Patent US4633573A successfully refreshed from Google Patents.
US4633573A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Microcircuit package and sealing method
Assignee: Aegis Inc
•
Filing: 1984-05-23
•
Granted: 1987-01-06
•
Expires: 2004-05-23
Abstract
Abstract A microcircuit package and sealing method in which a non-organic coating is used to hermetically seal the microcircuit. The microcircuit is isolated and insulated in order to protect the microcircuit from the high temperatures required to apply and cure a non-organic coating. The materials and methods used to isolate and insulate the microcircuit are chosen so that the thermal coefficients of the materials are complementary and thus form a highly reliable, durable seal, while also insulating the microcircuit during the process of applying the non-organic coating.
Inventors
- 👤 Jeremy D. Scherer
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 01:43
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/10; H10W76/12; H10W76/15; H10W76/157; H10W76/60; H10W95/00; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W70/682; H10W70/685; H10W72/00; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/851; H10W72/874; H10W72/884; H10W74/00; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49146
Claims Analysis
Total Claims: 24
Claim 1
Independent Claim
116 words
The method of hermetically sealing a microcircuit mounted on a package having a continuous perimeter sealing surface of random shape independent of the hermetic seal to be applied comprising the steps of: isolating the microcircuit and insulating the microcircuit to protect it from contamination and heat by forming a thermal barrier over the microcircuit sufficient to prevent the microcircuit from being damaged by the heat of applying a non-organic coating over the thermal barrier; and hermetically sealing the microcircuit by applying a non-organic coating over the thermal barrier whereby the non-organic coating overlaps the continuous perimeter sealing surface so that the non-organic coating fuses to the sealing surface in order to hermetically seal the microcircuit package.
Claim 2
Independent Claim
116 words
The method of hermetically sealing a microcircuit mounted on a package having a continuous perimeter sealing surface of random shape independent of the hermetic seal to be applied comprising the steps of: isolating the microcircuit and insulating the microcircuit to protect it from contamination and heat by forming a thermal barrier over the microcircuit sufficient to prevent the microcircuit from being damaged by the heat of applying a non-organic coating over the thermal barrier; and hermetically sealing the microcircuit by applying a non-organic coating over the thermal barrier whereby the non-organic coating overlaps the continuous perimeter sealing surface so that the non-organic coating fuses to the sealing surface in order to hermetically seal the microcircuit package.
Claim 3
Dependent Claim
30 words
The method of claim 1 wherein the steps of isolating and insulating the microcircuit comprise encapsulating the microcircuit in an encapsulating coating and applying a protective layer over said coating.
Claim 4
Dependent Claim
13 words
The method of claim 2 wherein said protective layer is a ceramic material.
Claim 5
Dependent Claim
22 words
The method of claim 3 wherein the thermal coefficients of the encapsulating coating, the protective layer, and the non-organic coating are complementary.
Claim 6
Dependent Claim
29 words
The method of claim 4 wherein said encapsulating coating can withstand temperatures of at least 390° F. and said ceramic material can withstand temperatures of at least 3000° F.
Claim 7
Dependent Claim
22 words
The method of claim 1 wherein the step of applying a non-organic coating comprises spraying said non-organic coating in an inert atmosphere.
Claim 8
Dependent Claim
21 words
The method of claim 1 wherein the step of applying a non-organic coating comprises an evaporating deposition of the non-organic coating.
Claim 9
Dependent Claim
21 words
The method of claim 1 wherein the step of applying a non-organic coating comprises an electroplating deposition of the non-organic coating.
Claim 10
Dependent Claim
28 words
The method of claim 1 wherein the step of hermetically sealing the microcircuit comprises bonding the non-organic coating to a seal ring defining the continuous perimeter sealing surface.
Claim 11
Dependent Claim
29 words
The method of claim 1 wherein the steps of isolating and insulating the microcircuit comprises forming a cavity over the microcircuit thus providing an atmosphere space over the microcircuit.
Claim 12
Dependent Claim
20 words
The method of claim 10 wherein the step of forming a cavity comprises fastening a ceramic spacer over the microcircuit.
Claim 13
Dependent Claim
44 words
The method of claim 1, 3 or 11 further comprising the step of metallizing said sealing surface and wherein said non-organic coating is a metal, and wherein the step of hermetically sealing the microcircuit comprises bonding the metal coating to said metallized sealing surface.
Claim 14
Dependent Claim
38 words
The method of claim 1, 3 or 11 wherein said non-organic coating is a glass, and wherein the step of hermetically sealing the microcircuit comprises applying the glass coating to a continuous perimeter sealing surface of the package.
Claim 15
Independent Claim
92 words
A method of hermetically sealing a microcircuit mounted in a cavity on a microcircuit package, comprising the steps of: providing a continuous perimeter sealing surface of random shape independent of the hermetic seal to be applied around the cavity; forming a thermal barrier over said microcircuit by covering said microcircuit with at least one protective layer; applying a non-organic sealing material on top of said protective layer so that said non-organic sealing material overlaps and fuses to said sealing surface and thereby forms a hermetic seal on said continuous perimeter sealing surface.
Claim 16
Independent Claim
92 words
A method of hermetically sealing a microcircuit mounted in a cavity on a microcircuit package, comprising the steps of: providing a continuous perimeter sealing surface of random shape independent of the hermetic seal to be applied around the cavity; forming a thermal barrier over said microcircuit by covering said microcircuit with at least one protective layer; applying a non-organic sealing material on top of said protective layer so that said non-organic sealing material overlaps and fuses to said sealing surface and thereby forms a hermetic seal on said continuous perimeter sealing surface.
Claim 17
Dependent Claim
54 words
The method of claim 14 further comprising the step of metallizing said continuous perimeter sealing surface and wherein said non-organic sealing material is a metal, said protective layer is a ceramic material, and further comprising the step of transporting said microcircuit in an inert atmosphere on a conveyor which acts as a heat sink.
Claim 18
Dependent Claim
41 words
The method of claim 14 wherein said sealing material is a glass, said protective layer is a ceramic material, and further comprising the step of transporting said microcircuit in an inert atmosphere on a conveyor which acts as a heat sink.
Claim 19
Dependent Claim
21 words
The method of claim 15 or 16 wherein said inert atmosphere is nitrogen, helium, or a mixture of nitrogen and helium.
Claim 20
Dependent Claim
23 words
The method of claim 14, 15 or 16 further comprising the step of encapsulating the microcircuit in a coating which fills the cavity.
Claim 21
Independent Claim
175 words
The method of hermetically sealing a microcircuit package comprising: (a) connecting a microcircuit in a cavity of a microcircuit package having electrical leads so that a complete electrical circuit is obtained between the microcircuit and the electrical leads; (b) providing a continuous perimeter sealing surface of random shape on the microcircuit package; (c) forming a thermal barrier over the microcircuit by encapsulating the microcircuit in a coating, which is applied and cured at a temperature which will not damage the microcircuit, in order to isolate and insulate the microcircuit; (d) covering the encapsulated microcircuit with a material, which may be applied and cured at a temperature which will not damage the microcircuit, said material further insulating the microcircuit; and (e) transporting the package on a conveyor having enough thermal mass to act as a heat sink past a series of sprayers which spray a non-organic coating over the cavity and surrounding continuous perimeter sealing surface so that the non-organic coating and the sealing surface fuse together to form a hermetic seal for the microcircuit package.
Claim 22
Independent Claim
175 words
The method of hermetically sealing a microcircuit package comprising: (a) connecting a microcircuit in a cavity of a microcircuit package having electrical leads so that a complete electrical circuit is obtained between the microcircuit and the electrical leads; (b) providing a continuous perimeter sealing surface of random shape on the microcircuit package; (c) forming a thermal barrier over the microcircuit by encapsulating the microcircuit in a coating, which is applied and cured at a temperature which will not damage the microcircuit, in order to isolate and insulate the microcircuit; (d) covering the encapsulated microcircuit with a material, which may be applied and cured at a temperature which will not damage the microcircuit, said material further insulating the microcircuit; and (e) transporting the package on a conveyor having enough thermal mass to act as a heat sink past a series of sprayers which spray a non-organic coating over the cavity and surrounding continuous perimeter sealing surface so that the non-organic coating and the sealing surface fuse together to form a hermetic seal for the microcircuit package.
Claim 23
Independent Claim
136 words
The method of hermetically sealing a microcircuit package comprising: (a) connecting a microcircuit in a cavity of a microcircuit package having electrical leads so that a complete electrical circuit is obtained between the microcircuit and the electrical leads; (b) providing a continuous perimeter sealing surface of random shape on the microcircuit package; (c) forming a thermal barrier over the microcircuit by bonding a spacer in the microcircuit package to form an atmosphere space over the microcircuit to insulate the microcircuit; (d) transporting the package on a conveyor having enough thermal mass to act as a heat sink past a series of sprayers which spray a non-organic coating over the cavity and surrounding continuous perimeter sealing surface so that the non-organic coating and the sealing surface fuse together to form a hermetic seal for the microcircuit package.
Claim 24
Independent Claim
136 words
The method of hermetically sealing a microcircuit package comprising: (a) connecting a microcircuit in a cavity of a microcircuit package having electrical leads so that a complete electrical circuit is obtained between the microcircuit and the electrical leads; (b) providing a continuous perimeter sealing surface of random shape on the microcircuit package; (c) forming a thermal barrier over the microcircuit by bonding a spacer in the microcircuit package to form an atmosphere space over the microcircuit to insulate the microcircuit; (d) transporting the package on a conveyor having enough thermal mass to act as a heat sink past a series of sprayers which spray a non-organic coating over the cavity and surrounding continuous perimeter sealing surface so that the non-organic coating and the sealing surface fuse together to form a hermetic seal for the microcircuit package.
References Cited (Backward Citations)
US3325586A
Cited
US3404319A
Cited
US3383568A
Cited
US3496427A
Cited
US3558993A
Cited
US3469148A
Cited
US3622419A
Cited
US3706840A
Cited
US3735211A
Cited
US3844910A
Cited
US3839660A
Cited
US3981074A
Cited
US4012579A
Cited
US4017340A
Cited
US4198444A
Cited
US4035526A
Cited
US4157611A
Cited
DE2619433A1
Cited
US4143456A
Cited
US4079511A
Cited
US4250347A
Cited
US4183135A
Cited
US4230901A
Cited
US4218701A
Cited
US4300184A
Cited
JPS5652857A
Cited
GB2067013A
Cited
US4331253A
Cited
US4330790A
Cited
JPS5792851A
Cited
US4331258A
Cited
US4410564A
Cited
JPS5886750A
Cited
JPS58176956A
Cited
JPS58199543A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1990-01-05 | 1990-07-07 | 1991-01-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1994-01-05 | 1994-07-07 | 1995-01-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1998-01-05 | 1998-07-07 | 1999-01-06 | $7700.00 | Window Closed / Lapsed |