US4183135A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Hermetic glass encapsulation for semiconductor die and method
Assignee: Motorola Solutions Inc
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Filing: 1978-10-13
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Granted: 1980-01-15
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Expires: 1998-10-13
Abstract
Abstract A semiconductor die having bump type contact areas thereon with film strip leads bonded thereto and fired glass encapsulating only the active side of the die and the bump contact areas. The method of encapsulation includes bonding the film strip leads to the bumps of the die, coating the bumps and active area with unfired glass and firing the glass at a temperature generally below 450° C. The method also includes bonding the film strip leads to the bumps and firing the glass simultaneously or firing the glass and remelting glass covering the bumps to bond the leads to the bumps through the fired glass.
Inventors
- 👤 John R. Welling
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 10:08
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/453; H10W72/00; H10W72/30; H10W74/00; H10W74/01; H10W74/10; H10W74/111; H10W74/131; H10W72/071; H10W72/073; H10W72/07331; H10W72/07336; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121
Claims Analysis
Total Claims: 3
Claim 1
Independent Claim
120 words
A method of hermetically sealing a semiconductor die comprising the steps of: (a) providing a semiconductor die having a plurality of contact pads thereon for receiving external leads in electrical connection therewith; (b) providing means having a plurality of inwardly directed leads formed as an integral portion thereof with the inner ends of said leads positioned to match, or mate, with the contact pads; (c) coating the die and contact pads with an unfired glass; and (d) positioning and bonding the leads of said means in mating engagement with the contact pads of the die and utilizing sufficient heat to fire the glass coating to form it into a solid mass encapsulating and hermetically sealing the die and lead bonds.
Claim 2
Independent Claim
120 words
A method of hermetically sealing a semiconductor die comprising the steps of: (a) providing a semiconductor die having a plurality of contact pads thereon for receiving external leads in electrical connection therewith; (b) providing means having a plurality of inwardly directed leads formed as an integral portion thereof with the inner ends of said leads positioned to match, or mate, with the contact pads; (c) coating the die and contact pads with an unfired glass; and (d) positioning and bonding the leads of said means in mating engagement with the contact pads of the die and utilizing sufficient heat to fire the glass coating to form it into a solid mass encapsulating and hermetically sealing the die and lead bonds.
Claim 3
Dependent Claim
22 words
A method as claimed in claim 1 wherein the first step includes providing a semiconductor die with bumps at the contact pads.
References Cited (Backward Citations)
US3303399A
Cited
US3825442A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1983-01-14 | 1983-07-16 | 1984-01-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1987-01-14 | 1987-07-16 | 1988-01-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1991-01-14 | 1991-07-16 | 1992-01-15 | $7700.00 | Window Closed / Lapsed |