US7402454B2
Active / In Force
US
⏱️ 0.1 years remaining
Molded integrated circuit package with exposed active area
Assignee: STMicroelectronics lnc USA
•
Filing: 2006-12-14
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Granted: 2008-07-22
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Expires: 2026-12-14
Abstract
Abstract An integrated circuit die having an active area that must remain exposed after packaging is secured by a compliant die attachment by which the integrated circuit die is held in position within a transfer mold during encapsulation. The compliant die attachment may comprise a flexible, compressible tape having pressure-sensitive adhesive, alone or with a rigid substrate support, or a compliant adhesive preferably applied only around a periphery of the die attach area. Deformation of the compliant die attachment under mold clamping pressure allows complete contact of the mold with the active area, preventing bleeding of the encapsulating material under the edge of a mold portion onto the active area.
Inventors
- 👤 Tiao Zhou
- 👤 Michael J. Hundt
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 08:28
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/01; H10W74/016; H10W74/10; H10W74/111; H10W74/114; H10W72/00; H10W72/851; H10W72/874; H10W72/884; H10W90/00; H10W90/701; H10W90/731; H10W90/734; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 21
Claim 1
Independent Claim
106 words
A method of packaging exposed active area sensors comprising steps of: utilizing a compliant die attachment to secure an integrated circuit die having a surface region which must remain exposed after packaging within a transfer mold during encapsulation of the integrated circuit die, wherein the compliant die attachment deforms, as necessary, in response to contact of a portion of the transfer mold with the surface region which must remain exposed after packaging, and wherein the compliant die attachment comprises: a flexible and compressible substrate mounted on a rigid base, and a compliant adhesive disposed only at locations proximate to a periphery of the integrated circuit die.
Claim 2
Independent Claim
106 words
A method of packaging exposed active area sensors comprising steps of: utilizing a compliant die attachment to secure an integrated circuit die having a surface region which must remain exposed after packaging within a transfer mold during encapsulation of the integrated circuit die, wherein the compliant die attachment deforms, as necessary, in response to contact of a portion of the transfer mold with the surface region which must remain exposed after packaging, and wherein the compliant die attachment comprises: a flexible and compressible substrate mounted on a rigid base, and a compliant adhesive disposed only at locations proximate to a periphery of the integrated circuit die.
Claim 3
Dependent Claim
82 words
The method according to claim 1 , wherein the step of utilizing a compliant die attachment to secure the integrated circuit die having a surface region which must remain exposed after packaging within a transfer mold during encapsulation of the integrated circuit die further comprises: securing the integrated circuit die with the flexible, compressible substrate to which the integrated circuit die is attached by an adhesive, the substrate held between portions of the transfer mold during encapsulation of the integrated circuit die.
Claim 4
Dependent Claim
21 words
The method according to claim 2 , wherein the flexible substrate comprises tape and the adhesive is a pressure sensitive adhesive.
Claim 5
Dependent Claim
76 words
The method according to claim 1 , wherein the step of utilizing a compliant die attachment to secure an integrated circuit die having a surface region which must remain exposed after packaging within a transfer mold during encapsulation of the integrated circuit die further comprises: securing the integrated circuit die with the compliant adhesive securing the integrated circuit die to a substrate held between portions of the transfer mold during encapsulation of the integrated circuit die.
Claim 6
Dependent Claim
34 words
The method according to claim 4 , further comprising: securing the integrated circuit die to a substrate including an opening therethrough beneath the integrated circuit die within a perimeter defined by the compliant adhesive.
Claim 7
Dependent Claim
19 words
The method according to claim 1 , wherein the flexible and compressible substrate comprises a flexible and compressible tape.
Claim 8
Dependent Claim
26 words
The method according to claim 1 , wherein the compliant die attachment prevents bleeding of an encapsulating material onto the surface of the integrated circuit die.
Claim 9
Dependent Claim
15 words
The method according to claim 1 , wherein the rigid base comprises a plastic base.
Claim 10
Dependent Claim
69 words
The method according to claim 1 , wherein the step of utilizing a compliant die attachment to secure an integrated circuit die having a surface region which must remain exposed after packaging within a transfer mold during encapsulation of the integrated circuit die further comprises: compensating during mold clamping for surface height variations for the surface region which must remain exposed after packaging by deforming the compliant die attachment.
Claim 11
Independent Claim
107 words
A method of packaging exposed active area sensors comprising steps of: securing an integrated circuit die having a surface region which must remain exposed after packaging using a compliant die attachment; and clamping the integrated circuit die and a substrate in a transfer mold, wherein the compliant die attachment deforms, as necessary, in response to contact of a portion of the transfer mold with the surface region which must remain exposed after packaging, and wherein the compliant die attachment comprises: a flexible and compressible substrate mounted on a rigid base, and a compliant adhesive disposed only at locations proximate to a periphery of the integrated circuit die.
Claim 12
Independent Claim
107 words
A method of packaging exposed active area sensors comprising steps of: securing an integrated circuit die having a surface region which must remain exposed after packaging using a compliant die attachment; and clamping the integrated circuit die and a substrate in a transfer mold, wherein the compliant die attachment deforms, as necessary, in response to contact of a portion of the transfer mold with the surface region which must remain exposed after packaging, and wherein the compliant die attachment comprises: a flexible and compressible substrate mounted on a rigid base, and a compliant adhesive disposed only at locations proximate to a periphery of the integrated circuit die.
Claim 13
Dependent Claim
55 words
The method according to claim 10 , wherein the step of securing an integrated circuit die further comprises: securing the integrated circuit die with the flexible, compressible substrate to which the integrated circuit die is attached by an adhesive, the substrate held between portions of the transfer mold during encapsulation of the integrated circuit die.
Claim 14
Dependent Claim
15 words
The method according to claim 11 , wherein the adhesive is a pressure sensitive adhesive.
Claim 15
Dependent Claim
19 words
The method according to claim 10 , wherein the flexible and compressible substrate comprises a flexible and compressible tape.
Claim 16
Dependent Claim
49 words
The method according to claim 10 , wherein the step of securing an integrated circuit die further comprises: securing the integrated circuit die with the compliant adhesive securing the integrated circuit die to a substrate held between portions of the transfer mold during encapsulation of the integrated circuit die.
Claim 17
Dependent Claim
34 words
The method according to claim 14 , further comprising: securing the integrated circuit die to a substrate including an opening therethrough beneath the integrated circuit die within a perimeter defined by the compliant adhesive.
Claim 18
Dependent Claim
15 words
The method according to claim 10 , wherein the rigid base comprises a plastic base.
Claim 19
Dependent Claim
45 words
The method according to claim 10 , wherein the step of clamping the integrated circuit die and substrate in a transfer mold further comprises: compensating for surface height variations for the surface region which must remain exposed after packaging by deforming the compliant die attachment.
Claim 20
Dependent Claim
30 words
The method according to claim 10 , further comprising injecting an encapsulating material into the transfer mold while the integrated circuit die and substrate are clamped in the transfer mold.
Claim 21
Dependent Claim
26 words
The method according to claim 18 , wherein the compliant die attachment prevents bleeding of the encapsulating material onto the surface of the integrated circuit die.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2011-07-22 | 2012-01-21 | 2012-07-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2015-07-22 | 2016-01-21 | 2016-07-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2019-07-22 | 2020-01-21 | 2020-07-22 | $7700.00 | Window Closed / Lapsed |