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US5705852A Expired / Lapsed US ⏱️ 0.0 years remaining

Non-contact IC card and process for its production

Assignee: Dexerials Corp
•
Filing: 1996-04-09
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Granted: 1998-01-06
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Expires: 2016-04-09
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Abstract

Abstract In a non-contact IC card comprising a substrate and provided thereon at least an IC chip and an antenna coil formed by etching, a connecting terminal of the antenna coil and a connecting bump of the IC chip are interconnected in a face-down fashion via an anisotropic conductive adhesive layer, or interconnected by wire bonding.

Inventors

  • 👤 Katsuhisa Orihara
  • 👤 Masahiro Fujimoto
  • 👤 Haruo Monkawa
  • 👤 Hideyuki Kurita

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-05 03:37
CPC Classifications
G; G06; G06K; G06K19/00; G06K19/06; G06K19/067; G06K19/07; G06K19/077; G06K19/07749; G06K19/0775; G06K19/07773; G06K19/07777; G06K19/07779; G06K19/07783; H; H10; H10W; H10W72/00; H10W72/01; H10W72/011; H10W72/071; H10W72/072; H10W72/07251; H10W72/074; H10W72/20; H10W72/261; H10W72/30; H10W72/321; H10W72/325; H10W72/351; H10W72/352; H10W72/353; H10W72/354; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W90/00; H10W90/701; H10W90/721; H10W90/724; H10W90/751; H10W90/754; H10W90/758

Claims Analysis

Total Claims: 10
Claim 1
Independent Claim 129 words
A non-contact IC card that transfers information through an induction electromagnetic field serving as a transmission medium comprising: a substrate having at least an IC chip and an antenna coil formed by etching; wherein a connecting terminal of said antenna coil and a connecting bump of said IC chip are interconnected in a face-down fashion via an anisotropic conductive adhesive layer; the IC chip being formed across the antenna coil; wherein at least part of said antenna coil is decreased in width so that a distance between the connecting terminal on an inner peripheral side and the connecting terminal on an outer peripheral side of said antenna coil is substantially the same as a distance between the connecting bumps of said IC chip which are connected with the terminals.
Claim 2
Dependent Claim 129 words
A non-contact IC card that transfers information through an induction electromagnetic field serving as a transmission medium comprising: a substrate having at least an IC chip and an antenna coil formed by etching; wherein a connecting terminal of said antenna coil and a connecting bump of said IC chip are interconnected in a face-down fashion via an anisotropic conductive adhesive layer; the IC chip being formed across the antenna coil; wherein at least part of said antenna coil is decreased in width so that a distance between the connecting terminal on an inner peripheral side and the connecting terminal on an outer peripheral side of said antenna coil is substantially the same as a distance between the connecting bumps of said IC chip which are connected with the terminals.
Claim 3
Dependent Claim 31 words
The non-contact IC card according to claim 1, wherein a tuning capacitor which constitutes an resonance circuit, and a voltage smoothing capacitor are provided within the area of the IC chip.
Claim 4
Dependent Claim 39 words
The non-contact IC card according to claim 1, wherein a tuning capacitor which constitutes an resonance circuit, and/or a voltage smoothing capacitor is/are provided on the substrate separately from said IC chip, and these capacitors are formed by etching.
Claim 5
Dependent Claim 123 words
A non-contact IC card that transfers information through an induction electromagnetic field serving as a transmission medium comprising: a substrate having at least an IC chip and an antenna coil formed by etching, wherein a connecting terminal of said antenna coil and a connecting bump of said IC chip are directly interconnected by wire bonding, the IC chip being formed across the antenna coil, wherein at least part of said antenna coil is decreased in width so that a distance between the connecting terminal on an inner peripheral side and the connecting terminal on an outer peripheral side of said antenna coil is substantially the same as a distance between the connecting bumps of said IC chip which are connected with the terminals.
Claim 6
Dependent Claim 123 words
A non-contact IC card that transfers information through an induction electromagnetic field serving as a transmission medium comprising: a substrate having at least an IC chip and an antenna coil formed by etching, wherein a connecting terminal of said antenna coil and a connecting bump of said IC chip are directly interconnected by wire bonding, the IC chip being formed across the antenna coil, wherein at least part of said antenna coil is decreased in width so that a distance between the connecting terminal on an inner peripheral side and the connecting terminal on an outer peripheral side of said antenna coil is substantially the same as a distance between the connecting bumps of said IC chip which are connected with the terminals.
Claim 7
Dependent Claim 31 words
The non-contact IC card according to claim 4, wherein a tuning capacitor which constitutes an resonance circuit, and a voltage smoothing capacitor are provided within the area of the IC chip.
Claim 8
Dependent Claim 39 words
The non-contact IC card according to claim 4, wherein a tuning capacitor which constitutes an resonance circuit, and/or a voltage smoothing capacitor is/are provided on the substrate separately from said IC chip, and these capacitors are formed by etching.
Claim 9
Dependent Claim 96 words
A process for producing a non-contact IC card, comprising the steps of; forming a resist layer having at least an antenna coil pattern, on a conductive layer provided on an insulating substrate; etching the conductive layer, using the resist layer as a mask, to form at least an antenna coil and a connecting terminal thereof; forming an anisotropic conductive adhesive layer on the connecting terminal of the antenna coil; and interconnecting the connecting terminal of the antenna coil and a connecting bump of an IC chip in a face-down fashion via the anisotropic conductive adhesive layer.
Claim 10
Dependent Claim 96 words
A process for producing a non-contact IC card, comprising the steps of; forming a resist layer having at least an antenna coil pattern, on a conductive layer provided on an insulating substrate; etching the conductive layer, using the resist layer as a mask, to form at least an antenna coil and a connecting terminal thereof; forming an anisotropic conductive adhesive layer on the connecting terminal of the antenna coil; and interconnecting the connecting terminal of the antenna coil and a connecting bump of an IC chip in a face-down fashion via the anisotropic conductive adhesive layer.

References Cited (Backward Citations)

US5448110A Cited
US5598032A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 2001-01-05 2001-07-07 2002-01-06 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2005-01-05 2005-07-07 2006-01-06 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2009-01-05 2009-07-07 2010-01-06 $7700.00 Window Closed / Lapsed

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