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US5250829A Expired / Lapsed US ⏱️ 0.0 years remaining

Double well substrate plate trench DRAM cell array

Assignee: International Business Machines Corp
•
Filing: 1992-01-09
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Granted: 1993-10-05
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Expires: 2012-01-09
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Abstract

Abstract A high density substrate plate DRAM cell memory device and process are described in which a buried well region is formed adjacent to deep trench capacitors such that the substrate region of DRAM transfer FETs can be electrically isolated from other FETs on a semiconductor substrate. The buried region is partially formed by ion implantation and diffusion to intersect the walls of the deep trenches.

Inventors

  • 👤 Gary B. Bronner
  • 👤 Sang H. Dhong
  • 👤 Wei Hwang

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-29 13:00
CPC Classifications
H; H10; H10B; H10B12/00; H10B12/30; H10B12/37

Claims Analysis

Total Claims: 6
Claim 1
Independent Claim 248 words
A dynamic random access memory device comprising: a semiconductor substrate having a first region of a first conductivity type; at least one array of dynamic memory cells, each cell comprising an access transistor coupled to a storage capacitor, the transistors of each memory cell being formed within a second region of said semiconductor substrate, each access transistor having a control electrode, a data line contact, a storage node, and a channel region; a plurality of signal storage capacitors formed in a plurality of trenches formed in said substrate, each capacitor including a signal storage node and a reference voltage node separated by a dielectric insulator, the reference node being connected to said substrate and the storage node of each capacitor being connected to a corresponding storage node of one of said access transistors; means for physically and electrically isolating all of the channel regions of said access transistors within said one array from said first region of said substrate, said means comprising a third region of opposite conductivity type to said first region, said third region formed between between said first and second regions, said third region intersecting all of said trenches; said third region comprising a doped well formed in said substrate wherein the doped well extends beyond and below said second region and having a depth within said substrate less than that of said trenches; and means for biasing said first, second and third regions of said substrate to first, second and third different reference voltages.
Claim 2
Dependent Claim 248 words
A dynamic random access memory device comprising: a semiconductor substrate having a first region of a first conductivity type; at least one array of dynamic memory cells, each cell comprising an access transistor coupled to a storage capacitor, the transistors of each memory cell being formed within a second region of said semiconductor substrate, each access transistor having a control electrode, a data line contact, a storage node, and a channel region; a plurality of signal storage capacitors formed in a plurality of trenches formed in said substrate, each capacitor including a signal storage node and a reference voltage node separated by a dielectric insulator, the reference node being connected to said substrate and the storage node of each capacitor being connected to a corresponding storage node of one of said access transistors; means for physically and electrically isolating all of the channel regions of said access transistors within said one array from said first region of said substrate, said means comprising a third region of opposite conductivity type to said first region, said third region formed between between said first and second regions, said third region intersecting all of said trenches; said third region comprising a doped well formed in said substrate wherein the doped well extends beyond and below said second region and having a depth within said substrate less than that of said trenches; and means for biasing said first, second and third regions of said substrate to first, second and third different reference voltages.
Claim 3
Dependent Claim 28 words
The dynamic random access memory device of claim 1 wherein the third region has an impurity doping level which varies with depth from the surface of the substrate.
Claim 4
Dependent Claim 19 words
The dynamic random access memory device of claim 2 wherein the impurity type of said first region is P-type.
Claim 5
Dependent Claim 29 words
The dynamic random access memory device of claim 3 wherein the dopant impurity of said first region is boron and the dopant impurity in said third region is N-type.
Claim 6
Dependent Claim 17 words
The dynamic random access memory device of claim 4 wherein the access transistors are N-channel FET devices.

References Cited (Backward Citations)

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EP0283964A2 Cited
US4873560A Cited
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GB2215913A Cited
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USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1996-10-04 1997-04-05 1997-10-05 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2000-10-04 2001-04-05 2001-10-05 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2004-10-04 2005-04-05 2005-10-05 $7700.00 Window Closed / Lapsed

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