US6300155B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for producing semiconductor device by coating
Assignee: Denso Corp
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Filing: 2000-03-30
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Granted: 2001-10-09
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Expires: 2020-03-30
Abstract
Abstract An electronic part is disposed in a space defined by upper and lower frames joined together. The upper frame has an opening portion, and a hollow packing member is disposed in the opening portion to expose a specific region of the electronic part. The upper and lower frames are further covered with a cover having a window portion at a position corresponding to the hollow portion of the packing member. In this state, a thin film is formed through the hollow portion to coat the specific region of the electronic part. The thin film is not adhered to the upper and lower frames. Accordingly, the upper and lower frames can be reused to form the thin film onto another electronic part successively.
Inventors
- 👤 Takafumi Taki
- 👤 Ryoichi Handa
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 15:12
CPC Classifications
G; G01; G01L; G01L19/00; G01L19/06; G01L19/0627; H; H10; H10W; H10W74/00; H10W74/01; H10W74/016
Claims Analysis
Total Claims: 25
Claim 1
Independent Claim
130 words
A method for producing a semiconductor device, comprising: preparing an electronic part having a specific region which is to be coated with a thin film; preparing a mask member which has an opening portion; disposing a hollow packing member in the opening portion of the mask member to cover an inner wall of the opening portion; covering the electronic part with the mask member having the packing member so that the specific region of the electronic part is exposed from a hollow portion of the packing member; covering the mask member with a cover member which has a window portion at a position corresponding to the hollow portion; forming a thin film to coat the specific region through the hollow portion; and detaching the electronic part from the mask member.
Claim 2
Independent Claim
130 words
A method for producing a semiconductor device, comprising: preparing an electronic part having a specific region which is to be coated with a thin film; preparing a mask member which has an opening portion; disposing a hollow packing member in the opening portion of the mask member to cover an inner wall of the opening portion; covering the electronic part with the mask member having the packing member so that the specific region of the electronic part is exposed from a hollow portion of the packing member; covering the mask member with a cover member which has a window portion at a position corresponding to the hollow portion; forming a thin film to coat the specific region through the hollow portion; and detaching the electronic part from the mask member.
Claim 3
Dependent Claim
24 words
The method of claim 1 , wherein covering the electronic part includes disposing the electronic part in a space defined in the mask member.
Claim 4
Dependent Claim
57 words
The method of claim 2 , wherein: the packing member disposed in the opening portion of the mask member has a protruding portion protruding from the mask member; and the cover member has a stepped portion for accommodating the protruding portion therein in contact with the protruding portion at the entire opening edge of the window portion.
Claim 5
Dependent Claim
25 words
The method of claim 3 , wherein a protruding amount of the stepped portion is decreased as a distance from the opening edge is decreased.
Claim 6
Dependent Claim
23 words
The method of claim 1 , wherein the cover member contacts the packing member at an entire opening edge of the window portion.
Claim 7
Dependent Claim
36 words
The method of claim 1 , wherein a thin film material for forming the thin film is adhered to a material for forming the cover member more readily than a material for forming the mask member.
Claim 8
Dependent Claim
20 words
The method of claim 6 , wherein the cover member is made of one selected from polycarbonate and AS resin.
Claim 9
Dependent Claim
28 words
The method of claim 1 , wherein the packing member has irregularities on a surface thereof for apparently absorbing a thin film material for forming the thin film.
Claim 10
Dependent Claim
27 words
The method of claim 1 , wherein the mask member is made of one selected from a group consisting of S45C, SUS303, YH75, polyacetal, 6-nylon, and MC-nylon.
Claim 11
Dependent Claim
56 words
The method of claim 1 , wherein: a semiconductor chip is mounted on the electronic part and is electrically connected to an electrode of the electronic part via a wire; and the semiconductor chip, the wire, and the electrode are exposed from the hollow portion of the packing member through which the thin film is formed.
Claim 12
Independent Claim
123 words
A method for producing a semiconductor device, comprising: preparing an electronic part having a specific region which is to be coated with a thin film; preparing a mask member having an opening portion; covering the electronic part with the mask member so that the specific region of the electronic part is exposed from the opening portion; forming a thin film to coat the specific region through the opening portion; detaching the mask member from the electronic part; and removing the thin film adhered to the mask member to reuse the mask member, wherein a first surface of the mask member to which the thin film is adhered when the thin film is formed has a surface roughness smaller than a specific surface roughness.
Claim 13
Independent Claim
123 words
A method for producing a semiconductor device, comprising: preparing an electronic part having a specific region which is to be coated with a thin film; preparing a mask member having an opening portion; covering the electronic part with the mask member so that the specific region of the electronic part is exposed from the opening portion; forming a thin film to coat the specific region through the opening portion; detaching the mask member from the electronic part; and removing the thin film adhered to the mask member to reuse the mask member, wherein a first surface of the mask member to which the thin film is adhered when the thin film is formed has a surface roughness smaller than a specific surface roughness.
Claim 14
Dependent Claim
42 words
The method of claim 11 , wherein the surface roughness of the first surface is smaller than a surface roughness of a second surface of the mask member to which the thin film is not adhered when the thin film is formed.
Claim 15
Dependent Claim
100 words
The method of claim 11 , further comprising disposing a hollow packing member in the opening portion of the mask member to cover an inner wall of the opening portion, before the electronic part is covered with the mask member, wherein; the specific region of the electronic part is exposed from a hollow portion of the packing member through which the thin film is formed; and the surface roughness of the first surface is smaller than a surface roughness of the inner wall of the opening portion which is covered with the packing member when the thin film is formed.
Claim 16
Dependent Claim
20 words
The method of claim 11 , wherein the surface roughness of the first surface is less than approximately 1.6 Rz.
Claim 17
Dependent Claim
20 words
The method of claim 14 , wherein the surface roughness of the first surface is less than approximately 0.6 Rz.
Claim 18
Dependent Claim
27 words
The method of claim 11 , wherein the mask member is made of one selected from a group consisting of S45C, SUS303, YH75, polyacetal, 6-nylon, and MC-nylon.
Claim 19
Dependent Claim
56 words
The method of claim 11 , wherein: a semiconductor chip is mounted on the electronic part and is electrically connected to an electrode of the electronic part via a wire; and the semiconductor chip, the wire, and the electrode are exposed from the opening portion of the mask member through which the thin film is formed.
Claim 20
Independent Claim
149 words
A method for producing a semiconductor device, comprising: preparing an electronic part having a specific region which is to be coated with a thin film; preparing a mask member having an opening portion; covering the electronic part with the mask member so that the specific region of the electronic part is exposed from the opening portion; forming a thin film to coat the specific region through the opening portion; detaching the mask member from the electronic part; and removing the thin film adhered to the mask member to reuse the mask member, wherein a supplementary film is formed on the mask member before forming the thin film so that the supplementary film is interposed between the mask member and the thin film; and wherein a bonding strength between the supplementary film and the thin film is smaller than a bonding strength between the mask member and the thin film.
Claim 21
Independent Claim
149 words
A method for producing a semiconductor device, comprising: preparing an electronic part having a specific region which is to be coated with a thin film; preparing a mask member having an opening portion; covering the electronic part with the mask member so that the specific region of the electronic part is exposed from the opening portion; forming a thin film to coat the specific region through the opening portion; detaching the mask member from the electronic part; and removing the thin film adhered to the mask member to reuse the mask member, wherein a supplementary film is formed on the mask member before forming the thin film so that the supplementary film is interposed between the mask member and the thin film; and wherein a bonding strength between the supplementary film and the thin film is smaller than a bonding strength between the mask member and the thin film.
Claim 22
Dependent Claim
58 words
The method of claim 18 , further comprising disposing a hollow packing member in the opening portion of the mask member to cover an inner wall of the opening portion, before the electronic part is covered with the mask member, wherein the thin film is formed on the specific region through a hollow portion of the packing member.
Claim 23
Dependent Claim
21 words
The method of claim 18 , wherein the supplementary film is made of one of electroless Ni plating and fluorine resin.
Claim 24
Dependent Claim
27 words
The method of claim 18 , wherein the mask member is made of one selected from a group consisting of S45C, SUS303, YH75, polyacetal, 6-nylon, and MC-nylon.
Claim 25
Dependent Claim
56 words
The method of claim 18 , wherein: a semiconductor chip is mounted on the electronic part and is electrically connected to an electrode of the electronic part via a wire; and the semiconductor chip, the wire, and the electrode are exposed from the opening portion of the mask member through which the thin film is formed.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2004-10-08 | 2005-04-09 | 2005-10-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2008-10-08 | 2009-04-09 | 2009-10-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2012-10-08 | 2013-04-09 | 2013-10-09 | $7700.00 | Window Closed / Lapsed |