US4417267A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Cooling means for semiconductor device
Assignee: Mitsubishi Electric Corp
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Filing: 1981-05-13
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Granted: 1983-11-22
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Expires: 2001-05-13
Abstract
Abstract A cooling means for a semiconductor device comprises a heat radiating plate made of aluminum or aluminum alloy, having a fitting part for a semiconductor device; an alloy layer formed only at said fitting part of the heat radiating plate to allow easy soldering and a solder layer for bonding said semiconductor device to said alloy layer.
Inventors
- 👤 Hifumi Wada
- 👤 Mitsuaki Nanba
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 06:55
CPC Classifications
H; H10; H10W; H10W72/00; H10W40/00; H10W40/10; H10W40/20; H10W40/25; H10W40/258
Claims Analysis
Total Claims: 3
Claim 1
Independent Claim
74 words
A cooling means for a semiconductor device which comprises a heat radiating plate made of aluminum or aluminum alloy, having a fitted part for a semiconductor device; an alloy layer formed only at said fitting part of the heat radiating plate to allow easy soldering and a solder layer for bonding said semiconductor device to said alloy layer, wherein said alloy layer is formed by heating a metal halide dispersed on the fitting part.
Claim 2
Dependent Claim
74 words
A cooling means for a semiconductor device which comprises a heat radiating plate made of aluminum or aluminum alloy, having a fitted part for a semiconductor device; an alloy layer formed only at said fitting part of the heat radiating plate to allow easy soldering and a solder layer for bonding said semiconductor device to said alloy layer, wherein said alloy layer is formed by heating a metal halide dispersed on the fitting part.
Claim 3
Dependent Claim
27 words
A cooling means for a conductor device according to claim 1 wherein said alloy layer for allowing easy soldering is formed on the surface of a recess.
References Cited (Backward Citations)
US2763822A
Cited
US3187812A
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US3434018A
Cited
US3396361A
Cited
US3930115A
Cited
US4196444A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1986-11-21 | 1987-05-23 | 1987-11-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1990-11-21 | 1991-05-23 | 1991-11-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1994-11-21 | 1995-05-23 | 1995-11-22 | $7700.00 | Window Closed / Lapsed |