US4546409A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Device for cooling semiconductor elements
Assignee: Mitsubishi Electric Corp
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Filing: 1983-03-25
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Granted: 1985-10-08
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Expires: 2003-03-25
Abstract
Abstract A device for cooling semiconductor elements is constituted by a plate for cooling semiconductor elements, the plate being made of aluminum or an aluminum alloy, and a semiconductor element-mounting sheet which is made of aluminum or an aluminum alloy, the sheet having on one surface thereof a metal layer to which solder can be applied as desired, and the other surface of the sheet being secured by ultrasonic welding to the plate in a recessed portion formed in the cooling plate by ultrasonic welding.
Inventors
- 👤 Souichi Yoshino
- 👤 Tadashi Kusanagi
- 👤 Masakazu Mori
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 19:15
CPC Classifications
H; H10; H10W; H10W72/00; H10W40/00; H10W40/10; H10W95/00
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
119 words
A device for cooling semiconductor elements, comprising: a cooling plate for cooling semiconductor elements, said plate being made of an aluminum material taken from the group consisting of aluminum and aluminum alloy and having recessed portions therein; and a preformed semiconductor element-mounting sheet which is made of an aluminum material taken from the group consisting of aluminum and aluminum alloy, said sheet having on one surface thereof a metal layer other than the metal of said mounting sheet and to which solder is readily bondable, and the other surface of said sheet being ultrasonically welded in an aluminum material to aluminum material bond to the aluminum material of said mounting sheet in a recessed portion of said cooling plate.
Claim 2
Independent Claim
119 words
A device for cooling semiconductor elements, comprising: a cooling plate for cooling semiconductor elements, said plate being made of an aluminum material taken from the group consisting of aluminum and aluminum alloy and having recessed portions therein; and a preformed semiconductor element-mounting sheet which is made of an aluminum material taken from the group consisting of aluminum and aluminum alloy, said sheet having on one surface thereof a metal layer other than the metal of said mounting sheet and to which solder is readily bondable, and the other surface of said sheet being ultrasonically welded in an aluminum material to aluminum material bond to the aluminum material of said mounting sheet in a recessed portion of said cooling plate.
Claim 3
Dependent Claim
17 words
A device for cooling semiconductor elements as claimed in claim 1 wherein said metal layer is copper.
Claim 4
Dependent Claim
24 words
A device for cooling semiconductor elements as claimed in claim 1, further comprising a solder layer on the outer surface of said metal layer.
Claim 5
Dependent Claim
28 words
A device for cooling semiconductor elements as claimed in claim 1 wherein said semiconductor element-mounting sheet is in the shape of a cup opening out of the recess.
Claim 6
Dependent Claim
32 words
A device for cooling semiconductor elements as claimed in claim 1 wherein at least one of said mounting sheet and said cooling plate has a roughened surface thereon for reinforcing the mounting.
Claim 7
Dependent Claim
141 words
A combined semiconductor element and a cooling device therefor, comprising: a cooling plate for cooling semiconductor elements, said plate being made of an aluminum material taken from the group consisting of aluminum and aluminum alloy and having recessed portions therein; and a preformed semiconductor element-mounting sheet which is made of an aluminum material taken from the group consisting of aluminum and aluminum alloy, said sheet having on one surface thereof a metal layer other than the metal of said mounting sheet and a preformed solder layer on the outer surface of said metal layer, and the other surface of said sheet being ultrasonically welded in an aluminum material to aluminum material bond to the aluminum material of said mounting sheet in a recessed portion of said cooling plate; and a semiconductor element soldered to said mounting sheet by said solder layer.
Claim 8
Dependent Claim
141 words
A combined semiconductor element and a cooling device therefor, comprising: a cooling plate for cooling semiconductor elements, said plate being made of an aluminum material taken from the group consisting of aluminum and aluminum alloy and having recessed portions therein; and a preformed semiconductor element-mounting sheet which is made of an aluminum material taken from the group consisting of aluminum and aluminum alloy, said sheet having on one surface thereof a metal layer other than the metal of said mounting sheet and a preformed solder layer on the outer surface of said metal layer, and the other surface of said sheet being ultrasonically welded in an aluminum material to aluminum material bond to the aluminum material of said mounting sheet in a recessed portion of said cooling plate; and a semiconductor element soldered to said mounting sheet by said solder layer.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1988-10-07 | 1989-04-08 | 1989-10-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1992-10-07 | 1993-04-08 | 1993-10-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1996-10-07 | 1997-04-08 | 1997-10-08 | $7700.00 | Window Closed / Lapsed |