US4331740A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Gang bonding interconnect tape process and structure for semiconductor device automatic assembly
Assignee: National Semiconductor Corp
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Filing: 1980-04-14
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Granted: 1982-05-25
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Expires: 2000-04-14
Abstract
Abstract A continuous tape is employed in the automatic assembly of semiconductor devices. The tape contains a sequential series of patterns, each one comprising a plurality of metal fingers. Each pattern includes fingers having an inward extension that terminates in a configuration that mates with the contact pattern of the semiconductor device. Desirably these fingers are thermocompression gang bonded to the semiconductor contact pads. This attaches the semiconductor device to the tape for further processing. In one assembly method the fingers have an outward extending portion that is designed for bonding to a secondary structure such as a lead frame destined to become part of the final housing. The fingers in the pattern are joined together by means of a ring located at or near the point at which they are bonded to the lead frame. After the lead frame bonds are achieved, preferably by thermocompression gang bonding, the ring is severed at locations between the fingers. If desired, the ring structure can be weakened at those points where it is to be severed.
Inventors
- 👤 Carmen D. Burns
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 14:21
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/421; H10W72/00; H10W72/701; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121; Y10T428/00; Y10T428/12; Y10T428/12188; Y10T428/12194
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
86 words
A tape for the automatic assembly of semiconductor devices having a bonding pad array that is to be interconnected with elements of a secondary lead array, said tape including a plurality of sequential metal finger patterns comprising: inwardly extending portions that form an array that mates with said bonding pad array; outwardly extending portions that form an array that mates with said secondary lead array; and a metal ring joining said fingers together to form a unitary structure, said ring including weakened points between said fingers.
Claim 2
Dependent Claim
86 words
A tape for the automatic assembly of semiconductor devices having a bonding pad array that is to be interconnected with elements of a secondary lead array, said tape including a plurality of sequential metal finger patterns comprising: inwardly extending portions that form an array that mates with said bonding pad array; outwardly extending portions that form an array that mates with said secondary lead array; and a metal ring joining said fingers together to form a unitary structure, said ring including weakened points between said fingers.
Claim 3
Dependent Claim
27 words
The tape of claim 1 where said ring is located on said fingers at the point where they are to be bonded to said secondary lead array.
Claim 4
Dependent Claim
30 words
The tape of claim 1 wherein said ring is located on said fingers at a point inside the point where they are to be bonded to said secondary lead array.
Claim 5
Dependent Claim
11 words
The tape of claim 1 in combination with said semiconductor device.
Claim 6
Dependent Claim
12 words
The tape of claim 4 in combination with said secondary lead array.
Claim 7
Dependent Claim
155 words
A tape process for assembling semiconductor devices wherein said tape includes a series of sequential metal finger patterns, each pattern including a plurality of fingers extending inwardly to form an array that mates with the contact pattern of a semiconductor device, said fingers also extending outwardly to form an array that mates with a secondary lead pattern that will serve to connect said semiconductor device to external circuitry, said process including the steps of: forming a ring of metal integral with said fingers to join said fingers into a unitary structure; thinning said ring at points intermediate between said fingers; bonding said fingers to said semiconductor device; excising said fingers from said tape at a location outside said ring; bonding said fingers to said secondary lead pattern; then severing said ring at said thinned points between said fingers; and lastly, encapsulating said semiconductor device along with said fingers and portions of said secondary lead pattern.
Claim 8
Dependent Claim
155 words
A tape process for assembling semiconductor devices wherein said tape includes a series of sequential metal finger patterns, each pattern including a plurality of fingers extending inwardly to form an array that mates with the contact pattern of a semiconductor device, said fingers also extending outwardly to form an array that mates with a secondary lead pattern that will serve to connect said semiconductor device to external circuitry, said process including the steps of: forming a ring of metal integral with said fingers to join said fingers into a unitary structure; thinning said ring at points intermediate between said fingers; bonding said fingers to said semiconductor device; excising said fingers from said tape at a location outside said ring; bonding said fingers to said secondary lead pattern; then severing said ring at said thinned points between said fingers; and lastly, encapsulating said semiconductor device along with said fingers and portions of said secondary lead pattern.
Claim 9
Dependent Claim
13 words
The process of claim 1 wherein said tape is of all metal construction.
Claim 10
Dependent Claim
25 words
The process of claim 6 wherein said tape is of composite construction including an insulating backing with metal portions including said finger patterns located thereon.
Claim 11
Dependent Claim
31 words
The process of claim 6 wherein said severing is achieved by pressing a knife blade against said ring and using said secondary lead pattern as a backing for said knife blade.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1985-05-24 | 1985-11-23 | 1986-05-25 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1989-05-24 | 1989-11-23 | 1990-05-25 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1993-05-24 | 1993-11-23 | 1994-05-25 | $7700.00 | Window Closed / Lapsed |