Semiconductor integrated circuit device having selectable operational functions

Claim 1

A semiconductor integrated circuit device having operational functions, selection of a particular function being determined by the absence or presence of a wiring connection between a first bonding pad (20) and a power supply having a first predetermined potential, comprising: a first potential supply line (31) for supplying an operating potential (Vcc), means (Q2, Q3, Q4) for generating a signal for designating one of said operational functions in response to a potential on an input signal line (30) connected to said first bonding pad (20), means (40) for generating aone shot pulse signal for a predetermined period in response to energizing of said first potential supply line by said power supply, means (Q11, Q40, Q52) momentarily activated in response to an output of said one shot pulse signal generating means, for resetting said input signal line to a second predetermined potential, and means (Q12, Q13, Q14; Q3, Q4, Q12; Q30, Q31, Q32; Q3, Q4, Q41; Q41, Q42, Q43; Q50, Q51, Q52) for setting and maintaining a potential on said input signal line in response to said potential on said input signal line, and cutting off a current path formed by said input signal line, said first bonding pad and said power supply when said bonding pad is connected to said power supply.

Claim 15

A system for determining operational functions for a semiconductor integrated circuit device using selection between at least first and second bonding pads (60a, 60c) to set a proper connection to an external circuit (67), comprising: a selection signal generator (66); a pad switching circuit (65) for selecting between said bonding pads in response to an output of said selection signal generator (66); a second potential bus; a selection binding pad (60b) connectable to either a power supply providing a first potential or said second potential bus, and further connectable to said selection signal generator in a manner to determine the specific output of said selection signal generator so as to select a specific bonding pad for connection from among at least said first and second bonding pads; said selection signal generator comprising a first potential supply line connected to a power supply providing a first potential; an input signal line connectable to said bonding pad for selection; means for generating at least two types of output signals for determining a bonding pad for connection to be selected by said pad switching circuit in response to a potential on said input signal line; means for generating an activation signal for a predetermined period in response to application of said first potential to said first potential supply line; means activated in response to an output of said activation signal generating means, for resetting said input signal line to a predetermined potential; and means for setting and maintaining the potential on said input signal line in response to said potential on said input signal line, and cutting off a current path formed by said input signal line, said selection bonding and either said power supply or said second potential bus.

Claim 16

A system for determining operational functions for a semiconductor integrated circuit device using selection between at least first and second bonding pads (60a, 60c) to set a proper connection to an external circuit (67), comprising: a selection signal generator (66); a pad switching circuit (65) for selecting between said bonding pads in response to an output of said selection signal generator (66); a second potential bus; a selection binding pad (60b) connectable to either a power supply providing a first potential or said second potential bus, and further connectable to said selection signal generator in a manner to determine the specific output of said selection signal generator so as to select a specific bonding pad for connection from among at least said first and second bonding pads; said selection signal generator comprising a first potential supply line connected to a power supply providing a first potential; an input signal line connectable to said bonding pad for selection; means for generating at least two types of output signals for determining a bonding pad for connection to be selected by said pad switching circuit in response to a potential on said input signal line; means for generating an activation signal for a predetermined period in response to application of said first potential to said first potential supply line; means activated in response to an output of said activation signal generating means, for resetting said input signal line to a predetermined potential; and means for setting and maintaining the potential on said input signal line in response to said potential on said input signal line, and cutting off a current path formed by said input signal line, said selection bonding and either said power supply or said second potential bus.