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US4948707A Expired / Lapsed US ⏱️ 0.0 years remaining

Conditioning a non-conductive substrate for subsequent selective deposition of a metal thereon

Assignee: International Business Machines Corp
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Filing: 1988-02-16
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Granted: 1990-08-14
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Expires: 2008-02-16
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Abstract

Abstract A non-conductive substrate is conditioned for subsequent selective deposition of a metal thereon by providing at least one of the major surfaces of the substrate in roughened form, contacting that surface(s) with a palladium/tin catalyst, activating the catalyst by employing an alkali hydroxide solution, laminating a photosensitive composition to the major surface(s), and exposing the photosensitive composition to actinic light in a predetermined pattern and then developing to provide the predetermined pattern.

Inventors

  • 👤 Robert W. Johnson
  • 👤 William H. Lawrence
  • 👤 Gary K. Lemon
  • 👤 Roy H. Magnuson
  • 👤 Voya R. Markovich
  • 👤 Ralph E. Parsons
  • 👤 Carlos J. Sambucetti

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-04 21:12
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/10; H05K3/18; H05K3/181; H05K3/182; H05K3/184; H05K3/38; H05K3/381; H05K2203/00; H05K2203/07; H05K2203/0703; H05K2203/0716; H05K2203/11; H05K2203/1152; H05K2203/12; H05K2203/122; H05K2203/14; H05K2203/1407; H05K3/0011; H05K3/0017; H05K3/0023

Claims Analysis

Total Claims: 21
Claim 1
Independent Claim 176 words
Method for conditioning a non-conductive substrate for the subsequent selective deposition thereon of a metal from an electroless plating bath which comprises: providing a non-conductive substrate having at least one of its major surfaces roughened; contacting said at least one of its major surfaces with a homogeneous colloidal dispersion of palladium/tim particles having a particle size of about 10 angstroms to about 50 angstroms; activating said palladium/tin particles by contacting with an alkali hydroxide solution of about 0.05 molar to about 1 molar; laminating to said at least one major surface a photosensitive composition capable of providing a permanent protecting coating; exposing said photosensitive composition to actinic light in a predetermined pattern; and then developing said photosensitive composition to provide a predetermined pattern on said at least one major surface, whereby palladium particles, remaining beneath the photosensitive composition remaining as said permanent protective coating after the developing, are insulated and immobilized to thereby reduce current leakage between adjacent circuit lines from the subsequent selective deposition on the substrate of a metal from an electroless plating bath.
Claim 2
Dependent Claim 176 words
Method for conditioning a non-conductive substrate for the subsequent selective deposition thereon of a metal from an electroless plating bath which comprises: providing a non-conductive substrate having at least one of its major surfaces roughened; contacting said at least one of its major surfaces with a homogeneous colloidal dispersion of palladium/tim particles having a particle size of about 10 angstroms to about 50 angstroms; activating said palladium/tin particles by contacting with an alkali hydroxide solution of about 0.05 molar to about 1 molar; laminating to said at least one major surface a photosensitive composition capable of providing a permanent protecting coating; exposing said photosensitive composition to actinic light in a predetermined pattern; and then developing said photosensitive composition to provide a predetermined pattern on said at least one major surface, whereby palladium particles, remaining beneath the photosensitive composition remaining as said permanent protective coating after the developing, are insulated and immobilized to thereby reduce current leakage between adjacent circuit lines from the subsequent selective deposition on the substrate of a metal from an electroless plating bath.
Claim 3
Dependent Claim 14 words
The method of claim 1 wherein said non-conductive substrate includes a thermosetting polymeric material.
Claim 4
Dependent Claim 13 words
The method of claim 1 wherein said non-conductive substrate includes an epoxy resin.
Claim 5
Dependent Claim 13 words
The method of claim 1 wherein said non-conductive substrate includes glass-reinforced epoxy material.
Claim 6
Dependent Claim 23 words
The method of claim 1 wherein at least one of the major surfaces of the non-conductive substrate is roughened by sacrificial metal technique.
Claim 7
Dependent Claim 10 words
The method of claim 5 wherein said metal is copper.
Claim 8
Dependent Claim 63 words
The method of claim 1 wherein at least one of the major surfaces of the non-conductive substrate is roughened by providing a copper sheet having a roughened surface; laminating said copper sheet to said at least one of the major surfaces by pressing the roughened surface of said copper sheet against the surface of said substrate; and etching away all of the copper.
Claim 9
Dependent Claim 42 words
The method of claim 1 which further includes conditioning the at least one of the major surfaces prior to treatment with the palladium/tin particles by contacting with an acidic solution containing a multifunctional cationic group containing at least two available ionic moieties.
Claim 10
Dependent Claim 27 words
The method of claim 1 wherein said colloidal dispersion contains about 1.5 to about 2.5 grams/liter of palladium and about 75 to about 150 grams/liter of tin.
Claim 11
Dependent Claim 26 words
The method of claim 1 wherein said activating is carried out at room temperature to about 70° C. for about 30 seconds to about 60 seconds.
Claim 12
Dependent Claim 19 words
The method of claim 1 wherein said hydroxide solution is a 0.1 molar to 0.3 molar sodium hydroxide solution.
Claim 13
Dependent Claim 50 words
The method of claim 1 wherein said photosensitive composition includes reaction product of a mixture of at least one epoxidized non-linear novolak having at least 6 terminal epoxy groups with at least about 0.9 moles of at least one monoethylenically unsaturated carboxylic acid per epoxide equivalent weight of said novolak.
Claim 14
Dependent Claim 15 words
The method of claim 12 wherein said novolak is represented by the average formula: ##STR2##
Claim 15
Dependent Claim 23 words
The method of claim 12 wherein said photosensitive composition also contains about 1% to about 20% by weight of a polyethylenically unsaturated compound.
Claim 16
Dependent Claim 20 words
The method of claim 1 wherein the thickness of the photosensitive composition is about 0.7 mil to about 2 mils.
Claim 17
Dependent Claim 20 words
The method of claim 1 wherein the thickness of the photosensitive composition is about 1.5 mils to about 1.8 mils.
Claim 18
Dependent Claim 11 words
The method of claim 1 wherein said photosensitive composition is post-cured.
Claim 19
Dependent Claim 30 words
The method of claim 1 which further includes after the developing of the photosensitive composition depositing on said substrate in said predetermined pattern a metal from an electroless plating bath.
Claim 20
Dependent Claim 10 words
The method of claim 18 wherein said metal is copper.
Claim 21
Dependent Claim 41 words
The method of claim 18 whereby said laminating ensures interdiffusion between the photosensitive composition and the substrate so that the electrical resistance between adjacent circuit lines is greater than about 10 9 ohms at about 50° C. at 80% relative humidity.

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1993-08-13 1994-02-12 1994-08-14 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1997-08-13 1998-02-12 1998-08-14 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2001-08-13 2002-02-12 2002-08-14 $7700.00 Window Closed / Lapsed

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