Abstract A plastic encapsulation of the chip carrier type for a semiconductor integrated circuit is described. The package includes a lead frame member formed from a continuous metal tape which permits reel-to-reel automatic processing. The lead frame member provides the entire means for connecting from electrodes on the active or front surface of the semiconductor chip to contact members external to the encapsulation. The lead frame member also includes integral backside contact members providing electrical and thermal contact to the back surface of the semiconductor chip. The backside contact members similarly are integral with contact members external to the encapsulation. The interconnected structure including the lead frame member and semiconductor chip is housed in a molded plastic encapsulation. The package is capable of very small dimensions and is adapted for a high degree of automatic fabrication, including handling in stick-type magazines for subsequent operations such as testing, aging, and assembly.
An encapsulation containing a semiconductor integrated circuit chip, said chip having front and back sides, at least said front side having electrodes thereon, the encapsulation comprising a molded plastic body member encompassing the semiconductor chip, characterized in that the encapsulation includes unitary lead members for providing interconnection between electrodes on the chip and terminals external to the encapsulation, a first group of said lead members each having a termination internal to the encapsulation in contact with electrodes on the front side of the chip, a second group of said lead members, separate from said first group, which have terminations internal to the encapsulation comprising not more than four large area tab members, each of which contacts about 20 percent of the backside of said chip.
Claim 2
Dependent Claim
125 words
An encapsulation containing a semiconductor integrated circuit chip, said chip having front and back sides, at least said front side having electrodes thereon, the encapsulation comprising a molded plastic body member encompassing the semiconductor chip, characterized in that the encapsulation includes unitary lead members for providing interconnection between electrodes on the chip and terminals external to the encapsulation, a first group of said lead members each having a termination internal to the encapsulation in contact with electrodes on the front side of the chip, a second group of said lead members, separate from said first group, which have terminations internal to the encapsulation comprising not more than four large area tab members, each of which contacts about 20 percent of the backside of said chip.
Claim 3
Dependent Claim
35 words
An encapsulation in accordance with claim 1 characterized in that the encapsulation is rectilinear in configuration, and each pair of external terminations adjacent each corner are connected to one of said large area tab members.
Claim 4
Dependent Claim
27 words
An encapsulation in accordance with claim 2 characterized in that the corner portions of said molded plastic body project further from the body than the external terminations.