Process for fabricating CMOS devices with self-aligned channel stops

Claim 2

A process for fabricating CMOS devices formed on a semiconductor substrate provided with n-channel and p-channel regions of n- and p-type conductivity, respectively, which includes forming source, drain and gate portions in said regions and making electrical contacts to said portions, wherein the improvement comprises forming self-aligned channel stops between regions of the same conductivity and between regions of the opposite conductivity by (a) forming a mask overlying and aligned with a number of said regions; (b) implanting a number of first channel stops and well regions of one conductivity type; (c) forming a layer overlying said regions; (d) removing said mask and the corresponding portion of said layer, so as to leave the remaining portion of said layer overlying and automatically aligned with a number of said regions; and (e) implanting a number of second channel stops and well regions of the opposite conductivity type.

Claim 3

The process of claim 1 in which the channel stops between regions of the opposite conductivity are mutually self-aligned.

Claim 4

A process for fabricating CMOS devices formed on a semiconductor substrate with n-channel and p-channel regions of the n- and p-type conductivity, respectively, which includes forming source, drain and gate portions in said regions and making electrical contacts to said portions, wherein the improvement comprises forming self-aligned channel stops between regions of the same conductivity and between regions of the opposite conductivity by a process which includes: (a) opening windows for both n- and p-channel regions in an oxide layer formed on the semiconductor substrate so as to expose n- and p-channel regions; (b) forming a complementary mask to cover p-channel regions and channel stops by a composite resist mask and implanting ions to form n-channel regions; (c) evaporating a metal layer on both the composite resist mask and the n-channel regions; (d) lifting off those portions of the metal layer covering the composite resist mask; and (e) implanting ions to form p-channel regions and channel stops using the remaining portions of the metal layer as a mask.

Claim 5

A process for fabricating CMOS devices formed on a semiconductor substrate with n-channel and p-channel regions of the n- and p-type conductivity, respectively, which includes forming source, drain and gate portions in said regions and making electrical contacts to said portions, wherein the improvement comprises forming self-aligned channel stops between regions of the same conductivity and between regions of the opposite conductivity by a process which includes: (a) opening windows for both n- and p-channel regions in an oxide layer formed on the semiconductor substrate so as to expose n- and p-channel regions; (b) forming a complementary mask to cover p-channel regions and channel stops by a composite resist mask and implanting ions to form n-channel regions; (c) evaporating a metal layer on both the composite resist mask and the n-channel regions; (d) lifting off those portions of the metal layer covering the composite resist mask; and (e) implanting ions to form p-channel regions and channel stops using the remaining portions of the metal layer as a mask.

Claim 6

The process of claim 3 in which the complementary resist mask comprises at least two layers.

Claim 7

The process of claim 4 in which the complementary resist mask is at least about twice as thick as the metal layer.

Claim 8

The process of claim 5 in which the complementary resist mask comprises a thick layer of photoresist about 2 μm thick formed on the substrate and a thin layer of photoresist about 0.5 to 1 μm thick formed on the thick photoresist layer.

Claim 9

The process of claim 5 in which the complementary resist mask comprises a thick layer of polysilicon about 1 μm thick and a thin layer of photoresist about 0.5 to 1 μm thick formed thereon.

Claim 10

The process of claim 5 in which the complementary resist mask comprises a thick layer of photoresist about 2 μm thick formed on the substrate, a thin metal layer about 1,000 A thick formed on the thick photoresist layer and a thin photoresist layer about 0.5 to 1 μm formed on the metal layer.

Claim 11

The process of claim 3 in which the semiconductor substrate comprises silicon and the oxide layer comprises silicon dioxide.

Claim 12

The process of claim 9 in which boron atoms are implanted in the substrate to form p-wells and p + -channel stops and phosphorus atoms are implanted in the p-wells to form n-channel devices.

Claim 13

The process of claim 9 in which phosphorus atoms are implanted in the substrate to form n-wells and n + -channel stops and boron atoms are implanted in the n-wells to form p-channel devices.

Claim 14

The process of claim 3 in which the ions are implanted under conditions such that the peak distribution of atoms lies in the substrate just beneath the oxide layer.

Claim 15

The process of claim 3 in which the metal layer is formed to a thickness that is an inverse function of its density.

Claim 16

The process of claim 13 in which the metal layer comprises about 5,000 A of aluminum or about 2,500 A of gold.

Claim 17

A process for fabricating CMOS devices on a semiconductor substrate which includes: (a) forming a field oxide on the substrate; (b) opening windows in the field oxide for subsequent fabrication of both n- and p-channel devices; (c) forming a composite resist mask over the p-channel windows; (d) implanting ions to form p-wells and p + channel stops; (e) evaporating a metal layer over both the n-channel windows and the composite resist mask covering p-channel windows; (f) removing the metal layer over the composite resist mask by lift-off; and (g) implanting ions to form n-wells and n + channel stops.

Claim 18

A process for fabricating CMOS devices on a semiconductor substrate which includes: (a) forming a field oxide on the substrate; (b) opening windows in the field oxide for subsequent fabrication of both n- and p-channel devices; (c) forming a composite resist mask over the p-channel windows; (d) implanting ions to form p-wells and p + channel stops; (e) evaporating a metal layer over both the n-channel windows and the composite resist mask covering p-channel windows; (f) removing the metal layer over the composite resist mask by lift-off; and (g) implanting ions to form n-wells and n + channel stops.

Claim 19

The process of claim 15 in which the composite resist mask comprises at least two layers.

Claim 20

The process of claim 16 in which the composite resist mask is at least about twice as thick as the metal layer.

Claim 21

The process of claim 17 in which the composite resist mask comprises a thick layer of photoresist about 2 μm thick formed on the substrate and a thin layer of photoresist about 0.5 to 1 μm thick formed on the thick photoresist layer.

Claim 22

The process of claim 17 in which the composite resist mask comprises a thick layer of polysilicon about 1 μm thick and a thin layer of photoresist about 0.5 to 1 μm thick formed thereon.

Claim 23

The process of claim 17 in which the composite resist mask comprises a thick layer of photoresist about 2 μm thick formed on the substrate, a thin metal layer about 1,000 A thick formed on the thick photoresist layer and a thin photoresist layer about 0.5 to 1 μm formed on the metal layer.

Claim 24

The process of claim 15 in which the semiconductor substrate comprises silicon and the field oxide comprises silicon dioxide.

Claim 25

The process of claim 21 in which boron atoms are implanted in the substrate to form p-wells and p + -channel stops and phosphorus atoms are implanted in the p-wells to form n-channel devices.

Claim 26

The process of claim 21 in which phosphorus atoms are implanted in the substrate to form n-wells and n + -channel stops and boron atoms are implanted in the n-wells to form p-channel devices.

Claim 27

The process of claim 15 in which the ions are implanted under conditions such that the peak distribution of atoms lies in the substrate just beneath the substrate/field oxide interface.

Claim 28

The process of claim 15 in which the metal layer is formed to a thickness that is an inverse function of its density.

Claim 29

The process of claim 25 in which the metal layer comprises about 5,000 A of aluminum or about 2,500 A of gold.

Claim 30

The process of claim 15 further including (h) removing the metal layer over the n-channel windows; (i) forming a gate oxide in the n-channel and p-channel windows; (j) depositing polysilicon and diffusing n-type atoms therein; (k) defining polysilicon gates for both n-channel devices and p-channel devices and implanting p-type ions to form all source and drain regions; (l) defining n + -regions for n-channel devices and implanting n-type ions to form source and drain regions for n-channel devices by over-compensating the previously implanted p-type atoms; (m) forming contact holes; and (n) forming a desired metallization pattern.