US6222276B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Through-chip conductors for low inductance chip-to-chip integration and off-chip connections
Assignee: International Business Machines Corp
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Filing: 1998-04-07
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Granted: 2001-04-24
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Expires: 2018-04-07
Abstract
Abstract Through-chip conductors for low inductance chip-to-chip integration and off-chip connections in a semiconductor package is disclosed. A semiconductor device has active devices on the front surface, a first through-chip conductor having first electrical/physical characteristics passing from the front surface of the device to the back surface, a second through-chip conductor having second electrical/physical characteristics passing to the back surface, and an off-chip or chip-to-chip connector electrically connecting the active devices on the front surface to a different level of packaging.
Inventors
- 👤 Claude Louis Bertin
- 👤 Wayne John Howell
- 👤 William R. Tonti
- 👤 Jerzy Maria Zalesinski
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 17:10
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W20/00; H10W20/01; H10W20/021; H10W20/023; H10W20/0234; H10W20/20; H10W20/211; H10W20/212; H10W20/2125; H10W20/2128; H10W40/00; H10W40/20; H10W40/22; H10W40/226; H10W40/228; H10W44/00; H10W44/20; H10W44/203; H10W44/209; H10W44/212; H10W72/00; H10W72/01; H10W72/019; H10W72/071; H10W72/072; H10W72/07251; H10W72/07252; H10W72/07254; H10W72/20; H10W72/221; H10W72/227; H10W72/241; H10W72/247; H10W72/90; H10W72/941; H10W72/9415; H10W72/942; H10W72/944; H10W72/951; H10W72/952; H10W90/00; H10W90/20; H10W90/22; H10W90/24; H10W90/26; H10W90/297; H10W90/701; H10W90/721; H10W90/722; H10W90/724; H10W90/728
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
96 words
A semiconductor device comprising: a semiconductor chip having a back surface and active devices on a front surface; at least one first through-chip conductor passing a first electrical/physical characteristic from said front surface to said back surface of the chip, wherein the first electrical/physical characteristic is electrical; at least one second through-chip conductor passing a second electrical/physical characteristic from said front surface to said back surface of the chip, wherein the second electrical/physical characteristic is thermal; and at least one chip connector electrically connected to said first through-chip conductor at the back surface of the chip.
Claim 2
Dependent Claim
96 words
A semiconductor device comprising: a semiconductor chip having a back surface and active devices on a front surface; at least one first through-chip conductor passing a first electrical/physical characteristic from said front surface to said back surface of the chip, wherein the first electrical/physical characteristic is electrical; at least one second through-chip conductor passing a second electrical/physical characteristic from said front surface to said back surface of the chip, wherein the second electrical/physical characteristic is thermal; and at least one chip connector electrically connected to said first through-chip conductor at the back surface of the chip.
Claim 3
Dependent Claim
16 words
The device of claim 1 , wherein said different level of packaging comprises a circuit board.
Claim 4
Dependent Claim
22 words
The device of claim 1 , wherein said at least one chip connector comprises a plurality of chip connectors of mixed heights.
Claim 5
Dependent Claim
19 words
The device of claim 1 , wherein said first through-chip conductor comprises an inner conductor surrounded by an insulator.
Claim 6
Dependent Claim
23 words
The device of claim 1 , wherein said first through-chip conductor comprises an outer conductor and an inner conductor separated by an insulator.
Claim 7
Dependent Claim
11 words
The device of claim 1 , wherein said conductor is copper.
Claim 8
Dependent Claim
16 words
The device of claim 1 , wherein said chip connector comprises a conductor of plated copper.
Claim 9
Dependent Claim
30 words
The device of claim 1 , wherein said chip connector comprises an outer conductor of plated copper and at least one inner conductor of plated copper separated by an insulator.
Claim 10
Dependent Claim
122 words
A semiconductor package comprising: an active semiconductor device having a back surface and active devices on a front surface; a first set of through-chip conductors passing from the front surface of the device to the back surface of the device, wherein the first set of through-chip conductors comprise an outer conductor and an inner conductor separated by an insulator; a second set of through-chip conductors passing from the front surface of the device to the back surface of the device, wherein the second set of through-chip conductors has thermal characteristics; chip connectors connected to the first set of through-chip conductors on the back surface of the device; and a different level of packaging in contact with the back surface of the device.
Claim 11
Dependent Claim
122 words
A semiconductor package comprising: an active semiconductor device having a back surface and active devices on a front surface; a first set of through-chip conductors passing from the front surface of the device to the back surface of the device, wherein the first set of through-chip conductors comprise an outer conductor and an inner conductor separated by an insulator; a second set of through-chip conductors passing from the front surface of the device to the back surface of the device, wherein the second set of through-chip conductors has thermal characteristics; chip connectors connected to the first set of through-chip conductors on the back surface of the device; and a different level of packaging in contact with the back surface of the device.
Claim 12
Dependent Claim
16 words
The package of claim 9 , wherein said different level of packaging comprises a circuit board.
Claim 13
Dependent Claim
19 words
The package of claim 9 , wherein said first through-chip conductor comprises an inner conductor surrounded by an insulator.
Claim 14
Dependent Claim
16 words
The package of claim 9 , wherein said chip connector comprises a conductor of plated copper.
Claim 15
Dependent Claim
30 words
The package of claim 9 , wherein said chip connector comprises an outer conductor of plated copper and at least one inner conductor of plated copper separated by an insulator.
Claim 16
Dependent Claim
120 words
A semiconductor device comprising: a semiconductor chip having a back surface and active devices on a front surface; at least one first through-chip conductor passing a first electrical/physical characteristic from said front surface to said back surface of the chip, wherein the first electrical/physical characteristic is electrical; at least one second through-chip conductor passing a second electrical/physical characteristic from said front surface to said back surface of the chip, wherein the second electrical/physical, characteristic is thermal; and at least one chip connector electrically connected to said first through-chip conductor at the back surface of the chip, wherein the chip connector comprises an outer conductor of plated copper and at least one inner conductor of plated copper separated by an insulator.
Claim 17
Dependent Claim
120 words
A semiconductor device comprising: a semiconductor chip having a back surface and active devices on a front surface; at least one first through-chip conductor passing a first electrical/physical characteristic from said front surface to said back surface of the chip, wherein the first electrical/physical characteristic is electrical; at least one second through-chip conductor passing a second electrical/physical characteristic from said front surface to said back surface of the chip, wherein the second electrical/physical, characteristic is thermal; and at least one chip connector electrically connected to said first through-chip conductor at the back surface of the chip, wherein the chip connector comprises an outer conductor of plated copper and at least one inner conductor of plated copper separated by an insulator.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2004-04-23 | 2004-10-23 | 2005-04-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2008-04-23 | 2008-10-23 | 2009-04-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2012-04-23 | 2012-10-23 | 2013-04-24 | $7700.00 | Window Closed / Lapsed |