IC module and IC card

Claim 2

An IC module comprising: a substrate, an IC chip mounted on the substrate, and an antenna coil electrically connected to the IC chip, wherein the antenna coil includes a conductive film which is patterned on a surface of the substrate, wherein the antenna coil includes a spiral portion having a plurality of spiral turns, wherein the substrate is provided with a pair of terminals disposed inwardly of the spiral portion in connection to starting and terminating ends, respectively, of the antenna coil, wherein the IC chip has a main surface formed with a pair of electrodes for connection to the pair of terminals, wherein the antenna coil further includes a bent extension extending from the respective spiral turns, and wherein the bent extension includes a first portion inwardly from each spiral turn toward the IC chip, a second portion extending from the first portion to pass between the pair of terminals, and a third portion extending outwardly from the second portion to a next spiral turn.

Claim 3

The IC module according to claim 1, wherein the main surface of the IC chip is rectangular, the pair of electrodes for antenna connection being disposed at corners of the main surface on a common diagonal line.

Claim 4

The IC module according to claim 2, wherein the main surface of the IC chip is provided with at least one dummy electrode, the substrate being provided with a dummy terminal corresponding to the dummy electrode, the dummy electrode being connected to the dummy terminal.

Claim 5

The IC module according to claim 1, wherein the substrate comprises a flexible substrate made of a resin film as a base material.

Claim 6

An IC module comprising: a substrate, an IC chip mounted on the substrate, an antenna coil electrically connected to the IC chip, including a conductive film which is patterned on a surface of the substrate, and an auxiliary film having a surface formed with a conductor pattern which is symmetrical or substantially symmetrical to the pattern of the antenna coil, wherein the substrate and the auxiliary film are bonded to each other to bring the conductive film pattern of the antenna coil into connection to the conductor pattern of the auxiliary film.

Claim 7

An IC module comprising: a substrate, an IC chip mounted on the substrate, an antenna coil electrically connected to the IC chip, including a conductive film which is patterned on a surface of the substrate, and an auxiliary film having a surface formed with a conductor pattern which is symmetrical or substantially symmetrical to the pattern of the antenna coil, wherein the substrate and the auxiliary film are bonded to each other to bring the conductive film pattern of the antenna coil into connection to the conductor pattern of the auxiliary film.

Claim 8

The IC module according to claim 5, wherein the film has a hole for avoiding interference of the film with the IC chip.

Claim 9

The IC module according to claim 5, wherein the substrate and the film are bonded to each other via an anisotropic conductive film comprising conductive particles dispersed in an insulating resin.

Claim 10

An IC module comprising: a substrate, an IC chip mounted on the substrate, an antenna coil electrically connected to the IC chip, including a conductive film which is patterned on a surface of the substrate, an adhesive layer for bonding the substrate and the IC chip to each other, and a bond assisting layer disposed at a portion of the substrate for adhesion to the adhesive layer, the bond assisting layer being made of a material having a higher adhesion to the adhesive layer than the substrate.

Claim 11

An IC module comprising: a substrate, an IC chip mounted on the substrate, an antenna coil electrically connected to the IC chip, including a conductive film which is patterned on a surface of the substrate, an adhesive layer for bonding the substrate and the IC chip to each other, and a bond assisting layer disposed at a portion of the substrate for adhesion to the adhesive layer, the bond assisting layer being made of a material having a higher adhesion to the adhesive layer than the substrate.

Claim 12

The IC module according to claim 8, wherein the bond assisting layer is provided by the conductive film which also provides the antenna coil.

Claim 13

The IC module according to claim 9, wherein a part of the antenna coil provides the bond assisting layer.

Claim 14

The IC module according to claim 8, wherein the adhesive layer comprises an anisotropic conductive film including conductive particles dispersed in an insulating resin.

Claim 15

An IC module comprising: a substrate, an IC chip mounted on the substrate, and an antenna coil electrically connected to the IC chip, including a conductive film which is patterned on a surface of the substrate, wherein the substrate has weakening means adjacent the IC chip.

Claim 16

An IC module comprising: a substrate, an IC chip mounted on the substrate, and an antenna coil electrically connected to the IC chip, including a conductive film which is patterned on a surface of the substrate, wherein the substrate has weakening means adjacent the IC chip.

Claim 17

The IC module according to claim 12, wherein the weakening means comprises a plurality of perforations penetrating through the substrate around the IC chip.

Claim 18

An IC module comprising: a substrate, an IC chip mounted on the substrate, an antenna coil electrically connected to the IC chip, including a conductive film which is patterned on a surface of the substrate, and a sealing member for enclosing the IC chip, wherein the sealing member has weakening means.

Claim 19

An IC module comprising: a substrate, an IC chip mounted on the substrate, an antenna coil electrically connected to the IC chip, including a conductive film which is patterned on a surface of the substrate, and a sealing member for enclosing the IC chip, wherein the sealing member has weakening means.

Claim 20

The IC module according to claim 14, wherein the weakening means comprises a perforation which penetrates through the sealing member in its thickness direction.

Claim 21

The IC module according to claim 14, wherein the weakening means comprises a recess formed on an obverse surface of the sealing member.

Claim 22

The IC module according to claim 14, wherein the weakening means comprises a plurality of weakening portions arranged to surround the IC chip in plan view.

Claim 23

The IC module according to claim 14, wherein the IC chip is mounted at a central portion of the substrate, and wherein the substrate is shaped like a gear or a starfish in plan view with a plurality of projections extending radially from a portion of the substrate on which the IC chip is mounted.

Claim 24

The IC module according to claim 18, wherein the antenna coil is shaped like a gear or a starfish in plan view in conformity with the shape of the substrate.

Claim 25

The IC module according to claim 19, wherein the sealing member is shaped like a gear or a starfish in plan view in conformity with the shape of the substrate.

Claim 26

An IC module comprising: a substrate, an IC chip mounted on the substrate, an antenna coil electrically connected to the IC chip, including a conductive film which is patterned on a surface of the substrate, and a sealing member for enclosing the IC chip, wherein the IC chip is mounted at a central portion of the substrate, the substrate being formed with a plurality of slits extending from a peripheral edge of the substrate toward the central portion.

Claim 27

An IC module comprising: a substrate, an IC chip mounted on the substrate, an antenna coil electrically connected to the IC chip, including a conductive film which is patterned on a surface of the substrate, and a sealing member for enclosing the IC chip, wherein the IC chip is mounted at a central portion of the substrate, the substrate being formed with a plurality of slits extending from a peripheral edge of the substrate toward the central portion.

Claim 28

An IC module comprising: a substrate, an IC chip mounted on the substrate, an antenna coil electrically connected to the IC chip, including a conductive film which is patterned on a surface of the substrate, a covering member which is bonded to the substrate for covering the IC chip, and an elastic member interposed between the covering member and the IC chip, wherein the IC chip is pressed against the substrate by the elastic member.

Claim 29

An IC module comprising: a substrate, an IC chip mounted on the substrate, an antenna coil electrically connected to the IC chip, including a conductive film which is patterned on a surface of the substrate, a covering member which is bonded to the substrate for covering the IC chip, and an elastic member interposed between the covering member and the IC chip, wherein the IC chip is pressed against the substrate by the elastic member.

Claim 30

The IC module according to claim 22, wherein the covering member has a recess for housing the IC chip.

Claim 31

The IC module according to claim 23, wherein the covering member comprises a first sheet having a through-hole, and a second sheet bonded to the first sheet to close an opening of the through-hole at one end thereof.

Claim 32

An IC-card comprising an IC module which includes a substrate, an IC chip mounted on the substrate, and an antenna coil electrically connected to the IC chip, the antenna coil comprising a conductive film which is patterned on a surface of the substrate, wherein the antenna coil includes a spiral portion having a plurality of spiral turns, wherein the substrate is provided with a pair of terminals disposed outwardly of the spiral portion in connection to starting and terminating ends, respectively, of the antenna coil, wherein the IC chip has a main surface formed with a pair of electrodes for connection to the pair of terminals, wherein the antenna coil further includes a bent extension extending from the respective spiral turns, wherein the bent extension includes a first portion outwardly from each spiral turn toward the IC chip, a second portion extending from the first portion to pass between the pair of terminals, and a third portion extending inwardly from the second portion to a next spiral turn, and wherein the IC module is incorporated in a card member.

Claim 33

An IC-card comprising an IC module which includes a substrate, an IC chip mounted on the substrate, and an antenna coil electrically connected to the IC chip, the antenna coil comprising a conductive film which is patterned on a surface of the substrate, wherein the antenna coil includes a spiral portion having a plurality of spiral turns, wherein the substrate is provided with a pair of terminals disposed outwardly of the spiral portion in connection to starting and terminating ends, respectively, of the antenna coil, wherein the IC chip has a main surface formed with a pair of electrodes for connection to the pair of terminals, wherein the antenna coil further includes a bent extension extending from the respective spiral turns, wherein the bent extension includes a first portion outwardly from each spiral turn toward the IC chip, a second portion extending from the first portion to pass between the pair of terminals, and a third portion extending inwardly from the second portion to a next spiral turn, and wherein the IC module is incorporated in a card member.

Claim 34

The IC-card according to claim 25, wherein the card member comprises a card body having a receiving portion for housing the IC module, and at least one cover sheet bonded to the card body to close an opening of the receiving portion.

Claim 35

The IC-card according to claim 26, wherein the IC module includes a sealing member for sealing the IC chip, the sealing member having a lower modulus of elasticity than the card body.

Claim 36

The IC-card according to claim 27, wherein the substrate comprises a flexible substrate made of a flexible resin film as a base material.

Claim 37

The IC-card according to claim 26, wherein the IC module includes a sealing member for sealing the IC chip, the IC module and the cover sheet being bonded to each other via a flexible member which is lower in modulus of elasticity than the sealing member.

Claim 38

The IC-card according to claim 29, wherein the flexible member comprises a sheet made of a thermosetting resin.

Claim 39

The IC-card according to claim 26, wherein the IC chip is housed in the receiving portion of the card body with the IC chip supported by the cover sheet, a gap being formed between the IC chip and inner wall surfaces of the receiving portion.

Claim 40

The IC-card according to claim 25, wherein the IC chip is located at a peripheral portion of the card member.

Claim 41

The IC-card according to claim 32, wherein the card member is rectangular, the IC chip being located at or adjacent a corner of the card member.

Claim 42

An IC-card comprising an IC module which includes a substrate, an IC chip mounted on the substrate, and an antenna coil electrically connected to the IC chip, wherein the antenna coil includes a conductive film which is patterned on a surface of the substrate, wherein the antenna coil includes a spiral portion having a plurality of spiral turns, wherein the substrate is provided with a pair of terminals disposed inwardly of the spiral portion in connection to starting and terminating ends, respectively, of the antenna coil, wherein the IC chip has a main surface formed with a pair of electrodes for connection to the pair of terminals, wherein the antenna coil further includes a bent extension extending from the respective spiral turns, wherein the bent extension includes a first portion inwardly from each spiral turn toward the IC chip, a second portion extending from the first portion to pass between the pair of terminals, and a third portion extending outwardly from the second portion to a next spiral turn, and wherein the IC module is incorporated in a card member.

Claim 43

An IC-card comprising an IC module which includes a substrate, an IC chip mounted on the substrate, and an antenna coil electrically connected to the IC chip, wherein the antenna coil includes a conductive film which is patterned on a surface of the substrate, wherein the antenna coil includes a spiral portion having a plurality of spiral turns, wherein the substrate is provided with a pair of terminals disposed inwardly of the spiral portion in connection to starting and terminating ends, respectively, of the antenna coil, wherein the IC chip has a main surface formed with a pair of electrodes for connection to the pair of terminals, wherein the antenna coil further includes a bent extension extending from the respective spiral turns, wherein the bent extension includes a first portion inwardly from each spiral turn toward the IC chip, a second portion extending from the first portion to pass between the pair of terminals, and a third portion extending outwardly from the second portion to a next spiral turn, and wherein the IC module is incorporated in a card member.