US5071518A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of making an electrical multilayer interconnect
Assignee: Rateze Remote Mgmt LLC
•
Filing: 1989-10-24
•
Granted: 1991-12-10
•
Expires: 2009-10-24
Abstract
Abstract A method of making an electrical multilayer interconnect in which the electrical lines can be protected by an overcoat. The method includes depositing an electrically conductive layer on a substrate, forming a base plating mask on the electrically conductive layer, plating a copper base into an opening in the base plating mask onto the electrically conductive layer, stripping the base plating mask, forming a pillar plating mask on top of the copper base, plating an electrically conductive metal pillar into an opening in the pillar plating mask onto the top of the copper base, stripping the plating mask, and stripping the electrically conductive layer below the stripped base plating mask. Additionally, a protective overcoat layer can be deposited on the exposed copper surfaces.
Inventors
- 👤 Ju-Don T. Pan
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 03:50
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/46; H05K3/4644; H05K3/4647; H10; H10W; H10W20/00; H10W20/01; H10W20/031; H10W20/063; H10W20/064; H10W70/00; H10W70/01; H10W70/05; H10W70/60; H10W70/62; H10W70/66; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0347; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/096; H05K2203/00; H05K2203/07; H05K2203/0703; H05K2203/072; H05K2203/0733; H05K3/10; H05K3/108; H05K3/22; H05K3/222; H05K3/24; H05K3/243; H05K3/38; H05K3/388
Claims Analysis
Total Claims: 20
Claim 1
Independent Claim
98 words
A method of making an electrical multilayer interconnect comprising: depositing an electrically conductive layer on a substrate, forming a base plating mask on the electrically conductive layer, plating a copper base into an opening in the base plating mask onto the electrically conductive layer, stripping the base plating mask, forming a pillar plating mask On top of the copper base, plating an electrically conductive metal pillar into an opening in the pillar plating mask onto the top of the copper base, stripping the pillar plating mask, and stripping the electrically conductive layer below the stripped base plating mask.
Claim 2
Independent Claim
98 words
A method of making an electrical multilayer interconnect comprising: depositing an electrically conductive layer on a substrate, forming a base plating mask on the electrically conductive layer, plating a copper base into an opening in the base plating mask onto the electrically conductive layer, stripping the base plating mask, forming a pillar plating mask On top of the copper base, plating an electrically conductive metal pillar into an opening in the pillar plating mask onto the top of the copper base, stripping the pillar plating mask, and stripping the electrically conductive layer below the stripped base plating mask.
Claim 3
Dependent Claim
13 words
The method of claim 1 wherein the electrically conductive layer is a metal.
Claim 4
Dependent Claim
14 words
The method of claim 2 wherein the electrically conductive metal layer is sputter deposited.
Claim 5
Dependent Claim
14 words
The method of claim 2 wherein the electrically conductive metal layer is electrolessly deposited.
Claim 6
Dependent Claim
16 words
The method of claim 1 wherein the electrically conductive metal pillar is plated by electroless deposition.
Claim 7
Dependent Claim
15 words
The method of claim 1 wherein the electrically conductive metal pillar is plated by electroplating.
Claim 8
Dependent Claim
24 words
The method of claim 1 wherein the electrically conductive metal pillar is selected from the group consisting of copper, nickel, and a nickel alloy.
Claim 9
Dependent Claim
19 words
The method of claim 1 further comprising the step of depositing an overcoat layer on the exposed copper surfaces
Claim 10
Dependent Claim
24 words
The method of claim 8 wherein the overcoat layer is deposited on the exposed surfaces of the copper base and electrically conductive metal pillar.
Claim 11
Dependent Claim
12 words
The method of claim 8 wherein the overcoat layer is electrolessly deposited.
Claim 12
Dependent Claim
26 words
The method of claim 10 wherein the overcoat layer is an electrolessly deposited metal selected from the group consisting of chromium, nickel, and a nickel alloy.
Claim 13
Dependent Claim
12 words
The method of claim 8 wherein the overcoat layer is immersion coated.
Claim 14
Dependent Claim
13 words
The method of claim 12 wherein the overcoat layer is immersion coated tin.
Claim 15
Dependent Claim
23 words
The method of claim 8 wherein prior to depositing the overcoat layer a light copper etch is applied to the exposed copper surfaces.
Claim 16
Independent Claim
104 words
A method of making an electrical multilayer interconnect comprising: depositing an electrically conductive metal layer on a substrate, forming a base plating mask on the metal layer, plating a copper base into an opening in the base plating mask onto the metal layer, stripping the base plating mask, forming a pillar plating mask On top of the copper base, plating a pillar selected from the group consisting copper, nickel, and a nickel alloy into an opening in the pillar plating mask onto the top of the copper base, stripping the pillar plating mask, and stripping the metal layer below the stripped base plating mask.
Claim 17
Independent Claim
104 words
A method of making an electrical multilayer interconnect comprising: depositing an electrically conductive metal layer on a substrate, forming a base plating mask on the metal layer, plating a copper base into an opening in the base plating mask onto the metal layer, stripping the base plating mask, forming a pillar plating mask On top of the copper base, plating a pillar selected from the group consisting copper, nickel, and a nickel alloy into an opening in the pillar plating mask onto the top of the copper base, stripping the pillar plating mask, and stripping the metal layer below the stripped base plating mask.
Claim 18
Dependent Claim
19 words
The method of claim 15 further comprising the step of depositing an overcoat layer on the exposed copper surfaces.
Claim 19
Dependent Claim
12 words
The method of claim 16 wherein the overcoat layer is electrolessly deposited.
Claim 20
Dependent Claim
12 words
The method of claim 16 wherein the overcoat layer is immersion coated.
References Cited (Backward Citations)
US3745094A
Cited
US3791858A
Cited
US4082591A
Cited
US4159222A
Cited
US4306925A
Cited
US4190474A
Cited
US4233344A
Cited
US4409037A
Cited
US4810332A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-12-09 | 1995-06-10 | 1995-12-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-12-09 | 1999-06-10 | 1999-12-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-12-09 | 2003-06-10 | 2003-12-10 | $7700.00 | Window Closed / Lapsed |