US4782007A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Additive method for manufacturing printed circuit boards using aqueous alkaline developable and strippable photoresists
Assignee: MacDermid Acumen Inc
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Filing: 1987-04-28
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Granted: 1988-11-01
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Expires: 2007-04-28
Abstract
Abstract An additive process for making printed circuit boards utilizing aqueous alkaline strippable resists, in which a suitable insulating substrate is patterned with the resist, the resist-patterned substrate catalyzed to electroless metal deposition, the resist then stripped completely from the substrate, utilizing an aqueous alkaline solution, preferably containing a reducing agent, and the electroless metal then deposited over the areas of the substrate catalyzed in the desired pattern.
Inventors
- 👤 Donald R. Ferrier
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 20:47
CPC Classifications
B; B05; B05D; B05D5/00; B05D5/12; G; G03; G03F; G03F7/00; H; H05; H05K; H05K3/00; H05K3/10; H05K3/18; H05K3/181; H05K3/182; H05K3/184; H05K2203/00; H05K2203/05; H05K2203/0562; H05K2203/0565; H05K2203/07; H05K2203/0756; H05K2203/0769; H05K2203/0779; H05K2203/0786; H05K3/40; H05K3/42; H05K3/425; H05K3/426
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
104 words
A process for manufacturing a pattern-metallized printed circuit by additive processing, comprising the steps of: (a) providing an insulating substrate; (b) providing on the surfaces of said substrate an alkaline strippable plating resist in a pattern which defines those areas on the surfaces of said substrate where metallization is not desired; (c) depositing on the resist-patterned substrate species or precursors thereof catalytic to electroless metallization; (d) removing said resist, and any catalytic species or precursors thereon, from said substrate by contact thereof with an aqueous alkaline solution containing a reducing agent; and (e) electrolessly depositing metal on the remaining catalyzed areas of said substrate.
Claim 2
Dependent Claim
104 words
A process for manufacturing a pattern-metallized printed circuit by additive processing, comprising the steps of: (a) providing an insulating substrate; (b) providing on the surfaces of said substrate an alkaline strippable plating resist in a pattern which defines those areas on the surfaces of said substrate where metallization is not desired; (c) depositing on the resist-patterned substrate species or precursors thereof catalytic to electroless metallization; (d) removing said resist, and any catalytic species or precursors thereon, from said substrate by contact thereof with an aqueous alkaline solution containing a reducing agent; and (e) electrolessly depositing metal on the remaining catalyzed areas of said substrate.
Claim 3
Dependent Claim
59 words
The process according to claim 1 wherein said alkaline strippable resist is provided by coating the substrate with a photosensitive resist material, exposing said coated substrate to light through a mask of desired pattern, and developing said exposed coated substrate so as to leave on the surfaces of said substrate an alkaline strippable plating resist in the desired pattern.
Claim 4
Dependent Claim
40 words
The process according to claim 2 wherein, prior to provision of said resist on said substrate, said substrate has thru-holes punched or drilled therein, and wherein said electroless deposition of metal is effective to metallize the surfaces of said thru-holes.
Claim 5
Dependent Claim
34 words
The process according to claim 1 wherein, prior to the depositing of catalytic species or precursors thereof on said substrate, said resist-patterned substrate is sequentially contacted with a swellant solution and an etchant solution.
Claim 6
Dependent Claim
34 words
The process according to claim 1 wherein said electroless depositing of metal on the remaining catalyzed areas of said substrate is effected by immersion of said substrate in a formaldehyde-reduced electroless copper depositing solution.
References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1991-11-01 | 1992-05-02 | 1992-11-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1995-11-01 | 1996-05-02 | 1996-11-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1999-11-01 | 2000-05-02 | 2000-11-01 | $7700.00 | Window Closed / Lapsed |