US5142828A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Correcting a defective metallization layer on an electronic component by polishing
Assignee: Microelectronics and Computer Technology Corp
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Filing: 1990-06-25
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Granted: 1992-09-01
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Expires: 2010-06-25
Abstract
Abstract A defective metallization layer is removed from the top of an electronic component such as an integrated circuit or a copper/polyimide substrate by polishing with a rotating pad and a slurry. Non-defective underlying metallization layers are preserved and a new metallization layer is fabricated to replace the defective layer.
Inventors
- 👤 II John W. Curry
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 22:03
CPC Classifications
H; H10; H10W; H10W20/00; H10W20/01; H10W20/031; H10W20/067; B; B24; B24B; B24B37/00; B24B37/04; H10P; H10P52/00; H10P52/40; H10P52/403; H10W70/00; H10W70/01; H10W70/05; H10W70/092
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
81 words
A method of correcting a defective metallization layer on an electronic component, comprising: providing an electronic component with a substantially planar defective metallization layer on a substantially planar base layer; removing the defective metallization layer by applying a polishing pad with a substantially planar polishing surface so that the entire defective metallization layer is removed from the base layer; and fabricating a new substantially planar metallization layer on the base layer to replace the defective metallization layer, thereby reworking the component.
Claim 2
Independent Claim
81 words
A method of correcting a defective metallization layer on an electronic component, comprising: providing an electronic component with a substantially planar defective metallization layer on a substantially planar base layer; removing the defective metallization layer by applying a polishing pad with a substantially planar polishing surface so that the entire defective metallization layer is removed from the base layer; and fabricating a new substantially planar metallization layer on the base layer to replace the defective metallization layer, thereby reworking the component.
Claim 3
Dependent Claim
17 words
The method of claim 1 wherein the polishing is performed by a rotating pad and a slurry.
Claim 4
Dependent Claim
13 words
The method of claim 2 wherein the electronic component is an integrated circuit.
Claim 5
Dependent Claim
12 words
The method of claim 2 wherein the electronic component is a substrate.
Claim 6
Dependent Claim
12 words
The method of claim 4 wherein the substrate comprises a polymeric dielectric.
Claim 7
Dependent Claim
11 words
The method of claim 5 wherein the polymeric dielectric is polyimide.
Claim 8
Dependent Claim
12 words
The method of claim 6 wherein the defective metallization layer comprises copper.
Claim 9
Dependent Claim
22 words
The method of claim 4, further comprising the step of: testing the top metallization layer and detecting a defect prior to polishing.
Claim 10
Dependent Claim
19 words
The method of claim 4 wherein the defective metallization layer is disposed on at least one underlying metallization layer.
Claim 11
Dependent Claim
22 words
The method of claim 9 wherein said at least one underlying metallization layer is not damaged by polishing the defective metallization layer.
Claim 12
Dependent Claim
13 words
The method of claim 1 wherein the defect is a bent metal segment.
Claim 13
Dependent Claim
16 words
The method of claim 1 wherein the defect is a metal segment which is too low.
Claim 14
Dependent Claim
17 words
The method of claim 1 wherein the defect is a metal segment which has an electrical opening.
Claim 15
Dependent Claim
20 words
The method of claim 1 wherein the defect is a pair of metal segment short-circuited together by a metal fragment.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-09-01 | 1996-03-02 | 1996-09-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-09-01 | 2000-03-02 | 2000-09-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-09-01 | 2004-03-02 | 2004-09-01 | $7700.00 | Window Closed / Lapsed |