EP0344084A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
High conduction cooling module having internal fins and compliant interfaces for VLSI chip technology
Assignee: International Business Machines Corp
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Filing: 1989-04-25
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Granted: —
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Expires: 2009-04-25
Abstract
Abstract The present invention dissipates the heat generated by high powered VLSI chips to a heat sink in a very efficient manner, providing a thermal resistance heretofore not possible in heat conduction module cold plate type systems. A finned internal thermal device (14) having a flat bottom contacts the chips (11), while corresponding fins in a finned cooling hat mounted to a cold plate form gaps into which the fins of the finned internal thermal devices are slidably mounted. A preferred double cantilever spring (22) between the finned internal thermal devices and fins of the finned cooling hat and a compliant thermally conductive interface such as synthetic oil between the chips and flat base of the finned internal devices provide efficient, non-rigid interfaces throughout the system, while assuring good thermal contact between the system components. The present high conduction cooling module allows for the simple incorporation of side biasing means and a grooved chip interface on the finned internal thermal devices to provide enhanced thermal performance if required.
Inventors
- 👤 Joseph Louis Horvath
- 👤 Robert Glenn Biskeborn
- 👤 Joseph Matthew Harvilchuck
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-04 17:22
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/70; H10W40/77; H10W40/774; H10W40/60; H10W40/611; H10W40/20; H10W40/231; H10W40/233; H10W40/242; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
208 words
An apparatus for removing heat from heat generating devices comprising : at least one heat conductive finned internal thermal device comprising, a base having a plurality of first fins on a first surface and a second surface which is flat and directly facing said heat generating devices, and outer finned internal thermal device surfaces; a heat conductive cooling hat having a plurality of second fins facing toward said heat generating devices; said first fins being interspersed with and at least partially overlapping said second fins so that at least one gap exists between overlapping portions of adjacent fins, and first and second channels exist; said first channels being partially bound by said first fins and said second channels being partially bound by said second fins; a compliant thermally conductive medium between said heat generating devices and said second surface of said base; biasing means located at least in said channels or secured at least to said outer surfaces of each said at least one heat conductive finned internal thermal device, and exerting a biasing force between said cooling hat and each at least one heat conductive finned internal thermal device urging said second surface of said base toward said heat generating devices through said compliant thermally conductive medium.
Claim 2
Independent Claim
208 words
An apparatus for removing heat from heat generating devices comprising : at least one heat conductive finned internal thermal device comprising, a base having a plurality of first fins on a first surface and a second surface which is flat and directly facing said heat generating devices, and outer finned internal thermal device surfaces; a heat conductive cooling hat having a plurality of second fins facing toward said heat generating devices; said first fins being interspersed with and at least partially overlapping said second fins so that at least one gap exists between overlapping portions of adjacent fins, and first and second channels exist; said first channels being partially bound by said first fins and said second channels being partially bound by said second fins; a compliant thermally conductive medium between said heat generating devices and said second surface of said base; biasing means located at least in said channels or secured at least to said outer surfaces of each said at least one heat conductive finned internal thermal device, and exerting a biasing force between said cooling hat and each at least one heat conductive finned internal thermal device urging said second surface of said base toward said heat generating devices through said compliant thermally conductive medium.
Claim 3
Dependent Claim
13 words
The apparatus of Claim 1 wherin said heat generating devices are semiconductor chips.
Claim 4
Dependent Claim
52 words
The apparatus of Claim 1 or 2 wherein said biasing means is a spring comprised of at least one arm, said spring being capable of being compressed to approximately one to three times the thickness of said at least one arm when mounted between the finned internal thermal device and cooling hat.
Claim 5
Independent Claim
25 words
The apparatus according to one of Claims 1 to 3 wherein said biasing means is a cantilever type spring having at least one cantilever arm.
Claim 6
Independent Claim
33 words
The apparatus according to one of Claims 1 to 4 wherein said base and said first fins of said finned internal thermal device and said second fins of said cooling hat are rigid.
Claim 7
Independent Claim
42 words
The apparatus according to one of Claims 2 to 5 where each said base of each said finned internal thermal device overhangs each of said chips and overhangs each of said heat generating devices by approximately one base thickness on each side.
Claim 8
Independent Claim
68 words
The apparatus according to one of Claims 1 to 6 wherein the ratio of the length of each fin to the width of each fin is at least approximately 3 to 1 and wherein those of said second fins of said finned cooling hat that are adjacent to the outermost said first fins of said finned internal thermal device are longer and wider than the other second fins.
Claim 9
Independent Claim
50 words
The apparatus according to one of Claims 1 to 7 wherein each said cantilever arm has a free end which contacts the bottommost surface of a corresponding said second fin of said finned cooling hat and said cantilever arm being secured to said base of said finned internal thermal device.
Claim 10
Independent Claim
16 words
The apparatus according to anyone of Claims 4 to 8 wherein there are two cantilever arms.
Claim 11
Dependent Claim
43 words
The apparatus of Claim 9 wherein each said cantilever type spring is secured to said finned cooling hat and the free end of each said cantilever arm contacts the uppermost surface of a corresponding said first fin of said finned internal thermal device.
Claim 12
Independent Claim
54 words
The apparatus according to anyone of Claims 1 to 10 wherein said compliant thermally conductive material exists in each said at least one gap between adjacent fins, said compliant thermally conductive material being a thermal paste, a gel, or an oil-like material having a viscosity in the range of approximately 350 to 1800 centipoise.
Claim 13
Independent Claim
38 words
The apparatus according to anyone of the preceding Claims wherein said at least one gap between adjacent fins is at least equal to the product of the corresponding chip tilt angle and the overlapping length between adjacent fins.
Claim 14
Independent Claim
68 words
The apparatus according to anyone of the preceding Claims further comprising side biasing means urging one side of said first fins of said finned internal thermal device toward corresponding second fins of said finned cooling hat, said side biasing means being a spring that exerts a force between an outermost first fin of said finned internal thermal device and a corresponding second fin of said finned cooling hat.
Claim 15
Dependent Claim
51 words
The apparatus of Claim 13 wherein said spring member is a flap that is an integral portion of a second fin of said finned cooling hat corresponding to an outermost first fin of said finned internal thermal device and the side biasing means is a resilient sheet having bowed portions therein.
Claim 16
Independent Claim
29 words
The apparatus according to anyone of the preceding Claims wherein there are grooves in said second surface which is flat of said base of said finned internal thermal device.
References Cited (Backward Citations)
No citation records indexed.
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