High density CMOS process

Claim 2

On a silicon substrate which includes a first area for a first MOS device and a second spaced-apart area for a second MOS device, a process for forming channel stops of opposite conductivity type in the intermediate region between said first and second areas, comprising the steps of: forming a masking member on said substrate, said masking member protecting a portion of said intermediate region; doping the portion of said intermediate region unprotected by said masking member with a dopant of a first conductivity type to define a first channel stop; removing said masking member; doping said intermediate region with a dopant of a second conductivity type forming a second channel stop adjacent to said first channel stop; whereby adjacent full channel stops may be fabricated in alignment with each other and with said first and second areas.

Claim 3

The process as defined by claim 1 wherein said doping of said first and second channel stops is formed with ion implantation.

Claim 4

The process defined by claim 1 wherein said first and second areas are covered with silicon nitride prior to said formation of said masking member.

Claim 5

The process defined by claim 3 wherein a field oxide is formed on said substrate prior to said formation of said masking member.

Claim 6

The process defined by claim 4 including the step of forming a well region beneath said first area with ion implantation through said silicon nitride and with a drivein cycle prior to said doping of said first channel stop.

Claim 7

A process for fabricating CMOS devices on a silicon substrate comprising the steps of: defining a spaced-apart first area and second area on said substrate wherein at least the intermediate area between said first and second areas is covered with a protective layer; forming a masking member on said protective layer said masking member covering said second area and extending from said second area partway onto said intermediate area; ion implanting said first area with a dopant of a first conductivity type; removing portions of said protective layer employing said masking member as a mask, such that at least said protective layer adjacent to said first area is removed; doping said substrate adjacent to said first area with a dopant of said first conductivity type to form a first channel stop of said first conductivity type; removing at least said masking member; doping said intermediate area with a dopant of a second conductivity type thereby forming a second channel stop of said second conductivity type; fabricating active devices in said substrate at said first and second areas; whereby full channel stops are fabricated which are in alignment with one another and in alignment with said active devices.

Claim 8

A process for fabricating CMOS devices on a silicon substrate comprising the steps of: defining a spaced-apart first area and second area on said substrate wherein at least the intermediate area between said first and second areas is covered with a protective layer; forming a masking member on said protective layer said masking member covering said second area and extending from said second area partway onto said intermediate area; ion implanting said first area with a dopant of a first conductivity type; removing portions of said protective layer employing said masking member as a mask, such that at least said protective layer adjacent to said first area is removed; doping said substrate adjacent to said first area with a dopant of said first conductivity type to form a first channel stop of said first conductivity type; removing at least said masking member; doping said intermediate area with a dopant of a second conductivity type thereby forming a second channel stop of said second conductivity type; fabricating active devices in said substrate at said first and second areas; whereby full channel stops are fabricated which are in alignment with one another and in alignment with said active devices.

Claim 9

The process defined by claim 6 wherein said protective layer comprises a field oxide.

Claim 10

The process defined by claim 7 wherein said masking member comprises a photoresist material.

Claim 11

The process defined by claim 8 wherein said field oxide and photoresist material are removed prior to said doping of said second channel stop.

Claim 12

The process defined by claim 9 wherein a second field oxide is formed on said substrate over said intermediate area before said fabrication of said active devices.

Claim 13

The process defined by claim 6 wherein said spaced-apart first area and second area are defined with silicon nitride.

Claim 14

The process defined by claim 11 wherein said protective layer comprises a field oxide layer.

Claim 15

The process defined by claim 12 wherein said first conductivity type is a p-type.

Claim 16

The process defined by claim 13 wherein said removal of portions of said protective layer is performed by etching.

Claim 17

The process defined by claim 14 including a drive-in step for driving in said ion implanted dopant to define a p-well, said p-well for receiving one of said active devices.

Claim 18

On a silicon substrate which includes a first area for a first MOS device and a second spaced-apart area for a second MOS device, a process for forming channel stops of opposite conductivity type in the intermediate region between said first and second areas, comprising the steps of: doping said intermediate region with an impurity of a first conductivity type to define a first channel stop of a first conductivity type; forming a masking member on said substrate, said masking member protecting a portion of said intermediate region; doping the unprotected portion of said intermediate region of said silicon substrate with a dopant of a second conductivity type to define a second channel stop of a second conductivity type; whereby full channel stops may be fabricated in alignment with each other and with said first and second areas.

Claim 19

On a silicon substrate which includes a first area for a first MOS device and a second spaced-apart area for a second MOS device, a process for forming channel stops of opposite conductivity type in the intermediate region between said first and second areas, comprising the steps of: doping said intermediate region with an impurity of a first conductivity type to define a first channel stop of a first conductivity type; forming a masking member on said substrate, said masking member protecting a portion of said intermediate region; doping the unprotected portion of said intermediate region of said silicon substrate with a dopant of a second conductivity type to define a second channel stop of a second conductivity type; whereby full channel stops may be fabricated in alignment with each other and with said first and second areas.

Claim 20

The process defined by claim 16 wherein silicon nitride layers are formed over said first and second areas prior to said doping with said first conductivity type dopant and wherein said second conductivity dopant compensates for said first conductivity type dopant in said unprotected portions of said intermediate region.

Claim 21

The process defined by claim 16 including the step of etching silicon from said unprotected portion of said intermediate region of said substrate prior to said doping with said second conductivity type dopant.

Claim 22

The process defined by claim 18 wherein said doping with said first conductivity type dopant comprises the ion implantation at an energy level such that said first conductivity type dopant does not dope said first and second areas.

Claim 23

The process defined by claim 19 wherein silicon nitride layers are formed over said first and second areas prior to said ion implantation of said first conductivity type dopant.