Patent US1464222A successfully refreshed from Google Patents.
US5483740A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of making homogeneous thermoplastic semi-conductor chip carrier package
Assignee: Amkor Technology Singapore Holding Pte Ltd
•
Filing: 1994-11-28
•
Granted: 1996-01-16
•
Expires: 2014-11-28
Abstract
Abstract A homogeneous thermoplastic semi-conductor chip carrier cavity package (HC package) which utilizes the same thermoplastic for various integral attachments to the HC package, such as, a molded lid and a circuit substrate. A chemical bonding or fusing of the integral attachments to the HC package provides increased protection from having moisture enter into the cavity of the HC package. The HC package eliminates problems which are associated with having different coefficients of thermal expansion for the HC package and its various integral attachments.
Inventors
- 👤 William H. Maslakow
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 05:31
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/62; H10W70/63; H10W70/635; H10W40/00; H10W40/10; H10W76/00; H10W76/10; H10W76/12; H10W76/15; H10W76/157; H10W76/17; H10W76/18; H10W76/40; H10W76/42; H10W76/47; H10W90/00; H10W90/701; H10W72/00; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/541; H10W72/5445; H10W90/751; H10W90/756; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121; Y10T29/49124; Y10T29/49126
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
114 words
A method of manufacturing a thermoplastic chip carrier cavity package, said method comprising the steps of: laminating a circuit substrate with a suitable thermoplastic in order to form a base, said base providing integral reinforcement of said circuit substrate; etching a defined circuit pattern on said laminated circuit substrate; attaching a lead frame to said defined circuit pattern; forming a casing, which is comprised of said suitable thermoplastic, to cover said laminated circuit substrate and said lead frame so that a cavity is formed, said casing being chemically bonded to a portion of said base of said laminated circuit substrate; and bonding a lid chemically to said casing to cover to said formed cavity.
Claim 2
Independent Claim
114 words
A method of manufacturing a thermoplastic chip carrier cavity package, said method comprising the steps of: laminating a circuit substrate with a suitable thermoplastic in order to form a base, said base providing integral reinforcement of said circuit substrate; etching a defined circuit pattern on said laminated circuit substrate; attaching a lead frame to said defined circuit pattern; forming a casing, which is comprised of said suitable thermoplastic, to cover said laminated circuit substrate and said lead frame so that a cavity is formed, said casing being chemically bonded to a portion of said base of said laminated circuit substrate; and bonding a lid chemically to said casing to cover to said formed cavity.
Claim 3
Dependent Claim
13 words
The method of claim 1 wherein said step of etching includes subtractive etching.
Claim 4
Dependent Claim
13 words
The method of claim 1 wherein said step of etching includes additive etching.
Claim 5
Dependent Claim
16 words
The method of claim 1 wherein said step of forming a casing includes injecting or molding.
Claim 6
Dependent Claim
28 words
The method of claim 1 wherein said step of attaching a lead frame includes attaching said lead frame to said plurality of traces with a electrically conductive solder.
Claim 7
Dependent Claim
31 words
The method of claim 1 wherein said step of forming a casing includes a remelting of said base so that said casing is chemically fused to a portion of said base.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-01-15 | 1999-07-17 | 2000-01-16 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-01-15 | 2003-07-17 | 2004-01-16 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-01-15 | 2007-07-17 | 2008-01-16 | $7700.00 | Window Closed / Lapsed |