Patent US7531905B2 successfully refreshed from Google Patents.
US7531905B2
Active / In Force
US
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Stacked semiconductor device
Assignee: Micron Technology Inc
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Filing: 2007-01-10
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Granted: 2009-05-12
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Expires: 2027-01-10
Abstract
Abstract A stacked semiconductor device includes an interposer substrate having external power supply terminals, and semiconductor chips stacked on the interposer substrate. A power supply wiring arranged in the semiconductor chip located in the bottom layer is connected to the external power supply terminal via a bump electrode, the power supply wiring arranged in the semiconductor chip located in the top layer is connected to the external power supply terminal via a bonding wire, and the power supply wirings each arranged in adjacent semiconductor chips are mutually connected via the through electrode. Such a loop structure can solve a problem such that the higher the semiconductor chip, the larger its voltage drop.
Inventors
- 👤 Masakzau Ishino
- 👤 Hiroaki Ikeda
- 👤 Junji Yamada
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 10:51
CPC Classifications
H; H10; H10W; H10W90/00; H10W72/00; H10W72/851; H10W70/00; H10W70/60; H10W70/62; H10W70/63; H10W70/65; H10W70/654; H10W70/656; H10W72/01; H10W72/071; H10W72/072; H10W72/07251; H10W72/07254; H10W72/20; H10W72/241; H10W72/244; H10W72/247; H10W72/248; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/90; H10W72/951; H10W72/952; H10W90/20; H10W90/22; H10W90/701; H10W90/721; H10W90/722; H10W90/724; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 20
Claim 1
Independent Claim
93 words
A stacked semiconductor device in which a plurality of semiconductor chips including at least first and second semiconductor chips are stacked, comprising: an external power supply terminal; a first connector that electrically connects a power supply wiring arranged in the first semiconductor chip and the external power supply terminal; a second connector outside said semiconductor chips that electrically connects a power supply wiring arranged in the second semiconductor chip and the external power supply terminal; and a third connector that mutually electrically connects the power supply wirings each provided in adjacent semiconductor chips.
Claim 2
Dependent Claim
93 words
A stacked semiconductor device in which a plurality of semiconductor chips including at least first and second semiconductor chips are stacked, comprising: an external power supply terminal; a first connector that electrically connects a power supply wiring arranged in the first semiconductor chip and the external power supply terminal; a second connector outside said semiconductor chips that electrically connects a power supply wiring arranged in the second semiconductor chip and the external power supply terminal; and a third connector that mutually electrically connects the power supply wirings each provided in adjacent semiconductor chips.
Claim 3
Dependent Claim
25 words
The stacked semiconductor device as claimed in claim 1 , wherein the third connector includes a through electrode arranged in the plurality of semiconductor chips.
Claim 4
Dependent Claim
86 words
The stacked semiconductor device as claimed in claim 1 , wherein the plurality of semiconductor chips further include a third semiconductor chip arranged between the first semiconductor chip and the second semiconductor chip, and a power supply wiring of the third semiconductor chip is electrically connected to the power supply wirings of the first and the second semiconductor chips by the third connector, and is electrically connected in a bypassing manner to the external power supply terminal by a fourth connector different from the third connector.
Claim 5
Dependent Claim
36 words
The stacked semiconductor device as claimed in claim 1 , further comprising an interposer substrate on which the external power supply terminal is arranged, wherein the plurality of semiconductor chips are stacked on the interposer substrate.
Claim 6
Dependent Claim
24 words
The stacked semiconductor device as claimed in claim 4 , wherein the first semiconductor chip is a semiconductor chip nearest to the interposer substrate.
Claim 7
Dependent Claim
41 words
The stacked semiconductor device as claimed in claim 5 , wherein the first connector includes a bump electrode that electrically connects the power supply wiring arranged in the first semiconductor chip and a power supply wiring arranged in the interposer substrate.
Claim 8
Dependent Claim
24 words
The stacked semiconductor device as claimed in claim 4 , wherein the second semiconductor chip is a semiconductor chip farthest from the interposer substrate.
Claim 9
Dependent Claim
41 words
The stacked semiconductor device as claimed in claim 7 , wherein the second connector includes a bypass conductor that electrically connects the power supply wiring arranged in the second semiconductor chip and a power supply wiring arranged in the interposer substrate.
Claim 10
Dependent Claim
21 words
The stacked semiconductor device as claimed in claim 8 , wherein a plurality of the bypass conductors are arranged in parallel.
Claim 11
Dependent Claim
18 words
The stacked semiconductor device as claimed in claim 8 , wherein the bypass conductor is a bonding wire.
Claim 12
Dependent Claim
61 words
The stacked semiconductor device as claimed in claim 7 , further comprising a cap substrate arranged opposite, seen from the second semiconductor chip, to the interposer substrate, wherein the second connector electrically connects the external power supply terminal and the power supply wiring that is arranged in the second semiconductor chip, via the power supply wiring arranged in the cap substrate.
Claim 13
Dependent Claim
33 words
The stacked semiconductor device as claimed in claim 11 , further comprising an underfill material that is arranged between the interposer substrate and the cap substrate, and covers the plurality of semiconductor chips.
Claim 14
Dependent Claim
86 words
The stacked semiconductor device as claimed in claim 4 , wherein the plurality of semiconductor chips further include a third semiconductor chip arranged between the first semiconductor chip and the second semiconductor chip, and a power supply wiring of the third semiconductor chip is electrically connected to the power supply wirings of the first and the second semiconductor chips by the third connector, and is electrically connected in a bypassing manner to the external power supply terminal by a fourth connector different from the third connector.
Claim 15
Dependent Claim
87 words
The stacked semiconductor device as claimed in claim 13 , further comprising an intermediate interposer substrate arranged between the first semiconductor chip and the second semiconductor chip, wherein the power supply wiring arranged in the third semiconductor chip and a power supply wiring arranged on the intermediate interposer substrate are electrically connected by a bump electrode, and the fourth connector includes a bypass conductor that electrically connects the power supply wiring arranged on the interposer substrate and the power supply wiring arranged on the intermediate interposer substrate.
Claim 16
Dependent Claim
65 words
A stacked semiconductor device, comprising: a plurality of stacked semiconductor chips; and a power supply wiring that supplies a power supply potential to the plurality of semiconductor chips, wherein the power supply wiring has a loop structure that includes a portion that goes through a through electrode arranged in the plurality of semiconductor chips, and a portion that goes through at least one bypass conductor.
Claim 17
Dependent Claim
65 words
A stacked semiconductor device, comprising: a plurality of stacked semiconductor chips; and a power supply wiring that supplies a power supply potential to the plurality of semiconductor chips, wherein the power supply wiring has a loop structure that includes a portion that goes through a through electrode arranged in the plurality of semiconductor chips, and a portion that goes through at least one bypass conductor.
Claim 18
Dependent Claim
68 words
The stacked semiconductor device as claimed in claim 15 , further comprising an interposer substrate on which the plurality of semiconductor chips are mounted, wherein one end of the at least one bypass conductor is connected to the interposer substrate, and the other end of the at least one bypass conductor is connected to one of the plurality of semiconductor chips that is arranged in a top layer.
Claim 19
Dependent Claim
116 words
The stacked semiconductor device as claimed in claim 15 , wherein the plurality of semiconductor chips include at least a first semiconductor chip group and a second semiconductor chip group, the at least one bypass conductor includes first and second bypass conductors, and the loop structure of the power supply wiring includes a first loop structure including a portion that goes through a through electrode arranged in the first semiconductor chip group and a portion that goes through the first bypass conductor; and a second loop structure including a portion that goes through a through electrode arranged in the second semiconductor chip group and a portion that goes through the first and the second bypass conductors.
Claim 20
Dependent Claim
106 words
The stacked semiconductor device as claimed in claim 17 , further comprising an intermediate interposer substrate arranged between the first semiconductor chip group and the second semiconductor chip group, wherein one end of the first bypass conductor is connected to the interposer substrate and the other end of the first bypass conductor is connected to the intermediate interposer substrate, and one end of the second bypass conductor is connected to the interposer substrate and the other end of the second bypass conductor is connected directly or indirectly to a semiconductor chip that is arranged in a top layer and included in the second semiconductor chip group.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2012-05-11 | 2012-11-10 | 2013-05-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2016-05-11 | 2016-11-10 | 2017-05-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2020-05-11 | 2020-11-10 | 2021-05-12 | $7700.00 | Window Closed / Lapsed |