US5897338A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for encapsulating an integrated semi-conductor circuit
Assignee: Sencio BV
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Filing: 1997-06-10
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Granted: 1999-04-27
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Expires: 2017-06-10
Abstract
Abstract Method for encapsulating an integrated semi-conductor circuit (die) comprising the following steps: a) mounting the semi-conductor circuit onto the surface of a so-called lead frame, b) attaching connecting wires between the contact surfaces of the semi-conductor circuit and selected parts of the lead frame (bonding operation), c) by means of a mould producing a plastic housing which at least encapsulates the semi-conductor circuit, the supporting surface, the bonding wires and part of the lead frame, d) the mould comprises an inwards extending section of which the end surface in the closed situation of the mould extends parallel to the free upper side of the integrated semi-conductor circuit at short distance thereof, and e) before closing the mould a layer of heat resistant deformable material in the form of a ring or a continuous layer is brought in between the upper side of the integrated semi-conductor circuit and said end surface of the inwards extending part, which layer not or hardly adheres to the plastic housing.
Inventors
- 👤 Peter Jacobus Kaldenberg
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 15:09
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/10; H10W74/111; H10W74/01; H10W74/016; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
166 words
A method for encapsulating an integrated semi-conductor circuit (die) comprising the following steps: a) mounting the semi-conductor circuit onto the surface of a lead frame, b) attaching connecting wires between the contact surfaces of the semi-conductor circuit and selected parts of the lead frame (bonding operation), c) by means of a mould producing a plastic housing which at least encapsulates the semi-conductor circuit, the supporting surface, the bonding wires and part of the lead frame, wherein d) the mould comprises an inwards extending section of which the end surface in the closed situation of the mould extends parallel to the free upper side of the integrated semi-conductor circuit at short distance thereof, and e) before closing the mould a layer of heat resistant deformable material in the form of a ring or a continuous layer is brought in between the upper side of the integrated semi-conductor circuit and said end surface of the inwards extending part, which layer not or hardly adheres to the plastic housing.
Claim 2
Independent Claim
166 words
A method for encapsulating an integrated semi-conductor circuit (die) comprising the following steps: a) mounting the semi-conductor circuit onto the surface of a lead frame, b) attaching connecting wires between the contact surfaces of the semi-conductor circuit and selected parts of the lead frame (bonding operation), c) by means of a mould producing a plastic housing which at least encapsulates the semi-conductor circuit, the supporting surface, the bonding wires and part of the lead frame, wherein d) the mould comprises an inwards extending section of which the end surface in the closed situation of the mould extends parallel to the free upper side of the integrated semi-conductor circuit at short distance thereof, and e) before closing the mould a layer of heat resistant deformable material in the form of a ring or a continuous layer is brought in between the upper side of the integrated semi-conductor circuit and said end surface of the inwards extending part, which layer not or hardly adheres to the plastic housing.
Claim 3
Dependent Claim
31 words
A method according to claim 1, wherein the material is applied to end surface of the inwards extending part such that the end surface is covered or enclosed by said material.
Claim 4
Dependent Claim
14 words
A method according to claim 1, wherein said material consists of a silicon gel.
Claim 5
Dependent Claim
64 words
A mould for applying a method according to claim 1, comprising two or more detachable components together defining a space corresponding to the desired outer shape of the plastic housing, wherein said inwards extending part consists of a separate columnar component which, preceding the use of the mould, is attached in a thereto destined opening in the wall of one of the other components.
Claim 6
Dependent Claim
28 words
A mould according to claim 4, wherein the inwards extending part of the separate columnar component comprises said end surface as well as a columnar wall perpendicular thereto.
Claim 7
Dependent Claim
65 words
A mould according to claim 5, wherein there is a stepwise transition between the columnar wall and the end surface such that the columnar wall connects to a ring-shaped surface at a distance of said end surface whereby a further columnar wall having a smaller cross-section than the cross-section of the first mentioned columnar wall is present between said ring-shaped surface and the end surface.
Claim 8
Dependent Claim
41 words
A mould according to claim 6, wherein the stepwise transition is realized by making the component out of two parts, i.e. a columnar-shaped part determining the end surface and a tube, fitting around said columnar-shaped part and determining the ring-shaped surface.
References Cited (Backward Citations)
JPS55138845A
Cited
JPS60113950A
Cited
US4894707A
Cited
JPH0267750A
Cited
DE4424541A1
Cited
US5483740A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-04-26 | 2002-10-26 | 2003-04-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-04-26 | 2006-10-26 | 2007-04-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-04-26 | 2010-10-26 | 2011-04-27 | $7700.00 | Window Closed / Lapsed |