Patent US5037691A successfully refreshed from Google Patents.
US5037691A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Reinforced plastic laminates for use in the production of printed circuit boards and process for making such laminates and resulting products
Assignee: JACKSON WILLARD T
•
Filing: 1989-08-23
•
Granted: 1991-08-06
•
Expires: 2009-08-23
Abstract
Abstract A warp-free laminate is produced by winding a first set of strands or filaments about a flat mandrel with a second set of strands being wound transverse to the first set. The two sets may be perpendicular to each other. The filaments are maintained under a controlled tension while being impregnated with a resin and during subsequent cure of the resin. In order to permit the formation of a warp-free product, the winding pattern is such that it forms a mirror image about a neutral axis or plane of symmetry. The winding pattern may be chosen to provide interstices in a predetermined pattern permitting punching out or high speed drilling of hole openings for subsequent printed circuit applications.
Inventors
- 👤 Jonas Medney
- 👤 Fred E. Klimpl
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 03:47
CPC Classifications
B; B29; B29C; B29C53/00; B29C53/56; B29C53/564; B29C53/58; B29C53/76; B29C53/80; B29C53/8008; B29C53/8016; B29C70/00; B29C70/04; B29C70/06; B29C70/10; B29C70/16; B29C70/20; B29C70/202; B29C70/28; B29C70/30; B29C70/34; B29C70/347; H; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/0313; H05K1/0353; H05K1/0366; B29L; B29L2031/00; B29L2031/34; B29L2031/3425; H05K2201/00; H05K2201/01; H05K2201/0137; H05K2201/0145; H05K2201/02; H05K2201/0275; H05K2201/0278; H05K2201/0287; H05K2203/00; H05K2203/08; H05K2203/085; H05K2203/13; H05K2203/1305; H05K2203/1327; H05K3/00; H05K3/0011; H05K3/0044; H05K3/0047; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T428/00; Y10T428/24; Y10T428/24273; Y10T428/24322; Y10T428/24802; Y10T428/24917; Y10T428/30; Y10T428/31504; Y10T428/31721
Claims Analysis
Total Claims: 75
Claim 1
Independent Claim
74 words
A printed circuit board comprising a matrix having first and second exterior sides and a plane of symmetry parallel thereto and within said matrix, a plurality of layers, each layer comprising a plurality of filament sections arranged generally in the same direction, said filament sections being arranged in mirror image relationship relative to said plane of symmetry, said exterior sides having a flatness and surface finish suitable for use as a printed circuit board.
Claim 2
Dependent Claim
74 words
A printed circuit board comprising a matrix having first and second exterior sides and a plane of symmetry parallel thereto and within said matrix, a plurality of layers, each layer comprising a plurality of filament sections arranged generally in the same direction, said filament sections being arranged in mirror image relationship relative to said plane of symmetry, said exterior sides having a flatness and surface finish suitable for use as a printed circuit board.
Claim 3
Dependent Claim
34 words
A printed circuit board as claimed in claim 1 wherein the direction of filament sections in one layer are arranged at an angle with respect to the direction of filament sections in adjacent layers.
Claim 4
Dependent Claim
21 words
A printed circuit board as claimed in claim 1 wherein said plane of symmetry is positioned between adjacent of said layers.
Claim 5
Dependent Claim
19 words
A printed circuit board as claimed in claim 1 wherein said layers have a like number of filament sections.
Claim 6
Dependent Claim
54 words
A printed circuit board as claimed in claim 1 wherein the tension of the filament sections at gelation of the matrix is such that all stresses at ambient temperatures reach an equilibrium so that the net stresses in the circuit board is not greater than the critical buckling stress for the printed circuit board.
Claim 7
Dependent Claim
35 words
A printed circuit board as claimed in claim 1 wherein said filament sections in each of said layers are uniformly distributed about an axis with the axes of alternate layers being perpendicular to one another.
Claim 8
Dependent Claim
25 words
A printed circuit board as claimed in claim 1 which further comprises a metal on at least part of a surface of an exterior side.
Claim 9
Dependent Claim
28 words
A printed circuit board as claimed in claim 7 wherein said matrix is provided with at least one hole, with metal extending at least partly along said hole.
Claim 10
Dependent Claim
41 words
A printed circuit board as claimed in claim 1 wherein said filament sections are arranged in the matrix to leave a portion of said matrix devoid of said filament sections, said matrix being provided with a hole extending through said portion.
Claim 11
Dependent Claim
26 words
A printed circuit board as claimed in claim 1 wherein the filament sections in one layer are perpendicular to the filament sections in a second layer.
Claim 12
Dependent Claim
52 words
A printed circuit board as claimed in claim 1 in the shape of a right quadrilateral having two faces in the shape of parallel planes and four edges arranged in parallel pairs connecting said faces, said filament sections of said first and second layers being at least substantially perpendicular to said edges.
Claim 13
Dependent Claim
33 words
A printed circuit board as claimed in claim 1 wherein said filament sections include sections of harder and softer materials, the softer material sections being arranged to facilitate the formation of holes therein.
Claim 14
Dependent Claim
18 words
A printed circuit board as claimed in claim 1 wherein said filament sections are of untwisted filament bundles.
Claim 15
Dependent Claim
18 words
A printed circuit board as claimed in claim 1 wherein said filament sections are of twisted yarn structure.
Claim 16
Dependent Claim
18 words
A printed circuit board as claimed in claim 1 wherein said filament sections are of plied yarn structure.
Claim 17
Dependent Claim
30 words
A printed circuit board as claimed in claim 1 wherein said filament sections are of a material selected from the group consisting of fiberglass, aramid, quartz, carbon, nylon and polyester.
Claim 18
Dependent Claim
32 words
A printed circuit board as claimed in claim 1 wherein the matrix is of a material selected from the group consisting of epoxy, polyimide, polyester, vinyl ester, phenolic, bismaleimide, melamine, and polybutadiene.
Claim 19
Dependent Claim
40 words
A multilayer printed circuit board comprising a continuous, essentially void-free resin matrix having outer surfaces, conductive metal on at least one side of said outer surfaces, and interior printed circuit boards in spaced relation and encapsulated by said resin matrix.
Claim 20
Dependent Claim
40 words
A multilayer printed circuit board comprising a continuous, essentially void-free resin matrix having outer surfaces, conductive metal on at least one side of said outer surfaces, and interior printed circuit boards in spaced relation and encapsulated by said resin matrix.
Claim 21
Dependent Claim
21 words
A multilayer printed circuit board as in claim 18 wherein the filamentary material is continuous fiberglass, quartz, aramid, nylon, or polyester.
Claim 22
Dependent Claim
17 words
A multilayer printed circuit board as in claim 19 wherein the filamentary material is in cloth form.
Claim 23
Dependent Claim
19 words
A multilayer printed circuit board as in claim 19 but where the filamentary material fiberglass is in wound form.
Claim 24
Dependent Claim
23 words
A multilayer printed circuit board as in claim 18 where filamentary material is discontinuous fiberglass, quartz, aramid, nylon or polyester in mat form.
Claim 25
Dependent Claim
37 words
A multilayer printed circuit board as in claim 18 where the resin matrix comprises a liquid resin system selected from the group consisting of epoxy, polyimide, acrylic, polyester, bismaleimide, vinyl ester, cyanate ester, phenolic, melamine and polybutadiene.
Claim 26
Dependent Claim
19 words
A multilayer printed circuit board as in claim 18 where the resin system is a hardenable plastic resin system.
Claim 27
Dependent Claim
33 words
A multilayer printed circuit board as in claim 24 where the resin system is a resin system selected from the group consisting of epoxy, polyimide, polyester, bismaleimide, vinyl ester, phenolic, melamine and polybutadiene.
Claim 28
Dependent Claim
18 words
A multilayer printed circuit board as in claim 18 wherein fillers are placed into the liquid resin system.
Claim 29
Dependent Claim
19 words
A printed circuit board as claimed in claim 1 further comprising a woven or non-woven fabric within said matrix.
Claim 30
Dependent Claim
15 words
A printed circuit board as in claim 17 wherein the said matrix material includes fillers.
Claim 31
Dependent Claim
73 words
A printed circuit board comprising a matrix having first and second outer surfaces and a plurality of filament sections embedded therein and in parallel layers arranged in mirror image relationship relative to a plane of symmetry parallel to said outer surfaces, wherein filament sections within each respective layer are arranged generally in the same direction, and the filament sections in one layer are arranged at an angle with respect to each adjacent layer.
Claim 32
Dependent Claim
73 words
A printed circuit board comprising a matrix having first and second outer surfaces and a plurality of filament sections embedded therein and in parallel layers arranged in mirror image relationship relative to a plane of symmetry parallel to said outer surfaces, wherein filament sections within each respective layer are arranged generally in the same direction, and the filament sections in one layer are arranged at an angle with respect to each adjacent layer.
Claim 33
Dependent Claim
48 words
A printed circuit board as claimed in claim 29 wherein the filament sections are maintained during the setting or curing of the matrix at a tension which is the minimum necessary to maintain alignment of the filament sections, such that the resultant structure is substantially free from warpage.
Claim 34
Dependent Claim
55 words
A printed circuit board as claimed in claim 29 wherein the parallel filament sections are equally tensioned and wherein the material of the filament sections and the proportion of filament sections to matrix in the respective layers is such that the coefficients of thermal expansion in the directions of the filament sections are substantially equal.
Claim 35
Dependent Claim
23 words
A printed circuit board as claimed in claim 29 wherein the filament sections in the alternate layers are at least substantially perpendicularly related.
Claim 36
Dependent Claim
18 words
A printed circuit board as claimed in claim 29 wherein the filament sections and matrix are electrically non-conductive.
Claim 37
Dependent Claim
36 words
A printed circuit board as claimed in claim 29 wherein the layers are of right quadrilateral configuration having pairs of opposite edges, with the filament sections being substantially perpendicular to one of said pairs of edges.
Claim 38
Dependent Claim
37 words
A multilayer printed circuit board as in claim 29 where the liquid plastic resin system is a resin selected from the group consisting of epoxy, polyimide, acrylic, polyester, bismaleimide, vinyl ester, cyanate ester, phenolic, melamine and polybutadiene.
Claim 39
Dependent Claim
37 words
A printed circuit board as claimed in claim 29 further comprising a metallic coating and wherein said matrix has at least a portion of one surface on which at least part of said metallic coating is supported.
Claim 40
Dependent Claim
41 words
A printed circuit board as claimed in claim 36 wherein said matrix is provided with at least one hole defining an interior surface within said matrix, said metallic coating including a portion supported on at least part of said interior surface.
Claim 41
Dependent Claim
22 words
A printed circuit board as claimed in claim 29 wherein all of said layers have a substantially equal number of filament sections.
Claim 42
Dependent Claim
36 words
A printed circuit board as claimed in claim 29 wherein said plurality of filament sections in each said layer are uniformly disposed about an axis, the axes of said alternate layers being transverse to one another.
Claim 43
Dependent Claim
92 words
A printed circuit board comprising a matrix having embedded therein a plurality of filament sections arranged in parallel layers arranged in mirror image relative to a plane of symmetry, the filament sections in each respective layer being parallel, the filament sections in alternate layers being arranged angularly with respect to each adjacent layer, wherein the filament sections are maintained during the setting or curing of the matrix at a tension which is the minimum necessary to maintain alignment of the filament sections, such that the resultant structure is substantially free from warpage.
Claim 44
Dependent Claim
92 words
A printed circuit board comprising a matrix having embedded therein a plurality of filament sections arranged in parallel layers arranged in mirror image relative to a plane of symmetry, the filament sections in each respective layer being parallel, the filament sections in alternate layers being arranged angularly with respect to each adjacent layer, wherein the filament sections are maintained during the setting or curing of the matrix at a tension which is the minimum necessary to maintain alignment of the filament sections, such that the resultant structure is substantially free from warpage.
Claim 45
Dependent Claim
97 words
A printed circuit board as claimed in claim 40 wherein the filament sections in the alternate layers are at least substantially perpendicularly related, the layers being of right quadrilateral configuration having pairs of opposite edges, with the filament sections being at least substantially perpendicular to one of said pairs of edges, wherein the parallel filament sections are equally tensioned and wherein the material of the filament sections and the proportion of filament sections to matrix in the respective layers is such that the coefficients of thermal expansion in the directions of the filament sections are substantially equal.
Claim 46
Dependent Claim
46 words
A printed circuit board as claimed in claim 40 further comprising a metallic coating and wherein said matrix has at least a portion of one surface on which at least part of said metallic coating is supported, wherein the filament sections and matrix are electrically non-conductive.
Claim 47
Dependent Claim
41 words
A printed circuit board as claimed in claim 42 wherein said matrix is provided with at least one hole defining an interior surface within said matrix, said metallic coating including a portion supported on at least part of said interior surface.
Claim 48
Dependent Claim
37 words
A multilayer printed circuit board as in claim 40 where the liquid plastic resin system is a resin selected from the group consisting of epoxy, polyimide, acrylic, polyester, bismaleimide, vinyl ester, cyanate ester, phenolic, melamine and polybutadiene.
Claim 49
Dependent Claim
59 words
A printed circuit board comprising a matrix having X and Y directions which are perpendicular to each other and layers of continuous filaments in said matrix, said matrix and filaments being so constructed and arranged as to provide a plane of symmetry therein and thermal coefficients of expansion which are essentially the same in the X and Y directions.
Claim 50
Dependent Claim
59 words
A printed circuit board comprising a matrix having X and Y directions which are perpendicular to each other and layers of continuous filaments in said matrix, said matrix and filaments being so constructed and arranged as to provide a plane of symmetry therein and thermal coefficients of expansion which are essentially the same in the X and Y directions.
Claim 51
Dependent Claim
31 words
A printed circuit board as claimed in claim 45 wherein said layers are parallel and wherein the filaments in alternate layers are aligned respectively in only the X or Y direction.
Claim 52
Dependent Claim
36 words
A printed circuit board as claimed in claim 45 wherein the filaments are so constructed and arranged as to provide section modulus of elasticity values which are essentially the same in the X and Y directions.
Claim 53
Dependent Claim
20 words
A printed circuit board as claimed in claim 45 wherein the matrix and filaments constitute a void free monolithic structure.
Claim 54
Dependent Claim
57 words
A printed circuit board as claimed in claim 46 wherein the filaments are under a tension which is the same on all filaments aligned in the X direction and on all filaments aligned in the Y direction and is of a value which induces a stress in said board which is less than the critical buckling stress.
Claim 55
Dependent Claim
19 words
A printed circuit board as claimed in claim 45 wherein the filaments are all of substantially the same diameter.
Claim 56
Dependent Claim
16 words
A printed circuit board as claimed in claim 45 wherein the filaments are of different diameters.
Claim 57
Dependent Claim
32 words
A printed circuit board as claimed in claim 51 wherein the filaments are of larger diameter towards the center of the matrix and of smaller diameter toward the surfaces of the matrix.
Claim 58
Dependent Claim
34 words
A printed circuit board as claimed in claim 45 wherein the filaments are so constructed and arranged as to provide section modulus of elasticity values which are tailored in the X and Y directions.
Claim 59
Dependent Claim
26 words
A printed circuit board as claimed in claim 45 wherein the filaments are arranged in rovings and the number of filaments in the rovings are different.
Claim 60
Dependent Claim
27 words
A printed circuit board as claimed in claim 50 wherein the filaments are arranged in rovings and the number of filaments in the rovings are the same.
Claim 61
Dependent Claim
36 words
A multilayer printed circuit board as in claim 23 where the liquid resin system is a resin selected from the group consisting of epoxy, polyimide, acrylic, polyester, bismaleimide, vinyl ester, cyanate ester, phenolic, melamine and polybutadiene.
Claim 62
Dependent Claim
71 words
A printed circuit board comprising a matrix having X and Y directions and layers of continuous filaments in said matrix, said matrix and filaments being so constructed and arranged as to provide thermal coefficients of expansion which are the same in the X and Y directions, wherein the filaments are so constructed and arranged as to provide section modulus of elasticity values which are tailored in the X and Y directions.
Claim 63
Dependent Claim
71 words
A printed circuit board comprising a matrix having X and Y directions and layers of continuous filaments in said matrix, said matrix and filaments being so constructed and arranged as to provide thermal coefficients of expansion which are the same in the X and Y directions, wherein the filaments are so constructed and arranged as to provide section modulus of elasticity values which are tailored in the X and Y directions.
Claim 64
Dependent Claim
64 words
A printed circuit board as claimed in claim 57 wherein said layers are parallel and wherein the filaments in alternate layers are aligned respectively in the X and Y directions and are so constructed and arranged as to provide a section modulus of elasticity which is the same in the X and Y directions, the matrix and filaments constituting a void free monolithic structure.
Claim 65
Dependent Claim
57 words
A printed circuit board as claimed in claim 57 wherein the filaments are under a tension which is the same on all filaments aligned in the X direction and on all filaments aligned in the Y direction and is of a value which induces a stress in said article which is less than the critical buckling stress.
Claim 66
Dependent Claim
18 words
A printed circuit board as claimed in claim 57 wherein some of the filaments are of different diameters.
Claim 67
Dependent Claim
33 words
A printed circuit board as claimed in claim 57 wherein the filaments are of larger diameter towards the center of the matrix and of smaller diameter toward the outer surfaces of the board.
Claim 68
Dependent Claim
37 words
A multilayer printed circuit board as in claim 57 where the liquid plastic resin system is a resin selected from the group consisting of epoxy, polyimide, acrylic, polyester, bismaleimide, vinyl ester, cyanate ester, phenolic, melamine and polybutadiene.
Claim 69
Dependent Claim
46 words
A multilayer printed circuit board comprising a continuous matrix having outer surfaces suitable for supporting a metal printed circuit thereupon; and a plurality of interior printed circuit boards aligned, spaced and embedded within said matrix in proper registration thereof, said matrix including a filamentary material therein.
Claim 70
Dependent Claim
46 words
A multilayer printed circuit board comprising a continuous matrix having outer surfaces suitable for supporting a metal printed circuit thereupon; and a plurality of interior printed circuit boards aligned, spaced and embedded within said matrix in proper registration thereof, said matrix including a filamentary material therein.
Claim 71
Dependent Claim
19 words
A multilayer printed circuit board as claimed in claim 63 wherein the matrix is a settable liquid resin system.
Claim 72
Dependent Claim
37 words
A multilayer printed circuit board as in claim 64 where the liquid plastic resin system is a resin selected from the group consisting of epoxy, polyimide, acrylic, polyester, bismaleimide, vinyl ester, cyanate ester, phenolic, melamine and polybutadiene.
Claim 73
Dependent Claim
28 words
A multilayer printed circuit board as claimed in claim 63 wherein the matrix is essentially void free and the filamentary material is fiberglass, quartz, aramid, nylon or polyester.
Claim 74
Dependent Claim
24 words
A multilayer printed circuit board as claimed in claim 63 wherein the filamentary material is in the form of a woven or non-woven fabric.
Claim 75
Dependent Claim
36 words
A multilayer printed circuit board as claimed in claim 63 wherein at least one outer surface includes a metal printed circuit thereupon, and further comprising at least one hole therein forming a part of said circuit.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-08-05 | 1995-02-04 | 1995-08-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-08-05 | 1999-02-04 | 1999-08-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-08-05 | 2003-02-04 | 2003-08-06 | $7700.00 | Window Closed / Lapsed |