US4551787A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Apparatus for use in cooling integrated circuit chips
Assignee: Unisys Corp
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Filing: 1984-09-13
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Granted: 1985-11-05
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Expires: 2004-09-13
Abstract
Abstract An integrated circuit chip is cooled by being mounted on a substrate which is urged into contact with a compliant mat which includes a layer having a predetermined array of interconnected metallic pads for spreading heat flux more uniformly. The mat is connected to a plate which may be water cooled. The mat also includes additional layers which are heat conductive and electrically insulative. One of the additional layers is a film of paste.
Inventors
- 👤 Faquir C. Mittal
- 👤 Charles R. Solis
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 08:11
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/20; H10W40/25; H10W40/255; H05; H05K; H05K7/00; H05K7/20; H05K7/20218; H05K7/20254; H10W40/22; H10W40/226; H10W40/40; H10W40/47
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
115 words
A cooling apparatus including integrated circuit chips comprising: a cold plate; a first film of paste in contact with said plate, said first film being heat conductive and electrically insulative; a second film in contact with said first film, said second film having a predetermined array of interconnected metallic pads; a third film in contact with said second film, said third film being heat conductive and electrically insulative, said films comprising a compliant mat; a substrate having a plurality of circuit packages including integrated circuit chips in a predetermined array corresponding to said array of metallic pads; and each of said circuit packages being in contact with said third film adjacent an associated metallic pad.
Claim 2
Dependent Claim
115 words
A cooling apparatus including integrated circuit chips comprising: a cold plate; a first film of paste in contact with said plate, said first film being heat conductive and electrically insulative; a second film in contact with said first film, said second film having a predetermined array of interconnected metallic pads; a third film in contact with said second film, said third film being heat conductive and electrically insulative, said films comprising a compliant mat; a substrate having a plurality of circuit packages including integrated circuit chips in a predetermined array corresponding to said array of metallic pads; and each of said circuit packages being in contact with said third film adjacent an associated metallic pad.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1988-11-04 | 1989-05-06 | 1989-11-05 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1992-11-04 | 1993-05-06 | 1993-11-05 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1996-11-04 | 1997-05-06 | 1997-11-05 | $7700.00 | Window Closed / Lapsed |