US4331253A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Lid assembly for hermetic sealing of a semiconductor chip
Assignee: SEMICONDUCTOR PACKAGING MATERIALS Co INC A CORP OF NY
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Filing: 1981-03-13
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Granted: 1982-05-25
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Expires: 2001-03-13
Abstract
Abstract A lid assembly includes an integral heat fusible layer defining a hermetic sealing area provided around the periphery of a lid for hermetic sealing semiconductor chips in a flat pack. The integral heat fusible layer includes a flowed solderable layer in the hermetic sealing area.
Inventors
- 👤 Richard Gordon
- 👤 John G. Ciallella
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 00:18
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/10; H10W76/12; H10W76/15; H10W76/157; H10W76/60
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
39 words
A lid assembly for hermetic sealing of a package containing a semiconductor chip comprising: a lid of metallic material including a single integral heat fusible layer deposited on said lid in a peripheral region defining a hermetic sealing area.
Claim 2
Dependent Claim
39 words
A lid assembly for hermetic sealing of a package containing a semiconductor chip comprising: a lid of metallic material including a single integral heat fusible layer deposited on said lid in a peripheral region defining a hermetic sealing area.
Claim 3
Dependent Claim
24 words
The lid assembly as set forth in claim 1 wherein said integral heat fusible layer includes a solderable heat fusible layer in registration therewith.
Claim 4
Dependent Claim
22 words
The lid assembly as set forth in claim 2 wherein said solderable layer is provided as a fired printed heat fusible layer.
Claim 5
Dependent Claim
21 words
The lid assembly as set forth in claim 2 wherein said solderable layer includes a preform of solderable alloy flowed thereto.
Claim 6
Dependent Claim
17 words
The lid assembly as set forth in claim 2 wherein said lid includes a corrosion inhibiting layer.
Claim 7
Dependent Claim
37 words
A lid assembly for hermetic sealing of a package containing a semiconnector chip comprising a metallic lid and a single solderable heat fusible layer deposited on said lid in a peripheral region defining a hermetic sealing area.
Claim 8
Dependent Claim
37 words
A lid assembly for hermetic sealing of a package containing a semiconnector chip comprising a metallic lid and a single solderable heat fusible layer deposited on said lid in a peripheral region defining a hermetic sealing area.
Claim 9
Dependent Claim
17 words
The lid assembly as set forth in claim 6 wherein said lid includes a corrosion inhibiting layer.
Claim 10
Dependent Claim
29 words
The lid assembly as set forth in claim 6 wherein said solderable layer includes a fired printed heat fusible layer or a heat fusible preform of solder alloy composition.
Claim 11
Dependent Claim
21 words
The lid assembly as set forth in claim 6 wherein said solderable layer is a composition of lead, tin and silver.
Claim 12
Independent Claim
50 words
A method of fabricating a lid assembly for hermetic sealing of a package containing a semiconductor chip comprising the steps of depositing an integral heat fusible layer around the periphery of the surface of a lid to define a hermetic sealing area and flowing said integral heat fusible layer thereto.
Claim 13
Independent Claim
50 words
A method of fabricating a lid assembly for hermetic sealing of a package containing a semiconductor chip comprising the steps of depositing an integral heat fusible layer around the periphery of the surface of a lid to define a hermetic sealing area and flowing said integral heat fusible layer thereto.
Claim 14
Dependent Claim
35 words
The method as set forth in claim 10 wherein said depositing an integral heat fusible layer includes depositing a heat fusible preform of a solderable alloy around the periphery of the surface of said lid.
Claim 15
Dependent Claim
25 words
The method as set forth in claim 10 further including depositing a corrosion inhibiting layer on said lid prior to depositing said heat fusible layer.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1985-05-24 | 1985-11-23 | 1986-05-25 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1989-05-24 | 1989-11-23 | 1990-05-25 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1993-05-24 | 1993-11-23 | 1994-05-25 | $7700.00 | Window Closed / Lapsed |