US4630355A
Expired / Lapsed
US
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Electric circuits having repairable circuit lines and method of making the same
Assignee: Energy Conversion Devices Inc
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Filing: 1985-03-08
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Granted: 1986-12-23
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Expires: 2005-03-08
Abstract
Abstract Circuit assemblies are disclosed which include a supporting substrate, a plurality of conductive lines supported on the substrate and a deposited phase-change material capable of an energy induced phase change from an initially high resistance state to a relatively low resistance state placed in electrical contact with the conductive lines. The assemblies also include contact receiving means connected to the conductive lines at preselected discrete locations to receive externally applied contact means, such as electric probes, for applying voltages across selected portions of the conductive lines. The application of such voltages can induce a phase change in portions of the phase-change material which bridge breaks in the conductive lines of such circuit subassemblies, changing such portions from their high resistance state to their low resistance state, thereby forming electrically shunting conductive paths around such open circuits. There are also disclosed methods of making such circuit assemblies.
Inventors
- 👤 Robert R. Johnson
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 19:49
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/611; H05; H05K; H05K1/00; H05K1/02; H05K1/0286; H05K1/0293; H10W70/62; H10W70/641; H10W72/00; H10W72/90; G; G02; G02F; G02F1/00; G02F1/01; G02F1/13; G02F1/133; G02F1/136; G02F1/1362; G02F1/136259; G02F1/136263; H05K2203/00; H05K2203/10; H05K2203/105; H05K2203/17; H05K2203/173; H05K3/00; H05K3/22; H05K3/225; Y; Y10; Y10S; Y10S148/00; Y10S148/055; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49004; Y10T29/49117; Y10T29/49124
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
184 words
A method of making a circuit assembly comprising: providing a supporting substrate; forming a plurality of conductive lines supported on said substrate to interconnect circuit elements supported or to be supported on said substrate; forming a deposited phase-change material capable of being changed from an intially relatively disordered, relatively high resistance state to a more ordered, more crystalline relatively low resistance state by the application of sufficient energy, said deposited phase-change material being located in electrical contact with at least portions of said conductive lines to form electrically parallel paths between selected portions of said conductive lines; detecting at least one open circuit portion in one of said conductive lines within at least one of said selected portions; and applying sufficient energy to said phase-change material within said at least one selected portions of said conductive line having said detected open circuit portion to cause the inducement of a phase change within said phase-change material from said initially high resistance state to said low resistance state to form an electrically shunting conductive path around said detected open circuit portion of said one conductive line.
Claim 2
Independent Claim
184 words
A method of making a circuit assembly comprising: providing a supporting substrate; forming a plurality of conductive lines supported on said substrate to interconnect circuit elements supported or to be supported on said substrate; forming a deposited phase-change material capable of being changed from an intially relatively disordered, relatively high resistance state to a more ordered, more crystalline relatively low resistance state by the application of sufficient energy, said deposited phase-change material being located in electrical contact with at least portions of said conductive lines to form electrically parallel paths between selected portions of said conductive lines; detecting at least one open circuit portion in one of said conductive lines within at least one of said selected portions; and applying sufficient energy to said phase-change material within said at least one selected portions of said conductive line having said detected open circuit portion to cause the inducement of a phase change within said phase-change material from said initially high resistance state to said low resistance state to form an electrically shunting conductive path around said detected open circuit portion of said one conductive line.
Claim 3
Dependent Claim
38 words
A method of making a circuit assembly as defined in claim 1, including the further step of forming contact receiving means positioned on said conductive lines to enable the application of said sufficient energy to said phase-change material.
Claim 4
Dependent Claim
29 words
A method of making a circuit assembly as defined in claim 1, wherein said forming of a deposited phase-change material includes depositing said phase-change material on said conductive lines.
Claim 5
Dependent Claim
28 words
A method of making a circuit assembly as defined in claim 1, wherein said forming of said conductive lines includes forming said conductive lines on said phase-change material.
Claim 6
Dependent Claim
18 words
A method of making a circuit assembly as defined in claim 1, wherein said phase-change material includes silicon.
Claim 7
Dependent Claim
20 words
A method of making a circuit assembly as defined in claim 1, wherein said phase-change material includes a chalcogenide element.
Claim 8
Dependent Claim
74 words
A method of making a circuit assembly as defined in claim 1, for use in a display of the type having at least one pixel each having circuit elements associated with said pixel, including a pair of electrodes with light influencing material disposed between said electrodes, wherein said forming of said conductive lines includes forming said conductive lines to connect to circuit elements associated with the individual pixels of such a liquid crystal display.
Claim 9
Dependent Claim
92 words
A method of making a circuit assembly as defined in claim 1 for use in an electronic matrix having a plurality of first spaced apart address lines, a plurality of second spaced apart address lines forming a plurality of cross over points with said first address lines, and selection means between each of said cross over points for establishing selectable current paths through respective pairs of said first and second address lines, wherein said forming of said conductive lines includes forming said conductive lines as address lines of said electronic matrix array.
Claim 10
Dependent Claim
41 words
A method of making a circuit assembly as defined in claim 8, wherein said forming of said phase-change material includes forming a layer of phase-change semiconductor material which forms part of said selection means between each of said cross over points.
Claim 11
Dependent Claim
60 words
A method as defined in claim 1, wherein said applying of said sufficient energy includes applying a sufficient voltage to said one conductive line and across said open circuit portion to cause sufficient current to flow through said phase-change material so as to switch that part of said phase-change material bridging said open circuit portion to said low resistance state.
Claim 12
Dependent Claim
37 words
A method as defined in claim 1, wherein said applying of said sufficient energy includes applying sufficient radiant energy to said phase-change material bridging said open circuit portion to switch that part to said low resistance state.
Claim 13
Dependent Claim
24 words
A method as defined in claim 11, wherein said applying of said radiant energy includes using a laser beam to apply said radiant energy.
Claim 14
Independent Claim
221 words
A method of making a packaged circuit assembly comprising: (a) forming an integrated circuit which includes: providing a supporting substrate; forming a plurality of conductive lines supported on said substrate to interconnect circuit element supported on said substrate; forming a deposited phase-change material capable of electrically induced phase-change from an initially relatively disordered, relatively high resistance state to a more ordered, more crystalline, relatively low resistance state, said deposited phase-change material being located in electrical contact with at least portions of said conductive lines to form electrically parallel paths between selected portions of said conductive lines; and (b) forming packaging means enclosing said integrated circuit; and (c) forming connection means coupled to said conductive lines and extending from said integrated circuit, through said packaging means, and having a portion external to said packaging means, detecting open circuit portions within said conductive lines between said external portions of said connection means, and applying voltages to said external portions of said connection means associated with said detected open circuit line portions to thereby apply said voltages between selected portions of said conducitve lines and said phase-change material to permit the electrical inducement of a phase-change therein from said initially high resistance state to said low resistance state to from electrically shunting conductive paths around said detected open circuit portions of said conductive lines.
Claim 15
Independent Claim
221 words
A method of making a packaged circuit assembly comprising: (a) forming an integrated circuit which includes: providing a supporting substrate; forming a plurality of conductive lines supported on said substrate to interconnect circuit element supported on said substrate; forming a deposited phase-change material capable of electrically induced phase-change from an initially relatively disordered, relatively high resistance state to a more ordered, more crystalline, relatively low resistance state, said deposited phase-change material being located in electrical contact with at least portions of said conductive lines to form electrically parallel paths between selected portions of said conductive lines; and (b) forming packaging means enclosing said integrated circuit; and (c) forming connection means coupled to said conductive lines and extending from said integrated circuit, through said packaging means, and having a portion external to said packaging means, detecting open circuit portions within said conductive lines between said external portions of said connection means, and applying voltages to said external portions of said connection means associated with said detected open circuit line portions to thereby apply said voltages between selected portions of said conducitve lines and said phase-change material to permit the electrical inducement of a phase-change therein from said initially high resistance state to said low resistance state to from electrically shunting conductive paths around said detected open circuit portions of said conductive lines.
Claim 16
Dependent Claim
30 words
A method of making a packaged circuit assembly as defined in claim 13, wherein said forming of a deposited phase-change material includes depositing said phase-change material on said conductive lines.
Claim 17
Dependent Claim
29 words
A method of making a packaged circuit assembly as defined in claim 13, wherein said forming of said conductive lines includes forming said conductive lines on said phase-change material.
Claim 18
Dependent Claim
19 words
A method of making a packaged circuit assembly as defined in claim 13, wherein said phase-change material includes silicon.
Claim 19
Dependent Claim
21 words
A method of making a packaged circuit assembly as defined in claim 13, wherein said phase-change material includes a chalcogenide element.
Claim 20
Dependent Claim
75 words
A method of making a packaged circuit assembly as defined in claim 13 for use in a display of the type having at least one pixel each having circuit elements associated with said pixel, including a pair of electrode with light influencing material disposed between said electrodes, wherein said forming of said conductive lines includes forming said conductive lines to connect to circuit elements associated with the individual pixels of such a liquid crystal display.
Claim 21
Dependent Claim
94 words
A method of making a packaged circuit assembly as defined in claim 13 for use in an electronic matrix array having a plurality of first spaced apart address lines, a plurality of second spaced apart address lines forming a plurality of cross over points with said first address lines, and selection means between each of said cross over points for establishing selectable current paths through respective pairs of said first and second address lines, wherein said forming of said conductive lines includes forming said conductive lines as address lines of said electronic matrix array.
Claim 22
Dependent Claim
42 words
A method of making a packaged circuit assembly as defined in claim 19, wherein said forming of said phase-change material includes forming a layer of phase-change semiconductor material which forms part of said selection means between each of said cross over points.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1989-12-22 | 1990-06-23 | 1990-12-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1993-12-22 | 1994-06-23 | 1994-12-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1997-12-22 | 1998-06-23 | 1998-12-23 | $7700.00 | Window Closed / Lapsed |