EP0193747A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Device for cooling integrated circuit chip
Assignee: Hitachi Ltd
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Filing: 1986-02-06
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Granted: —
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Expires: 2006-02-06
Abstract
Abstract @ Disclosed is a cooling structure cooling a multichip module for effectively removing heat generated from integrated circuit chips. A suction plate (30) formed with minute grooves (31) on one of its surfaces is disposed between each of the integrated circuit chip (2) and an associated cooling block (20) and is brought into contact at the grooved surface with the integrated circuit chip through a layer of a liquid (200) such as silicone oil interposed therebetween, thereby producing negative hydrostatic pressure by the capillary action of the grooves. The suction plate (30) has a thickness small enough to be bent under influence of the negative hydrostatic pressure to follow up warping of the integrated circuit chip, so that the clearance between the opposing surfaces of the suction plate and the integrated circuit chip can be minimized. An integrated circuit chip cooling device of surface-to-surface contact type operable with a low thermal resistance is provided, which can improve the maintainability and reliability without sacrificing the cooling efficiency.
Inventors
- 👤 Minoru Yamada
- 👤 Mitsuru Hitachi Yokohama Mitakeryo Usui
- 👤 Akira Masaki
- 👤 Keiichirou Hitachi Daini Kyoshinryo Nakanishi
- 👤 Masahide Hitachi Koyasudai Apartment House Tokuda
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-31 21:08
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/20; H10W40/25; H10W40/258; H10W40/70; H10W40/77; H10W40/772; H10W72/00; H10W72/071; H10W72/073; H10W72/07331; H10W72/07337; H10W72/30; H10W72/351; H10W72/352; H10W72/353; H10W72/354; H10W72/851; H10W72/874; H10W72/877; H10W90/00; H10W90/701; H10W90/721; H10W90/724
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
86 words
An integrated circuit chip cooling device comprising: an integrated circuit chip (2); a suction plate (30) having a surface formed with minute grooves (31) opposite to said integrated circuit chip and having a layer of a liquid (200) interposed between said grooved surface and said integrated circuit chip, thereby applying suction to said integrated circuit chip; and a cooling block (20) mounted on and coupled at least at its peripheral portions to said suction plate and having an internal space for circulation of a coolant therethrough.
Claim 2
Dependent Claim
86 words
An integrated circuit chip cooling device comprising: an integrated circuit chip (2); a suction plate (30) having a surface formed with minute grooves (31) opposite to said integrated circuit chip and having a layer of a liquid (200) interposed between said grooved surface and said integrated circuit chip, thereby applying suction to said integrated circuit chip; and a cooling block (20) mounted on and coupled at least at its peripheral portions to said suction plate and having an internal space for circulation of a coolant therethrough.
Claim 3
Dependent Claim
42 words
An integrated circuit chip cooling device as claimed in Claim 1, wherein a space is provided between a bottm plate (22) of said cooling block (20) and said suction plate (30) for enclosing a fluid (40) having a high thermal conductivity therein.
Claim 4
Dependent Claim
39 words
An integrated circuit chip cooling device as claimed in Claim 2, wherein a cavity (24) is formed adjacent to the peripheral edges of said bottom plate (22) to serve as a reservoir for said high thermal conductivity fluid (40).
Claim 5
Dependent Claim
29 words
An integrated circuit chip cooling device as claimed in Claim 3, wherein said bottom plate (22) is made of a metal selected from the group including copper and aluminum.
Claim 6
Dependent Claim
40 words
An integrated circuit chip cooling device as claimed in Claim 4, wherein said bottom plate (22) is plated with a metal selected from the group including chromium and nickel at the area contacted by said high thermal conductivity fluid (40).
Claim 7
Dependent Claim
23 words
An integrated circuit chip cooling device as claimed in Claim 5, wherein said high thermal conductivity fluid (40) is a liquid-phase Ga-In-Sn alloy.
Claim 8
Dependent Claim
31 words
An integrated circuit chip cooling device as claimed in Claim 2, wherein said bottom plate (22) and said suction plate (30) are secured together at their outer peripheral portions by soldering.
Claim 9
Dependent Claim
18 words
An integrated circuit chip cooling device as claimed in Claim 1, wherein said liquid (200) is silicone oil.
Claim 10
Dependent Claim
49 words
An integrated circuit chip cooling device as claimed in Claim 1, wherein the width of said grooves (31) formed on said suction plate (30) is progressively narrowed and widened toward and away from said integrated circuit chip (2) respectively, and said grooves communicate with each other through cavities (32).
Claim 11
Dependent Claim
56 words
An integrated circuit chip cooling device as claimed in Claim 1, wherein intermeshing grooves (50) are formed on each of a surface of a bottom plate (22) of said cooling block (20) and an opposing surface of said suction plate (30), and said grooves of said bottom plate are inserted into those of said suction plate.
Claim 12
Dependent Claim
39 words
An integrated circuit chip cooling device as claimed in Claim 10, wherein a gas having a high thermal conductivity is enclosed between.said bottom plate (22) of said cooling block (20) and said suction plate (30) inserted into each other.
Claim 13
Dependent Claim
19 words
An integrated circuit chip cooling device as claimed in Claim 11, wherein said high thermal conductivity gas is helium.
Claim 14
Dependent Claim
69 words
An integrated circuit chip cooling device as claimed in Claim 1, wherein said suction plate (30) applying suction to said integrated circuit chip (2) through said liquid layer (200) interposed therebetween is secured to a bottom plate (22) of said cooling block (20) by a low melting metal (60) having a melting point lying within a temperature range which does not adversely affect the surface tension of said liquid.
Claim 15
Dependent Claim
21 words
An integrated circuit chip cooling device as claimed in Claim 13, wherein said low melting metal (60) is an In-Sn alloy.
Claim 16
Dependent Claim
197 words
An integrated circuit chip cooling device comprising: a wiring substrate (3); a plurality of integrated circuit chips (2) mounted on said wiring substrate; a plurality of suction plates (30) each having a surface formed with minute grooves (31) opposite to the associated one of said integrated circuit chips and each having a layer of a liquid (200) interposed between said grooved surface and said associated integrated circuit chip, thereby applying suction to said associated integrated circuit chip; a plurality of cooling blocks (20) each mounted on and coupled at least at its peripheral portions to the associated one of said suction plates and each having an internal space for circulation of a coolant therethrough; resilient pipe members (10) connected to said cooling blocks to supply and discharge the coolant into and from said cooling blocks and capable of making expansion and contraction in a direction orthogonal with respect to said wiring substrate; and a hat (5) disposed opposite to said wiring substrate and having an internal coolant passage (7) for introducing said coolant into said pipe members, said hat being bonded to the marginal edges of said wiring substrate to hermetically seal said plural integrated circuit chips.
Claim 17
Dependent Claim
197 words
An integrated circuit chip cooling device comprising: a wiring substrate (3); a plurality of integrated circuit chips (2) mounted on said wiring substrate; a plurality of suction plates (30) each having a surface formed with minute grooves (31) opposite to the associated one of said integrated circuit chips and each having a layer of a liquid (200) interposed between said grooved surface and said associated integrated circuit chip, thereby applying suction to said associated integrated circuit chip; a plurality of cooling blocks (20) each mounted on and coupled at least at its peripheral portions to the associated one of said suction plates and each having an internal space for circulation of a coolant therethrough; resilient pipe members (10) connected to said cooling blocks to supply and discharge the coolant into and from said cooling blocks and capable of making expansion and contraction in a direction orthogonal with respect to said wiring substrate; and a hat (5) disposed opposite to said wiring substrate and having an internal coolant passage (7) for introducing said coolant into said pipe members, said hat being bonded to the marginal edges of said wiring substrate to hermetically seal said plural integrated circuit chips.
Claim 18
Dependent Claim
41 words
An integrated circuit chip cooling device as claimed in Claim 15, wherein each of said cooling blocks (20) includes a bottom plate (22), cooling fins (23) formed integrally with said bottom plate, and a cap (21) mounted on said bottom plate.
Claim 19
Dependent Claim
23 words
An integrated circuit chip cooling device as claimed in Claim 15, wherein each of said pipe members (10) has a flat-oval sectional shape.
Claim 20
Dependent Claim
48 words
An integrated circuit chip cooling device as claimed in Claim 15, wherein a space is provided between a bottom plate (22) of each of said cooling blocks (20) and the associated one of said suction plates (30) for enclosing therein a fluid (40) having a high thermal conductivity.
Claim 21
Dependent Claim
61 words
An integrated circuit chip cooling device as claimed in Claim 15, wherein intermeshing minute grooves (50) are formed on each of a surface of a bottom plate (22) of each of said cooling blocks (20) and an opposing surface of the associated one of said suction plates (30) for insertion of said bottom plate and said suction plate into each other.
Claim 22
Dependent Claim
79 words
An integrated circuit chip cooling device as claimed in Claim 15, wherein each of said suction plates (30) applying suction to the associated one of said integrated circuit chips (2) through said liquid layer (200) interposed therebetween is secured to a bottom plate (22) of the associated one of said cooling blocks (20) by a low melting metal (60) having a melting point lying within a temperature range which does not adversely affect the surface tension of said liquid.
References Cited (Backward Citations)
No citation records indexed.
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