Patent US4684975A successfully refreshed from Google Patents.
US4684975A
Expired / Lapsed
US
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Molded semiconductor package having improved heat dissipation
Assignee: National Semiconductor Corp
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Filing: 1985-12-16
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Granted: 1987-08-04
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Expires: 2005-12-16
Abstract
Abstract An improved metal tape for tape automated bonding provides for enhanced heat dissipation from the packaged semiconductor device. The invention includes two aspects. In the first aspect, individual metal tape leads are extended inward beyond the peripheral bonding pads of the semiconductor and over the active region of the semiconductor device. In this way, the leads are able to conduct heat away from the active region of the device. The second aspect of the invention relates to improved heat dissipation through the individual leads. The leads are flared or otherwise increased in area in the direction away from the active region of the semiconductor device to prove the radiative dissipation.
Inventors
- 👤 Hem P. Takiar
- 👤 Kamal N. Mehta
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 12:25
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/701; H10W70/00; H10W70/40; H10W70/461; H10W72/071; H10W72/077
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
66 words
A semiconductor package having enhanced heat dissipation, said package comprising an encapsulated semiconductor device having a plurality of bonding pads arranged around its periphery and metal tape leads bonded to said bonding pads, wherein said metal tape leads extend inward from the bonding pads and over central active regions on the semiconductor device, whereby said leads are able to conduct heat outward from the central regions.
Claim 2
Dependent Claim
66 words
A semiconductor package having enhanced heat dissipation, said package comprising an encapsulated semiconductor device having a plurality of bonding pads arranged around its periphery and metal tape leads bonded to said bonding pads, wherein said metal tape leads extend inward from the bonding pads and over central active regions on the semiconductor device, whereby said leads are able to conduct heat outward from the central regions.
Claim 3
Dependent Claim
19 words
A semiconductor package as in claim 1, wherein the metal tape leads extend beyond the encapsulation of the device.
Claim 4
Dependent Claim
22 words
A semiconductor package as in claim 1, wherein the metal tape leads are bonded to a metal lead frame within the encapsulation.
Claim 5
Dependent Claim
33 words
A semiconductor package as in claim 1, wherein at least some of the metal tape leads are flared in the direction away from the semiconductor device to improve heat dissipation from the device.
Claim 6
Dependent Claim
14 words
A semiconductor package as in claim 1, wherein said metal tape is flat tape.
Claim 7
Dependent Claim
14 words
A semiconductor package as in claim 1, wherein said metal tape is bump tape.
Claim 8
Dependent Claim
26 words
A semiconductor package as in claim 6, wherein said bump tape has bumps formed over the bonding pads and bumps formed over the central active regions.
Claim 9
Dependent Claim
24 words
A semiconductor package as in claim 1, wherein the metal tape leads are copper or copper plated with gold, nickel, tin, or combinations thereof.
References Cited (Backward Citations)
US3544857A
Cited
JPS5240062A
Cited
JPS5382168A
Cited
JPS53133371A
Cited
US4326238A
Cited
JPS5548951A
Cited
US4308339A
Cited
US4330790A
Cited
US4355463A
Cited
US4470507A
Cited
US4312926A
Cited
US4331740A
Cited
US4396936A
Cited
US4380042A
Cited
JPS5882552A
Cited
JPS58143558A
Cited
US4466183A
Cited
JPS601838A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1990-08-03 | 1991-02-02 | 1991-08-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1994-08-03 | 1995-02-02 | 1995-08-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1998-08-03 | 1999-02-02 | 1999-08-04 | $7700.00 | Window Closed / Lapsed |