coating.
Claim 13
Dependent Claim
26 words
A thermal joint as set forth in claim 9 wherein said anti-adhesion coating is selected from the group consisting of perfluropolyether, perfluropolyacrylate, perflurocarbon and molydenum disulfide.
Claim 14
Dependent Claim
120 words
A thermal joint adapted to be disposed between a first emitting object and a second heat removing object for transferring heat from the first object to the second object while providing compliance for object dimensional variation and thermally induced object variations, the thermal joint comprising: a first layer of high bulk thermal conductivity material adapted to be located in thermal contact with the heat emitting object; a second layer in contact with said first layer, said second layer being a lubricant having a thickness thinner than said first layer, and said second layer being adapted to be located in thermal contact with the heat removing object; and a metal foil layer disposed between said first layer and said second layer.
Claim 15
Dependent Claim
120 words
A thermal joint adapted to be disposed between a first emitting object and a second heat removing object for transferring heat from the first object to the second object while providing compliance for object dimensional variation and thermally induced object variations, the thermal joint comprising: a first layer of high bulk thermal conductivity material adapted to be located in thermal contact with the heat emitting object; a second layer in contact with said first layer, said second layer being a lubricant having a thickness thinner than said first layer, and said second layer being adapted to be located in thermal contact with the heat removing object; and a metal foil layer disposed between said first layer and said second layer.
Claim 16
Dependent Claim
31 words
A thermal joint as set forth in claim 1 wherein said first layer is an alloy comprising a first metal that is self-passivating and a second metal that expands upon freezing.
Claim 17
Dependent Claim
137 words
A thermal joint adapted to be disposed between a first heat emitting object and a second heat removing object for transferring heat from the first object to the second object while providing compliance for object dimensional variation and thermally induced object variations, the thermal joint comprising: a first layer of high bulk thermal conductivity material adapted to be located in thermal contact with the heat emitting object; a second layer in contact with said first layer, said second layer being a lubricant having a thickness thinner than said first layer, and said second layer being adapted to be located in thermal contact with the heat removing object; and a button layer disposed between said first layer and said second layer, said button layer having a bulk thermal conductivity and thickness greater than that of said first layer.
Claim 18
Dependent Claim
137 words
A thermal joint adapted to be disposed between a first heat emitting object and a second heat removing object for transferring heat from the first object to the second object while providing compliance for object dimensional variation and thermally induced object variations, the thermal joint comprising: a first layer of high bulk thermal conductivity material adapted to be located in thermal contact with the heat emitting object; a second layer in contact with said first layer, said second layer being a lubricant having a thickness thinner than said first layer, and said second layer being adapted to be located in thermal contact with the heat removing object; and a button layer disposed between said first layer and said second layer, said button layer having a bulk thermal conductivity and thickness greater than that of said first layer.
Claim 19
Dependent Claim
23 words
A thermal joint as set forth in claim 13 further comprising a barrier layer disposed between said button layer and said first layer.
Claim 20
Dependent Claim
15 words
A thermal joint as set forth in claim 14 wherein said barrier layer comprises foil.
Claim 21
Dependent Claim
109 words
A thermal joint adapted to be disposed between an electronic component and a cooling means for transferring heat between the component and the cooling means and for compensating for dimensional variations and thermally induced variations of the component, the thermal joint comprising: a first layer of high bulk thermal conductivity material adapted to be located in thermal contact with the electronic component, and a second layer in contact with said first layer, said second layer being a lubricant having a thickness thinner than said first layer, and said second layer being adapted to be located in thermal contact with the cooling means; wherein said first layer is eutectic solder.
Claim 22
Dependent Claim
109 words
A thermal joint adapted to be disposed between an electronic component and a cooling means for transferring heat between the component and the cooling means and for compensating for dimensional variations and thermally induced variations of the component, the thermal joint comprising: a first layer of high bulk thermal conductivity material adapted to be located in thermal contact with the electronic component, and a second layer in contact with said first layer, said second layer being a lubricant having a thickness thinner than said first layer, and said second layer being adapted to be located in thermal contact with the cooling means; wherein said first layer is eutectic solder.
Claim 23
Dependent Claim
30 words
A thermal joint as set forth in claim 16, wherein said first layer is a solder and said second layer is less than one-third the thickness of said first layer.
Claim 24
Dependent Claim
115 words
A thermal joint adapted to be disposed between an electronic component and a cooling means for transferring heat between the component and the cooling means and for compensating for dimensional variations and thermally induced variations of the component, the thermal joint comprising: a first layer of high bulk thermal conductivity material adapted to be located in thermal contact with the electronic component; and a second layer in contact with said first layer, said second layer being a lubricant having a thickness thinner than said first layer, and said second layer being adapted to be located in thermal contact with the cooling means; wherein said first layer is solder and said second layer is poly-alyphatic oil.
Claim 25
Dependent Claim
115 words
A thermal joint adapted to be disposed between an electronic component and a cooling means for transferring heat between the component and the cooling means and for compensating for dimensional variations and thermally induced variations of the component, the thermal joint comprising: a first layer of high bulk thermal conductivity material adapted to be located in thermal contact with the electronic component; and a second layer in contact with said first layer, said second layer being a lubricant having a thickness thinner than said first layer, and said second layer being adapted to be located in thermal contact with the cooling means; wherein said first layer is solder and said second layer is poly-alyphatic oil.
Claim 26
Dependent Claim
127 words
A thermal joint adapted to be disposed between an electronic component and a cooling means for transferring heat between the component and the cooling means and for compensating for dimensional variations and thermally induced variations of the component, the thermal joint comprising: a first layer of high bulk thermal conductivity material adapted to be located in thermal contact with the electronic component; and a second layer in contact with said first layer, said second layer being a lubricant having a thickness thinner than said first layer, and said second layer being adapted to be located in thermal contact with the cooling means; wherein said second layer is selected from the group consisting of low viscosity poly-aliphatic olefin, mineral oil, silicone oil, synthetic oil, gallium and liquid metal.
Claim 27
Dependent Claim
127 words
A thermal joint adapted to be disposed between an electronic component and a cooling means for transferring heat between the component and the cooling means and for compensating for dimensional variations and thermally induced variations of the component, the thermal joint comprising: a first layer of high bulk thermal conductivity material adapted to be located in thermal contact with the electronic component; and a second layer in contact with said first layer, said second layer being a lubricant having a thickness thinner than said first layer, and said second layer being adapted to be located in thermal contact with the cooling means; wherein said second layer is selected from the group consisting of low viscosity poly-aliphatic olefin, mineral oil, silicone oil, synthetic oil, gallium and liquid metal.
Claim 28
Dependent Claim
105 words
A thermal joint adapted to be disposed between an electronic component and a cooling means for transferring heat between the component and the cooling means and for compensating for dimensional variations and thermally induced variations of the component, the thermal joint comprising: a first layer of high bulk thermal conductivity material adapted to be located in thermal contact with the electronic component; a second layer in contact with said first layer, said second layer being a lubricant having a thickness thinner than said first layer, and said second layer being adapted to be located in thermal contact with the cooling means; and an anti-adhesion coating.
Claim 29
Dependent Claim
105 words
A thermal joint adapted to be disposed between an electronic component and a cooling means for transferring heat between the component and the cooling means and for compensating for dimensional variations and thermally induced variations of the component, the thermal joint comprising: a first layer of high bulk thermal conductivity material adapted to be located in thermal contact with the electronic component; a second layer in contact with said first layer, said second layer being a lubricant having a thickness thinner than said first layer, and said second layer being adapted to be located in thermal contact with the cooling means; and an anti-adhesion coating.
Claim 30
Dependent Claim
26 words
A thermal joint as set forth in claim 20, wherein said anti-adhesion coating is selected from the group consisting of perfluropolyether, perfluropolyacrylate, perflurocarbon and molybdenum disulfate.
Claim 31
Dependent Claim
115 words
A thermal joint adapted to be disposed between an electronic component and a cooling means for transferring heat between the component and the cooling means and for compensating for dimensional variations and thermally induced variations of the component, the thermal joint comprising: a first layer of high bulk thermal conductivity material adapted to be located in thermal contact with the electronic component; a second layer in contact with said first layer, said second layer being a lubricant having a thickness thinner than said first layer, and said second layer being adapted to be located in thermal contact with the cooling means; and a metal foil layer disposed between said first layer and said second layer.
Claim 32
Dependent Claim
115 words
A thermal joint adapted to be disposed between an electronic component and a cooling means for transferring heat between the component and the cooling means and for compensating for dimensional variations and thermally induced variations of the component, the thermal joint comprising: a first layer of high bulk thermal conductivity material adapted to be located in thermal contact with the electronic component; a second layer in contact with said first layer, said second layer being a lubricant having a thickness thinner than said first layer, and said second layer being adapted to be located in thermal contact with the cooling means; and a metal foil layer disposed between said first layer and said second layer.
Claim 33
Dependent Claim
31 words
A thermal joint as set forth in claim 16 wherein said first layer is an alloy comprising a first metal that is self-passivating and a second metal that expands upon freezing.
Claim 34
Dependent Claim
131 words
A thermal joint adapted to be disposed between an electronic component and a cooling means for transferring heat between the component and the cooling means and for compensating for dimensional variations and thermally induced variations of the component, the thermal joint comprising: a first layer of high bulk thermal conductivity material adapted to be located in thermal contact with the electronic component; a second layer in contact with said first layer, said second layer being a lubricant having a thickness thinner than said first layer, and said second layer being adapted to be located in thermal contact with the cooling means; and a button layer disposed between said first layer and said second layer, said button layer having a bulk thermal conductivity and thickness greater than that of said first layer.
Claim 35
Dependent Claim
131 words
A thermal joint adapted to be disposed between an electronic component and a cooling means for transferring heat between the component and the cooling means and for compensating for dimensional variations and thermally induced variations of the component, the thermal joint comprising: a first layer of high bulk thermal conductivity material adapted to be located in thermal contact with the electronic component; a second layer in contact with said first layer, said second layer being a lubricant having a thickness thinner than said first layer, and said second layer being adapted to be located in thermal contact with the cooling means; and a button layer disposed between said first layer and said second layer, said button layer having a bulk thermal conductivity and thickness greater than that of said first layer.
Claim 36
Dependent Claim
23 words
A thermal joint as set forth in claim 24 further comprising a barrier layer disposed between said button layer and said first layer.
Claim 37
Dependent Claim
15 words
A thermal joint as set forth in claim 25 wherein said barrier layer comprises foil.
Claim 38
Dependent Claim
114 words
A thermal joint adapted to be disposed between an electronic component and a cooling means for transferring heat between the component and the cooling means and for compensating for dimensional variations and thermally induced variations of the component, the thermal joint comprising: a first layer of high bulk thermal conductivity material adapted to be located in thermal contact with the electronic component; a second layer in contact with said first layer, said second layer being a lubricant having a thickness thinner than said first layer, and said second layer being adapted to be located in thermal contact with the cooling means; and retainer means disposed for positioning said first layer relative to said component.
Claim 39
Dependent Claim
114 words
A thermal joint adapted to be disposed between an electronic component and a cooling means for transferring heat between the component and the cooling means and for compensating for dimensional variations and thermally induced variations of the component, the thermal joint comprising: a first layer of high bulk thermal conductivity material adapted to be located in thermal contact with the electronic component; a second layer in contact with said first layer, said second layer being a lubricant having a thickness thinner than said first layer, and said second layer being adapted to be located in thermal contact with the cooling means; and retainer means disposed for positioning said first layer relative to said component.
Claim 40
Dependent Claim
136 words
An electronic assembly including a thermal joint comprising: a substrate; at least one electronic component attached to said substrate; cooling means; a thermal joint for transferring heat from said at least one electronic component to said cooling means while providing compliance for manufacturing and for thermally induced variations of said at least one electronic component, said thermal joint comprising: a first layer of planarized high thermal conductivity material adapted to be in thermal contact with said at least one electronic component, and a second layer of lubricant having a thickness less than that of said first layer, said second layer being adapted to be in thermal contact with said cooling means; wherein said second layer is selected from the group consisting of low viscosity poly-aliphatic olefin, mineral oil, silicone oil, synthetic oil, gallium and liquid metal.
Claim 41
Dependent Claim
136 words
An electronic assembly including a thermal joint comprising: a substrate; at least one electronic component attached to said substrate; cooling means; a thermal joint for transferring heat from said at least one electronic component to said cooling means while providing compliance for manufacturing and for thermally induced variations of said at least one electronic component, said thermal joint comprising: a first layer of planarized high thermal conductivity material adapted to be in thermal contact with said at least one electronic component, and a second layer of lubricant having a thickness less than that of said first layer, said second layer being adapted to be in thermal contact with said cooling means; wherein said second layer is selected from the group consisting of low viscosity poly-aliphatic olefin, mineral oil, silicone oil, synthetic oil, gallium and liquid metal.
Claim 42
Dependent Claim
16 words
An electronic assembly as set forth in claim 28, wherein said first layer is a metal.
Claim 43
Dependent Claim
15 words
An electronic assembly as set forth in claim 28, wherein said first layer is solder.
Claim 44
Dependent Claim
17 words
An electronic assembly as set forth in claim 28, wherein said solder is a bismuth-tin eutectic solder.
Claim 45
Dependent Claim
143 words
An electronic assembly including a thermal joint comprising: a substrate; at least one electronic component attached to said substrate; cooling means; a thermal joint for transferring heat from said at least one electronic component to said cooling means while providing compliance for manufacturing and for thermally induced variations of said at least one electronic component, said thermal joint comprising: a first layer of planarized high thermal conductivity material adapted to be in thermal contact with said at least one electronic component; and a second layer of lubricant having a thickness less than that of said first layer, said first layer and said second layer being adapted to be disposed between said at least one electronic component and said cooling means, said second layer being adapted to be in thermal contact with said cooling means; wherein said thermal joint further comprises an anti-adhesion coating.
Claim 46
Dependent Claim
143 words
An electronic assembly including a thermal joint comprising: a substrate; at least one electronic component attached to said substrate; cooling means; a thermal joint for transferring heat from said at least one electronic component to said cooling means while providing compliance for manufacturing and for thermally induced variations of said at least one electronic component, said thermal joint comprising: a first layer of planarized high thermal conductivity material adapted to be in thermal contact with said at least one electronic component; and a second layer of lubricant having a thickness less than that of said first layer, said first layer and said second layer being adapted to be disposed between said at least one electronic component and said cooling means, said second layer being adapted to be in thermal contact with said cooling means; wherein said thermal joint further comprises an anti-adhesion coating.
Claim 47
Dependent Claim
26 words
An electronic assembly as set forth in claim 32, wherein said anti-adhesion coating is selected from the group consisting of perfluropolyether, perfluropolyacrylate, perflurocarbon and molybdenum disulfide.
Claim 48
Dependent Claim
152 words
An electronic assembly including a thermal joint comprising: a substrate; at least one electronic component attached to said substrate; cooling means; a thermal joint for transferring heat from said at least one electronic component to said cooling means while providing compliance for manufacturing and for thermally induced variations of said at least one electronic component, said thermal joint comprising: a first layer of planarized high thermal conductivity material adapted to be in thermal contact with said at least one electronic component; a second layer of lubricant having a thickness less than that of said first layer, said first layer and said second layer being adapted to be disposed between said at least one electronic component and said cooling means, said second layer being adapted to be in thermal contact with said cooling means; and a foil layer disposed between said first and second layers and adapted to be coupled to said substrate.
Claim 49
Dependent Claim
152 words
An electronic assembly including a thermal joint comprising: a substrate; at least one electronic component attached to said substrate; cooling means; a thermal joint for transferring heat from said at least one electronic component to said cooling means while providing compliance for manufacturing and for thermally induced variations of said at least one electronic component, said thermal joint comprising: a first layer of planarized high thermal conductivity material adapted to be in thermal contact with said at least one electronic component; a second layer of lubricant having a thickness less than that of said first layer, said first layer and said second layer being adapted to be disposed between said at least one electronic component and said cooling means, said second layer being adapted to be in thermal contact with said cooling means; and a foil layer disposed between said first and second layers and adapted to be coupled to said substrate.
Claim 50
Dependent Claim
153 words
An electronic assembly including a thermal joint comprising: a substrate; at least one electronic component attached to said substrate; cooling means; a thermal joint for transferring heat from said at least one electronic component to said cooling means while providing compliance for manufacturing and for thermally induced variations of said at least one electronic component, said thermal joint comprising: a first layer of planarized high thermal conductivity material adapted to be in thermal contact with said at least one electronic component; and a second layer of lubricant having a thickness less than that of said first layer, said first layer and said second layer being adapted to be disposed between said at least one electronic component and said cooling means, said second layer being adapted to be in thermal contact with said cooling means; wherein said thermal joint further comprises retainer means adapted to be disposed on said at least one electronic component.
Claim 51
Dependent Claim
153 words
An electronic assembly including a thermal joint comprising: a substrate; at least one electronic component attached to said substrate; cooling means; a thermal joint for transferring heat from said at least one electronic component to said cooling means while providing compliance for manufacturing and for thermally induced variations of said at least one electronic component, said thermal joint comprising: a first layer of planarized high thermal conductivity material adapted to be in thermal contact with said at least one electronic component; and a second layer of lubricant having a thickness less than that of said first layer, said first layer and said second layer being adapted to be disposed between said at least one electronic component and said cooling means, said second layer being adapted to be in thermal contact with said cooling means; wherein said thermal joint further comprises retainer means adapted to be disposed on said at least one electronic component.
Claim 52
Dependent Claim
31 words
An electronic assembly as set forth in claim 35, wherein said retainer means includes a respective aperture disposed over a central area of an associated said at least one electronic component.
Claim 53
Dependent Claim
27 words
An electronic assembly as set forth in claim 36, wherein said retainer means is coupled to each said electronic component in the vicinity of the edges thereof.
Claim 54
Dependent Claim
21 words
An electronic assembly as set forth in claim 37, wherein said retainer means is coupled by adhesive means which peels cleanly.
Claim 55
Dependent Claim
31 words
An electronic assembly as set forth in claim 36, wherein the size of said respective aperture is commensurate with the power dissipated by said associated said at least one electronic component.
Claim 56
Dependent Claim
21 words
An electronic assembly as set forth in claim 34, further comprising retainer means disposed on said at least one electronic component.
Claim 57
Dependent Claim
31 words
An electronic assembly as set forth in claim 40, wherein said retainer means includes a respective aperture disposed over a central area of an associated said at least one electronic component.
Claim 58
Dependent Claim
31 words
An electronic assembly as set forth in claim 41, wherein said retainer means is coupled to each of said at least one electronic component in the vicinity of the edges thereof.
Claim 59
Dependent Claim
21 words
An electronic assembly as set forth in claim 42, wherein said retainer means is coupled by adhesive means which peels cleanly.
Claim 60
Dependent Claim
149 words
An electronic assembly including a thermal joint comprising: a substrate; at least one electronic component attached to said substrate; cooling means; a thermal joint for transferring heat from said at least one electronic component to said cooling means while providing compliance for manufacturing and for thermally induced variations of said at least one electronic component, said thermal comprising: a first layer of planarized high thermal conductivity material adapted to be in thermal contact with said at least one electronic component; and a second layer of lubricant having a thickness less than that of said first layer, said first layer and said second layer being adapted to be disposed between said at least one electronic component and said cooling means, said second layer being adapted to be in thermal contact with said cooling means; wherein at least one of said first layer or said cooling means includes a textured surface.
Claim 61
Dependent Claim
149 words
An electronic assembly including a thermal joint comprising: a substrate; at least one electronic component attached to said substrate; cooling means; a thermal joint for transferring heat from said at least one electronic component to said cooling means while providing compliance for manufacturing and for thermally induced variations of said at least one electronic component, said thermal comprising: a first layer of planarized high thermal conductivity material adapted to be in thermal contact with said at least one electronic component; and a second layer of lubricant having a thickness less than that of said first layer, said first layer and said second layer being adapted to be disposed between said at least one electronic component and said cooling means, said second layer being adapted to be in thermal contact with said cooling means; wherein at least one of said first layer or said cooling means includes a textured surface.
Claim 62
Dependent Claim
156 words
An electronic assembly including a thermal joint comprising: a substrate; at least one electronic component attached to said substrate; cooing means; a thermal joint for transferring heat from said at least one electronic component to said cooling means while providing compliance for manufacturing and for thermally induced variations of said at least one electronic component, and thermal joint comprising: a first layer of planarized high thermal conductivity material adapted to be in thermal contact with said at least one electronic component; and a second layer of lubricant having a thickness less than that of said first layer, said first layer and said second layer being adapted to be disposed between said at least one electronic component and said cooling means, said second layer being adapted to be in thermal contact with said cooling means; wherein said first layer is an alloy comprising a first metal that is self-passivating and a second metal that expands upon freezing.
Claim 63
Dependent Claim
156 words
An electronic assembly including a thermal joint comprising: a substrate; at least one electronic component attached to said substrate; cooing means; a thermal joint for transferring heat from said at least one electronic component to said cooling means while providing compliance for manufacturing and for thermally induced variations of said at least one electronic component, and thermal joint comprising: a first layer of planarized high thermal conductivity material adapted to be in thermal contact with said at least one electronic component; and a second layer of lubricant having a thickness less than that of said first layer, said first layer and said second layer being adapted to be disposed between said at least one electronic component and said cooling means, said second layer being adapted to be in thermal contact with said cooling means; wherein said first layer is an alloy comprising a first metal that is self-passivating and a second metal that expands upon freezing.
Claim 64
Dependent Claim
164 words
An electronic assembly including a thermal joint comprising: a substrate; at least one electronic component attached to said substrate; cooling means; a thermal joint for transferring heat from said at least one electronic component to said cooling means while providing compliance for manufacturing and for thermally induced variations of said at least one electronic component, said thermal joint comprising: a first layer of planarized high thermal conductivity material adapted to be in thermal contact with said at least one electronic component; and a second layer of lubricant having a thickness less than that of said first layer, said first layer and said second layer being adapted to be disposed between said at least one electronic component and said cooing means, said second layer being adapted to be in thermal contact with said cooling means; and a button layer disposed between said first layer and said second layer, said button layer having a bulk thermal conductivity and thickness greater than that of said first layer.
Claim 65
Dependent Claim
164 words
An electronic assembly including a thermal joint comprising: a substrate; at least one electronic component attached to said substrate; cooling means; a thermal joint for transferring heat from said at least one electronic component to said cooling means while providing compliance for manufacturing and for thermally induced variations of said at least one electronic component, said thermal joint comprising: a first layer of planarized high thermal conductivity material adapted to be in thermal contact with said at least one electronic component; and a second layer of lubricant having a thickness less than that of said first layer, said first layer and said second layer being adapted to be disposed between said at least one electronic component and said cooing means, said second layer being adapted to be in thermal contact with said cooling means; and a button layer disposed between said first layer and said second layer, said button layer having a bulk thermal conductivity and thickness greater than that of said first layer.
Claim 66
Dependent Claim
23 words
An electronic assembly as set forth in claim 46 further comprising a barrier layer disposed between said button layer and said first layer.
Claim 67
Dependent Claim
15 words
An electronic assembly as set forth in claim 47 wherein said barrier layer comprises foil.
Claim 68
Dependent Claim
144 words
An electronic assembly including a thermal joint comprising: a substrate; at least one electronic component attached to said substrate; cooling means; a thermal joint for transferring heat from said at least one electronic component to said cooling means while providing compliance for manufacturing and for thermally induced variations of said at least one electronic component, said thermal joint comprising: a first layer of planarized high thermal conductivity material adapted to be in thermal contact with said at least one electronic component; and a second layer of lubricant having a thickness less than that of said first layer, said first layer and said second layer being adapted to be disposed between said at least one electronic component and said cooling means, said second layer being adapted to be in thermal contact with said cooling means; wherein said cooing means comprises a bendable compliant bottom surface.
Claim 69
Dependent Claim
144 words
An electronic assembly including a thermal joint comprising: a substrate; at least one electronic component attached to said substrate; cooling means; a thermal joint for transferring heat from said at least one electronic component to said cooling means while providing compliance for manufacturing and for thermally induced variations of said at least one electronic component, said thermal joint comprising: a first layer of planarized high thermal conductivity material adapted to be in thermal contact with said at least one electronic component; and a second layer of lubricant having a thickness less than that of said first layer, said first layer and said second layer being adapted to be disposed between said at least one electronic component and said cooling means, said second layer being adapted to be in thermal contact with said cooling means; wherein said cooing means comprises a bendable compliant bottom surface.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-02-28 | 1997-08-30 | 1998-03-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-02-28 | 2001-08-30 | 2002-03-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-02-28 | 2005-08-30 | 2006-03-01 | $7700.00 | Window Closed / Lapsed |