Abstract A semiconductor device comprises a substrate, a recess formed on the substrate, a first conductive type semiconductor region and a second conductive type semiconductor region having an opposite conductive type to the first conductive type formed in the recess formed on the substrate, and wiring portions, wherein the surfaces of the substrate, the first conductive type semiconductor region and the second conductive type semiconductor region and are continuously on one plane, and the wiring portions connected respectively to the first conductive type semiconductor region and the second conductive type semiconductor region are formed on and in contact with the plane and are all substantially on the same plane and electrically independent from each other.
A semiconductor device comprising a substrate, having a recess formed thereon, in which are formed a first conductive type semiconductor region, and a second conductive type semiconductor region having an opposite conductive type to said first conductive type and being in contact with said first conductive type semiconductor region and wiring portions connected respectively to said first conductive type semiconductor region and electrically independent from each other which are formed in said recess formed on the substrate; wherein the substrate surface is in contact with each surface of said first conductive type semiconductor region and said second conductive type semiconductor region so that the surfaces of said substrate and said first and second conductive type semiconductor regions are continuously on one same plane, and the wiring portions are all formed on the same plane and in contact with said plane.
Claim 2
Dependent Claim
140 words
A semiconductor device comprising a substrate, having a recess formed thereon, in which are formed a first conductive type semiconductor region, and a second conductive type semiconductor region having an opposite conductive type to said first conductive type and being in contact with said first conductive type semiconductor region and wiring portions connected respectively to said first conductive type semiconductor region and electrically independent from each other which are formed in said recess formed on the substrate; wherein the substrate surface is in contact with each surface of said first conductive type semiconductor region and said second conductive type semiconductor region so that the surfaces of said substrate and said first and second conductive type semiconductor regions are continuously on one same plane, and the wiring portions are all formed on the same plane and in contact with said plane.
Claim 3
Dependent Claim
18 words
The semiconductor device according to claim 1, wherein the semiconductor regions comprise a semiconductor of group III-V compounds.
Claim 4
Dependent Claim
18 words
The semiconductor device according to claim 1, wherein the semiconductor regions comprise a semiconductor of group II-VI compounds.
Claim 5
Dependent Claim
18 words
The semiconductor device according to claim 1, wherein the semiconductor regions comprise a semiconductor of group IV compounds.
Claim 6
Dependent Claim
18 words
The semiconductor device according to claim 1, wherein the recess has a shape other than a circular shape.
Claim 7
Dependent Claim
32 words
The semiconductor device according to claim 1, wherein the recess has a circular shape and has a nucleation surface at a position other than the center of the bottom of the recess.