Ic package

Abstract

Abstract PURPOSE: To increase heat-discharge efficiency without lowering packaging efficiency, by providing hollows on a cover which covers a package enclosing a semiconductor chip, and establishing heat-discharge plates in situ. CONSTITUTION: IC chip 4 is fixed in the center of base 1 of a package having many package pins 2 on the outside of both ends. Cover 7 is placed on this and covers the entire structure. In this structure, cover 7 is made of epoxy resin, hollows 3 are provided on both sides of chip 4. Heat-discharge plates 5 are provided inside. Metal plates 6 are placed between chip 4 and each heat-discharge plate 5. By this, it is possible to discharge heat produced in package 1 efficiently. Thus heat-discharge efficiency is increased without lowering packaging efficiency. COPYRIGHT: (C)1980,JPO&Japio

Inventors

• 👤 Kiyoshi Hayamizu

Bibliographic Details