Integrated circuit packaging process

Claim 1

In a process for tape automatic assembly of integrated circuits, including the steps of forming a metal assembly tape having a succession of metal finger patterns, each pattern having a plurality metal fingers that extend inwardly to form an array that mates with the bonding pads on an integrated circuit chip and that extend outwardly of said bonding pads to form package leads that will act to provide mechanical mounting as well as electrical contact means for said integrated circuit chip bonding said integrated circuit chip to said inwardly extending fingers so that said chip becomes a part of said metal assembly tape, applying packaging means to said assembly tape for encapsulating said integrated circuit chip and the inwardly extending portions of said metal fingers so that said outwardly extending portions extend beyond said packaging means, testing said encapsulated integrated circuit while attached to the tape, and finally excising said integrated circuit from said tape whereby said integrated circuit can be mounted in final form, the improvement comprising: applying a strip of insulating material to the outer ends of said metal finger patterns prior to excising said integrated circuits from said tape whereby said package leads are held in position during subsequent testing, processing, and handling.