Semiconductor ROM cell programmed using source mask

Claim 2

In a ROM device formed on a substrate and having a plurality of individual storage cells programmed to an active state and a plurality of storage cells programmed to an inactive state, a cell structure for the cells programmed to the inactive state comprising: an insulating layer disposed on the substrate; an electrically-conductive gate electrode disposed on the insulating layer; a drain region of first conductivity type disposed in the substrate adjacent to the region of substrate directly below the gate electrode; an implant region of opposite conductivity type disposed in the substrate adjacent to the region of substrate directly below the gate electrode but spaced apart from the drain region; and a source region of first conductivity type formed in the substrate adjacent the implant region and separated from the gate electrode by the implant region.

Claim 3

The cell structure of claim 1 wherein the gate electrode comprises polycrystalline silicon.

Claim 4

The cell structure of claim 1 wherein the first conductivity type comprises N type and the opposite conductivity type comprises P type.

Claim 5

The cell structure of claim 1 wherein the implant has a dopant concentration density between approximately 5×10 17 and 5×10 19 atoms/cm 3 inclusive.

Claim 6

A ROM device formed on a substrate comprising: a plurality of storage cells programmed to an inactive state having: (i) a first source of a first conductivity type; (ii) an implant of a second conductivity type, adjacent the first source; (iii) a first drain formed of the first conductivity type and spaced a given distance from the implant; (iv) a first polysilicon gate, located on a surface of the substrate and having a first region adjacent the first drain and a second region adjacent the implant; (v) a first silicon dioxide layer disposed between the first polysilicon gate and the surface of the substrate; a plurality of storage cells programmed to an active state having: (i) a second source of the first conductivity type; (ii) a second drain formed of the first conductivity type and spaced a given distance from the second source; (iii) a second polysilicon gate, located on a surface of the substrate and having a first region adjacent the second drain and a second region adjacent the second source; and (iv) a second silicon dioxide layer disposed between the polysilicon gate and the surface of the substrate.

Claim 7

A ROM device formed on a substrate comprising: a plurality of storage cells programmed to an inactive state having: (i) a first source of a first conductivity type; (ii) an implant of a second conductivity type, adjacent the first source; (iii) a first drain formed of the first conductivity type and spaced a given distance from the implant; (iv) a first polysilicon gate, located on a surface of the substrate and having a first region adjacent the first drain and a second region adjacent the implant; (v) a first silicon dioxide layer disposed between the first polysilicon gate and the surface of the substrate; a plurality of storage cells programmed to an active state having: (i) a second source of the first conductivity type; (ii) a second drain formed of the first conductivity type and spaced a given distance from the second source; (iii) a second polysilicon gate, located on a surface of the substrate and having a first region adjacent the second drain and a second region adjacent the second source; and (iv) a second silicon dioxide layer disposed between the polysilicon gate and the surface of the substrate.

Claim 8

The ROM of claim 5 wherein the storage cells are arranged to form a "T" layout.

Claim 9

The ROM of claim 5 wherein the plurality of storage cells are arranged to form an "X" layout.

Claim 10

The ROM of claim 5 wherein the first and the second drains further comprise a drain electrode formed of the first conductivity type and located adjacent the first regions of the first and second polysilicon gates respectively.

Claim 11

The ROM of claim 5 wherein the first conductivity type comprises an N type material and the second conductivity type comprises a P type material.

Claim 12

The ROM of claim 5 wherein the first source and the substrate are at a substantially identical electrical potential.

Claim 13

The ROM of claim 6 wherein the implant has a dopant concentration density of approximately 5×10 19 atoms/cm 3 .

Claim 14

The ROM of claim 7 wherein the implant has a dopant concentration density of approximately 5×10 17 atoms/cm 3 .

Claim 15

In a ROM device formed on a substrate and having a plurality of individual storage cells programmed to an active state and a plurality of cells programmed to an inactive state, a cell structure for the cells programmed to the inactive state comprising: a gate electrode disposed on a surface of said substrate; a drain region of a first conductivity type disposed in the substrate and having a heavily doped main portion and a lightly doped drain electrode portion wherein said drain electrode adjoins said gate electrode; and a source region of said first conductivity type disposed in the substrate adjoining said gate electrode and separated from said drain region wherein said source region includes: (i) a heavily doped main portion and a lightly doped source electrode portion of said first conductivity type; and (ii) an implant region of a second conductivity type implanted in said lightly doped source electrode region whereby said heavily doped main portion is separated from said gate electrode by said implant region.

Claim 16

In a ROM device formed on a substrate and having a plurality of individual storage cells programmed to an active state and a plurality of cells programmed to an inactive state, a cell structure for the cells programmed to the inactive state comprising: a gate electrode disposed on a surface of said substrate; a drain region of a first conductivity type disposed in the substrate and having a heavily doped main portion and a lightly doped drain electrode portion wherein said drain electrode adjoins said gate electrode; and a source region of said first conductivity type disposed in the substrate adjoining said gate electrode and separated from said drain region wherein said source region includes: (i) a heavily doped main portion and a lightly doped source electrode portion of said first conductivity type; and (ii) an implant region of a second conductivity type implanted in said lightly doped source electrode region whereby said heavily doped main portion is separated from said gate electrode by said implant region.

Claim 17

The ROM of claim 13 wherein the storage cells are arranged to form a "T" layout.

Claim 18

The ROM of claim 13 wherein the plurality of storage cells are arranged to form an "X" layout.

Claim 19

The ROM of claim 13 wherein the first conductivity type comprises an N type material and the second conductivity type comprises a P type material.

Claim 20

The ROM of claim 13 wherein the first source and the substrate are at a substantially identical electrical potential.

Claim 21

The ROM of claim 14 wherein the implant has a dopant concentration density of approximately 5×10 19 atoms/cm 3 .

Claim 22

The ROM of claim 15 wherein the implant has a dopant concentration density of approximately 5×10 17 atoms/cm 3 .

Claim 23

The ROM of claim 5 wherein the second source further comprises a source electrode formed of the first conductivity type and located adjacent the second region of the second polysilicon gate.

Claim 24

The ROM of claim 5 wherein said implant of a second conductivity type is formed in a source electrode of said first diode and whereby a diode is formed between said implant and said first source.

Claim 25

The cell structure of claim 1 wherein the ROM device has predefined operating ranges for voltages applied to the gate, source and drain regions and wherein there is substantially no current flow for any combination of gate, source and drain voltages within the operating ranges.