US3933528A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Process for fabricating integrated circuits utilizing ion implantation
Assignee: Texas Instruments Inc
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Filing: 1974-07-02
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Granted: 1976-01-20
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Expires: 1994-07-02
Abstract
Abstract A self-aligning process for fabrication of integrated circuits utilizing ion implantation to effect doping. A composed masking technique is used to define self-aligned areas in a silicon oxide layer for definition of isolation, base, resistor and collector contact regions. Only two oxide removal steps are required for isolation through emitter process steps, and the process uses the silicon oxide layer and photoresist material for implantation masking. Formation of the emitter region by ion implantation and by diffusion are described.
Inventors
- 👤 Benjamin Johnston Sloan, Jr.
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 22:17
CPC Classifications
H; H10; H10D; H10D84/00; H10D84/01; H10D84/0112; H10D84/02; H10D84/03; H10D84/038; H10P; H10P30/00; H10P30/20; H10P30/22; H10P95/00; Y; Y10; Y10S; Y10S148/00; Y10S148/085; Y10S148/151; Y10S438/00; Y10S438/981
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
235 words
A method of fabricating a semiconductor device having a semiconductor substrate with a surface of one conductivity type on which is disposed an insulating layer, including the steps of a. forming a patterned layer on said insulating surface, said patterned layer having defined therein a plurality of critically spaced apertures; b. removing at least a portion of the thickness of said insulating layer in areas defined by said apertures in said patterned layer to define self-aligned control areas in said insulating layer; c. covering at least a first one of said control areas in said insulating layer by barrier material to prevent ion implantation therethrough and implanting dopant ions of conductivity type opposite to that of said semiconductor surface through at least second and third of said control areas to define first and second regions of said opposite conductivity type in said semiconductor surface; d. covering said second control area with barrier material to prevent ion implantation therethrough and implanting further dopant ions of said opposite conductivity type into said first region to reduce the sheet resistivity of said first region; e. introducing impurities of said one conductivity type into a reduced area of said first region to form therein a third region of said one conductivity type, and through a third one of said control areas into a further area of said semiconductor surface to form a fourth region of said one conductivity type.
Claim 2
Independent Claim
235 words
A method of fabricating a semiconductor device having a semiconductor substrate with a surface of one conductivity type on which is disposed an insulating layer, including the steps of a. forming a patterned layer on said insulating surface, said patterned layer having defined therein a plurality of critically spaced apertures; b. removing at least a portion of the thickness of said insulating layer in areas defined by said apertures in said patterned layer to define self-aligned control areas in said insulating layer; c. covering at least a first one of said control areas in said insulating layer by barrier material to prevent ion implantation therethrough and implanting dopant ions of conductivity type opposite to that of said semiconductor surface through at least second and third of said control areas to define first and second regions of said opposite conductivity type in said semiconductor surface; d. covering said second control area with barrier material to prevent ion implantation therethrough and implanting further dopant ions of said opposite conductivity type into said first region to reduce the sheet resistivity of said first region; e. introducing impurities of said one conductivity type into a reduced area of said first region to form therein a third region of said one conductivity type, and through a third one of said control areas into a further area of said semiconductor surface to form a fourth region of said one conductivity type.
Claim 3
Dependent Claim
75 words
A method according to claim 1, wherein said first region of opposite conductivity type defines a base region for a transistor and is formed in a region of said semiconductor surface defining a collector region for said transistor, wherein said third region of said one conductivity type defines an emitter region for said transistor, wherein said first region of opposite conductivity type defines a resistor, and wherein said fourth region defines a collector contact region.
Claim 4
Dependent Claim
53 words
A method according to claim 1, wherein said step (b) is accomplished by delineating apertures extending completely through said insulating layer to expose areas of said substrate surface in registration with said patterned layer apertures, and forming an insulating layer of reduced thickness on each of said exposed areas of said substrate surface.
Claim 5
Dependent Claim
266 words
In a method of fabricating a semiconductor device having a semiconductor substrate comprising a surface layer of one conductivity type and an underlying layer of opposite conductivity type, the steps of a. forming an insulating layer on the surface of said layer of one conductivity type; b. forming a patterned layer on said insulating layer and removing portions of said insulating layer over areas delineated by self-aligned apertures in said patterned layer, said areas including a closed contour area and a plurality of further apertures surrounded by said closed contour area; c. covering said further apertures with barrier material to prevent ion implantation therethrough and implanting dopant ions of said opposite conductivity type through said closed contour aperture into said semiconductor layer throughout the thickness thereof; d. uncovering said insulating layer and forming a relatively thin layer of insulating material on semiconductor surface areas within the said further apertures; e. covering the relatively thin insulating layer in a first one of said further apertures with barrier material to prevent implantation of ions therethrough and implanting ions of said opposite conductivity type through the relatively thin insulating layers in second and third ones of said further apertures to define first and second regions of said opposite conductivity type in said semiconductor layer of one conductivity type; f. covering the relatively thin insulating layer in said second further aperture with barrier material to prevent implantation of ions therethrough and implanting further ions of said opposite conductivity type through said relatively thin insulating layer in said third further aperture into said second region to decrease the sheet resistance thereof.
Claim 6
Dependent Claim
266 words
In a method of fabricating a semiconductor device having a semiconductor substrate comprising a surface layer of one conductivity type and an underlying layer of opposite conductivity type, the steps of a. forming an insulating layer on the surface of said layer of one conductivity type; b. forming a patterned layer on said insulating layer and removing portions of said insulating layer over areas delineated by self-aligned apertures in said patterned layer, said areas including a closed contour area and a plurality of further apertures surrounded by said closed contour area; c. covering said further apertures with barrier material to prevent ion implantation therethrough and implanting dopant ions of said opposite conductivity type through said closed contour aperture into said semiconductor layer throughout the thickness thereof; d. uncovering said insulating layer and forming a relatively thin layer of insulating material on semiconductor surface areas within the said further apertures; e. covering the relatively thin insulating layer in a first one of said further apertures with barrier material to prevent implantation of ions therethrough and implanting ions of said opposite conductivity type through the relatively thin insulating layers in second and third ones of said further apertures to define first and second regions of said opposite conductivity type in said semiconductor layer of one conductivity type; f. covering the relatively thin insulating layer in said second further aperture with barrier material to prevent implantation of ions therethrough and implanting further ions of said opposite conductivity type through said relatively thin insulating layer in said third further aperture into said second region to decrease the sheet resistance thereof.
Claim 7
Independent Claim
447 words
A method of fabricating an integrated circuit semiconductor device having a semiconductor layer of one conductivity type and an underlying semiconductor layer of opposite conductivity type a portion of said semiconductor layer of one conductivity type defining a collector region for a transistor; comprising the steps of a. forming a layer of insulating material over a surface of said semiconductor layer of one conductivity type; b. forming a patterned masking layer on said insulating layer and removing portions of said insulating layer in areas defined by said masking layer to open a closed contour aperture in said insulating layer surrounding said collector region and first, second and third self-aligned spaced apertures through said insulating layer surrounded by said closed contour aperture; c. covering said first, second and third apertures with barrier material to prevent implantation of ions therethrough and implanting ions of said opposite conductivity type into said semiconductor layer of one conductivity type through said closed contour aperture to form an isolation region of said opposite conductivity type extending throughout the thickness of said first layer of one conductivity type; d. removing said masking layer and barrier material and forming a relatively thin layer of insulating material on surface portions of said semiconductor layer of one conductivity type within said apertures in the insulating layer; e. covering the relatively thin insulating layer in said first aperture with barrier material to prevent implantation of ions therethrough and implanting ions of said opposite conductivity type into the semiconductor layer of said one conductivity type through said relatively thin thickness layers of insulating material in said second, third and closed contour apertures; f. covering the relatively thin insulating layers in said first and second apertures in the insulating layer with barrier material to prevent implantation of ions therethrough and introducing further dopant ions of said opposite conductivity type into said semiconductor layer of said one conductivity type through the relatively thin insulating layers in said third and said closed contour apertures whereby said second region of opposite conductivity type defines a resistor region having relatively high sheet resistance and said third region of opposite conductivity type defines a base region of relatively low sheet resistance; g. exposing surface areas of said semiconductor layer of one conductivity type beneath said first apertures and over a limited area of said third region of opposite conductivity type and introducing impurities of said one conductivity type into said exposed surface areas to define, respectively, a collector contact region and an emitter region for said transistor; and h. retaining said insulating layer in place and forming ohmic connections at least to said resistor, emitter, and collector contact regions through apertures in said insulating layer.
Claim 8
Independent Claim
447 words
A method of fabricating an integrated circuit semiconductor device having a semiconductor layer of one conductivity type and an underlying semiconductor layer of opposite conductivity type a portion of said semiconductor layer of one conductivity type defining a collector region for a transistor; comprising the steps of a. forming a layer of insulating material over a surface of said semiconductor layer of one conductivity type; b. forming a patterned masking layer on said insulating layer and removing portions of said insulating layer in areas defined by said masking layer to open a closed contour aperture in said insulating layer surrounding said collector region and first, second and third self-aligned spaced apertures through said insulating layer surrounded by said closed contour aperture; c. covering said first, second and third apertures with barrier material to prevent implantation of ions therethrough and implanting ions of said opposite conductivity type into said semiconductor layer of one conductivity type through said closed contour aperture to form an isolation region of said opposite conductivity type extending throughout the thickness of said first layer of one conductivity type; d. removing said masking layer and barrier material and forming a relatively thin layer of insulating material on surface portions of said semiconductor layer of one conductivity type within said apertures in the insulating layer; e. covering the relatively thin insulating layer in said first aperture with barrier material to prevent implantation of ions therethrough and implanting ions of said opposite conductivity type into the semiconductor layer of said one conductivity type through said relatively thin thickness layers of insulating material in said second, third and closed contour apertures; f. covering the relatively thin insulating layers in said first and second apertures in the insulating layer with barrier material to prevent implantation of ions therethrough and introducing further dopant ions of said opposite conductivity type into said semiconductor layer of said one conductivity type through the relatively thin insulating layers in said third and said closed contour apertures whereby said second region of opposite conductivity type defines a resistor region having relatively high sheet resistance and said third region of opposite conductivity type defines a base region of relatively low sheet resistance; g. exposing surface areas of said semiconductor layer of one conductivity type beneath said first apertures and over a limited area of said third region of opposite conductivity type and introducing impurities of said one conductivity type into said exposed surface areas to define, respectively, a collector contact region and an emitter region for said transistor; and h. retaining said insulating layer in place and forming ohmic connections at least to said resistor, emitter, and collector contact regions through apertures in said insulating layer.
Claim 9
Dependent Claim
31 words
A method according to claim 5, wherein said semiconductor substrate comprises a silicon substrate, said insulating layer comprises silicon oxide and said masking layer and said barrier material comprise photoresist material.
Claim 10
Dependent Claim
19 words
A method according to claim 6, wherein said one conductivity type is p-type and said opposite conductivity is n-type.
Claim 11
Dependent Claim
229 words
In a method of fabricating a semiconductor device having a semiconductor substrate including a layer of insulating material on one surface of said substrate, the steps of: a. forming a patterned layer on said insulating layer and delineating a plurality of critically spaced areas in said insulating layer in correspondence with said patterned layer, said spaced areas including a closed contour area and at least two areas within the closed contour area; b. implanting ions into said substrate in a region thereof below said closed contour area to define an isolation region in said substrate; c. forming reduced thickness insulating material in said spaced areas in the insulating layer within the closed contour area; d. implanting ions of one conductivity type into said substrate surface through at least one of said reduced thickness areas while covering other of said reduced thickness areas with barrier material to prevent ion implantation therethrough; e. implanting further ions of said one conductivity type into said substrate surface through at least a further one of said reduced thickness areas while covering other of said reduced thickness areas with barrier material to prevent ion implantation therethrough; f. and subsequently removing said patterned layer and said barrier material while leaving said insulating layer in place and forming ohmic connections through apertures in said insulating layer at least to selected ones of said ion implanted substrate areas.
Claim 12
Dependent Claim
229 words
In a method of fabricating a semiconductor device having a semiconductor substrate including a layer of insulating material on one surface of said substrate, the steps of: a. forming a patterned layer on said insulating layer and delineating a plurality of critically spaced areas in said insulating layer in correspondence with said patterned layer, said spaced areas including a closed contour area and at least two areas within the closed contour area; b. implanting ions into said substrate in a region thereof below said closed contour area to define an isolation region in said substrate; c. forming reduced thickness insulating material in said spaced areas in the insulating layer within the closed contour area; d. implanting ions of one conductivity type into said substrate surface through at least one of said reduced thickness areas while covering other of said reduced thickness areas with barrier material to prevent ion implantation therethrough; e. implanting further ions of said one conductivity type into said substrate surface through at least a further one of said reduced thickness areas while covering other of said reduced thickness areas with barrier material to prevent ion implantation therethrough; f. and subsequently removing said patterned layer and said barrier material while leaving said insulating layer in place and forming ohmic connections through apertures in said insulating layer at least to selected ones of said ion implanted substrate areas.
Claim 13
Dependent Claim
59 words
A method according to claim 8, wherein said step (d) results in implantation of a first doped region in said substrate of a conductivity type opposite from that of said substrate surface, and including the further step of forming a second doped region of the same conductivity type as that of said substrate surface, in said first doped region.
Claim 14
Dependent Claim
23 words
A method according to claim 8, wherein said ions implanted through said closed contour area are dopant ions of said one conductivity type.
References Cited (Backward Citations)
US3756861A
Cited
US3793088A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1979-01-19 | 1979-07-21 | 1980-01-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1983-01-19 | 1983-07-21 | 1984-01-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1987-01-19 | 1987-07-21 | 1988-01-20 | $7700.00 | Window Closed / Lapsed |