US5011580A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of reworking an electrical multilayer interconnect
Assignee: Microelectronics and Computer Technology Corp
•
Filing: 1990-06-25
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Granted: 1991-04-30
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Expires: 2010-06-25
Abstract
Abstract A method of reworking an electrical multilayer interconnect in which the electrical lines can be protected by an overcoat. The method includes removing a defective metallization layer from the top of an interconnect substrate, depositing an electrically conductive layer on the substrate, forming a base plating mask on the electrically conductive layer, plating a copper base into an opening in the base plating mask onto the electrically conductive layer, stripping the base plating mask, forming a pillar plating mask on top of the copper base, plating an electrically conductive metal pillar into an opening in the pillar plating mask onto the top of the copper base, stripping the plating mask, and stripping the electrically conductive layer below the stripped base plating mask. Additionally, a protective overcoat layer can be deposited on the exposed copper surfaces.
Inventors
- 👤 Ju-Don T. Pan
- 👤 II John W. Curry
- 👤 Laurence D. Schultz
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 23:34
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/62; H10W70/66; H05; H05K; H05K3/00; H05K3/46; H05K3/4644; H05K3/4647; H10W20/00; H10W20/01; H10W20/031; H10W20/064; H10W70/01; H10W70/05; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0347; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/096; H05K2203/00; H05K2203/07; H05K2203/0703; H05K2203/072; H05K2203/0733; H05K3/10; H05K3/108; H05K3/22; H05K3/222; H05K3/24; H05K3/243; H05K3/38; H05K3/388
Claims Analysis
Total Claims: 26
Claim 1
Independent Claim
110 words
A method of reworking an electrical multilayer interconnect comprising: removing a defective metallization layer from the top of an interconnect substrate, depositing an electrically conductive layer on the substrate, forming a base plating mask on the electrically conductive layer, plating a copper base into an opening in the base plating mask onto the electrically conductive layer, stripping the base plating mask, forming a pillar plating mask on top of the copper base, plating an electrically conductive metal pillar into an opening in the pillar plating mask onto the top of the copper base, stripping the pillar plating mask, and stripping the electrically conductive layer below the stripped base plating mask.
Claim 2
Independent Claim
110 words
A method of reworking an electrical multilayer interconnect comprising: removing a defective metallization layer from the top of an interconnect substrate, depositing an electrically conductive layer on the substrate, forming a base plating mask on the electrically conductive layer, plating a copper base into an opening in the base plating mask onto the electrically conductive layer, stripping the base plating mask, forming a pillar plating mask on top of the copper base, plating an electrically conductive metal pillar into an opening in the pillar plating mask onto the top of the copper base, stripping the pillar plating mask, and stripping the electrically conductive layer below the stripped base plating mask.
Claim 3
Dependent Claim
13 words
The method of claim 1 wherein the electrically conductive layer is a metal.
Claim 4
Dependent Claim
14 words
The method of claim 2 wherein the electrically conductive metal layer is sputter deposited.
Claim 5
Dependent Claim
14 words
The method of claim 2 wherein the electrically conductive metal layer is electrolessly deposited.
Claim 6
Dependent Claim
16 words
The method of claim 1 wherein the electrically conductive metal pillar is plated by electroless deposition.
Claim 7
Dependent Claim
15 words
The method of claim 1 wherein the electrically conductive metal pillar is plated by electroplating.
Claim 8
Dependent Claim
24 words
The method of claim 1 wherein the electrically conductive metal pillar is selected from the group consisting of copper, nickel, and a nickel alloy.
Claim 9
Dependent Claim
19 words
The method of claim 1 further comprising the step of depositing an overcoat layer on the exposed copper surfaces.
Claim 10
Dependent Claim
24 words
The method of claim 8 wherein the overcoat layer is deposited on the exposed surfaces of the copper base and electrically conductive metal pillar.
Claim 11
Dependent Claim
12 words
The method of claim 8 wherein the overcoat layer is electrolessly deposited.
Claim 12
Dependent Claim
26 words
The method of claim 10 wherein the overcoat layer is an electrolessly deposited metal selected from the group consisting of chromium, nickel, and a nickel alloy.
Claim 13
Dependent Claim
12 words
The method of claim 8 wherein the overcoat layer is immersion coated.
Claim 14
Dependent Claim
13 words
The method of claim 12 wherein the overcoat layer is immersion coated tin.
Claim 15
Dependent Claim
23 words
The method of claim 8 wherein prior to depositing the overcoat layer a light copper etch is applied to the exposed copper surfaces.
Claim 16
Dependent Claim
17 words
The method of claim 1 wherein the defective metallization layer is removed by uniform and non-selective polishing.
Claim 17
Dependent Claim
17 words
The method of claim 15 wherein the polishing is done by a rotating pad with a slurry.
Claim 18
Dependent Claim
20 words
The method of claim 1 further including depositing a polyimide coating over the substrate after stripping the electrically conductive layer.
Claim 19
Independent Claim
116 words
A method of reworking an electrical multilayer interconnect comprising: removing a defective metallization layer from the top of an interconnect substrate, depositing an electrically conductive metal layer on the substrate, forming a base plating mask on the metal layer, plating a copper base into an opening in the base plating mask onto the metal layer, stripping the base plating mask, forming a pillar plating mask on top of the copper base, plating a pillar selected from the group consisting copper, nickel, and a nickel alloy into an opening in the pillar plating mask onto the top of the copper base, stripping the pillar plating mask, and stripping the metal layer below the stripped base plating mask.
Claim 20
Independent Claim
116 words
A method of reworking an electrical multilayer interconnect comprising: removing a defective metallization layer from the top of an interconnect substrate, depositing an electrically conductive metal layer on the substrate, forming a base plating mask on the metal layer, plating a copper base into an opening in the base plating mask onto the metal layer, stripping the base plating mask, forming a pillar plating mask on top of the copper base, plating a pillar selected from the group consisting copper, nickel, and a nickel alloy into an opening in the pillar plating mask onto the top of the copper base, stripping the pillar plating mask, and stripping the metal layer below the stripped base plating mask.
Claim 21
Dependent Claim
19 words
The method of claim 18 further comprising the step of depositing an overcoat layer on the exposed copper surfaces.
Claim 22
Dependent Claim
12 words
The method of claim 19 wherein the overcoat layer is electrolessly deposited.
Claim 23
Dependent Claim
12 words
The method of claim 19 wherein the overcoat layer is immersion coated.
Claim 24
Dependent Claim
17 words
The method of claim 18 wherein the defective metallization layer is removed by uniform and non-selective polishing.
Claim 25
Dependent Claim
17 words
The method of claim 22 wherein the polishing is done by a rotating pad with a slurry.
Claim 26
Dependent Claim
19 words
The method of claim 18 further including depositing a polyimide coating over the substrate after stripping the metal layer.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-04-29 | 1994-10-29 | 1995-04-30 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-04-29 | 1998-10-29 | 1999-04-30 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-04-29 | 2002-10-29 | 2003-04-30 | $7700.00 | Window Closed / Lapsed |