Abstract The package houses an electronic assembly comprising a plurality of modules having integrated circuits secured to the module boards. Wiring patterns on each board interconnect integrated circuit leads and connect the circuits to the module output contacts formed around the periphery of the board. The housing sides have interior slots which are parallel to the edges of the module boards and include conducting strips which are perpendicular to the slots and spaced according to the spacing of the module output contacts. The edges of the modules are inserted into the slots for interconnecting corresponding output contacts of the modules through the conducting strips. At least one housing cover plate includes a circuit pattern on its interior surface which has contact terminals about its periphery and connecting pins on its external surface which are electrically connected to the circuit pattern. The plate is placed over the top of the assembled modules for electrically connecting the corresponding contacts of the modules through its circuit pattern to the connecting pins. The other housing cover plate which may or may not be provided with a circuit pattern and connecting pins completes the package. After the package has been assembled, it is subjected to an environment for fusing the module output contacts to the conducting strips and for fusing the cover plates to the housing so that a package can be produced with fused mechanical, electrical, and thermal connections being made between the modules of electronic system and the package which is also hermetically sealed.
A package for an electronic assembly of module circuit boards having output contacts disposed around the edges of the module circuit boards, said package comprising, housing means including horizontally extending slots in the inner surfaces of the walls of said housing means, for mating with the edges of the module circuit boards, continuous conducting strips orthogonal to the edges of said module circuit boards on the inner surfaces of said housing means for electrically connecting corresponding output contacts of said module circuit boards, cover plates for hermetically sealing said housing means, at least one of said cover plates including a circuit on its inner surface having contacts for mating with said continuous conducting strips for electrically interconnecting the circuits of said module circuit boards in a predetermined electrical configuration, said output contacts and said continuous conducting strips having a fusible metal layer thereon whereby said module circuit boards are mechanically connected inside said slots.
Claim 2
Dependent Claim
154 words
A package for an electronic assembly of module circuit boards having output contacts disposed around the edges of the module circuit boards, said package comprising, housing means including horizontally extending slots in the inner surfaces of the walls of said housing means, for mating with the edges of the module circuit boards, continuous conducting strips orthogonal to the edges of said module circuit boards on the inner surfaces of said housing means for electrically connecting corresponding output contacts of said module circuit boards, cover plates for hermetically sealing said housing means, at least one of said cover plates including a circuit on its inner surface having contacts for mating with said continuous conducting strips for electrically interconnecting the circuits of said module circuit boards in a predetermined electrical configuration, said output contacts and said continuous conducting strips having a fusible metal layer thereon whereby said module circuit boards are mechanically connected inside said slots.
Claim 3
Dependent Claim
107 words
The combination as recited in claim 1 including circuit components having leads flexibly attached to said module circuit boards and, said module circuit boards includes conductor patterns for interconnecting certain of said components and for connecting the leads from certain of said components to the module output contacts, the body of each of said components being suspended above the surface of the module boards by the leads of said component after said leads have been connected to a circuit of a module circuit board for enabling said cOmponent body to undergo dimensional changes relative to the surface of said module board as a result of environmental changes.