Patent US5250829A successfully refreshed from Google Patents.
US5250829A
Expired / Lapsed
US
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Double well substrate plate trench DRAM cell array
Assignee: International Business Machines Corp
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Filing: 1992-01-09
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Granted: 1993-10-05
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Expires: 2012-01-09
Abstract
Abstract A high density substrate plate DRAM cell memory device and process are described in which a buried well region is formed adjacent to deep trench capacitors such that the substrate region of DRAM transfer FETs can be electrically isolated from other FETs on a semiconductor substrate. The buried region is partially formed by ion implantation and diffusion to intersect the walls of the deep trenches.
Inventors
- 👤 Gary B. Bronner
- 👤 Sang H. Dhong
- 👤 Wei Hwang
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 17:35
CPC Classifications
H; H10; H10B; H10B12/00; H10B12/30; H10B12/37
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
248 words
A dynamic random access memory device comprising: a semiconductor substrate having a first region of a first conductivity type; at least one array of dynamic memory cells, each cell comprising an access transistor coupled to a storage capacitor, the transistors of each memory cell being formed within a second region of said semiconductor substrate, each access transistor having a control electrode, a data line contact, a storage node, and a channel region; a plurality of signal storage capacitors formed in a plurality of trenches formed in said substrate, each capacitor including a signal storage node and a reference voltage node separated by a dielectric insulator, the reference node being connected to said substrate and the storage node of each capacitor being connected to a corresponding storage node of one of said access transistors; means for physically and electrically isolating all of the channel regions of said access transistors within said one array from said first region of said substrate, said means comprising a third region of opposite conductivity type to said first region, said third region formed between between said first and second regions, said third region intersecting all of said trenches; said third region comprising a doped well formed in said substrate wherein the doped well extends beyond and below said second region and having a depth within said substrate less than that of said trenches; and means for biasing said first, second and third regions of said substrate to first, second and third different reference voltages.
Claim 2
Dependent Claim
248 words
A dynamic random access memory device comprising: a semiconductor substrate having a first region of a first conductivity type; at least one array of dynamic memory cells, each cell comprising an access transistor coupled to a storage capacitor, the transistors of each memory cell being formed within a second region of said semiconductor substrate, each access transistor having a control electrode, a data line contact, a storage node, and a channel region; a plurality of signal storage capacitors formed in a plurality of trenches formed in said substrate, each capacitor including a signal storage node and a reference voltage node separated by a dielectric insulator, the reference node being connected to said substrate and the storage node of each capacitor being connected to a corresponding storage node of one of said access transistors; means for physically and electrically isolating all of the channel regions of said access transistors within said one array from said first region of said substrate, said means comprising a third region of opposite conductivity type to said first region, said third region formed between between said first and second regions, said third region intersecting all of said trenches; said third region comprising a doped well formed in said substrate wherein the doped well extends beyond and below said second region and having a depth within said substrate less than that of said trenches; and means for biasing said first, second and third regions of said substrate to first, second and third different reference voltages.
Claim 3
Dependent Claim
28 words
The dynamic random access memory device of claim 1 wherein the third region has an impurity doping level which varies with depth from the surface of the substrate.
Claim 4
Dependent Claim
19 words
The dynamic random access memory device of claim 2 wherein the impurity type of said first region is P-type.
Claim 5
Dependent Claim
29 words
The dynamic random access memory device of claim 3 wherein the dopant impurity of said first region is boron and the dopant impurity in said third region is N-type.
Claim 6
Dependent Claim
17 words
The dynamic random access memory device of claim 4 wherein the access transistors are N-channel FET devices.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-10-04 | 1997-04-05 | 1997-10-05 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-10-04 | 2001-04-05 | 2001-10-05 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-10-04 | 2005-04-05 | 2005-10-05 | $7700.00 | Window Closed / Lapsed |