US6717275B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor module
Assignee: Renesas Electronics Corp
•
Filing: 2002-04-30
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Granted: 2004-04-06
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Expires: 2022-04-30
Abstract
Abstract A plurality of substrates are stacked on top of each other. A flexible cable serially connects the substrates. Semiconductor packages are mounted on the surfaces of the substrates. An adhesive material bonds adjoining semiconductor packages and holds the semiconductor packages in place with respect to each other. The bottommost substrate is provided with external leads by which the semiconductor module is mounted on the motherboard.
Inventors
- 👤 Tetsuya Matsuura
- 👤 Yasushi Kasatani
- 👤 Tadashi Ichimasa
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 12:00
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/14; H05K1/147; H10; H10W; H10W72/00; H05K1/18; H05K1/189; H10W70/00; H10W70/60; H10W70/611; H10W70/67; H10W70/688; H10W90/00; H05K1/141; H10W70/40; H10W90/20
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
47 words
A semiconductor module comprising a plurality of substrates connected serially through a common flexible cable and stacked together, wherein semiconductor chips are mounted on at least mutually facing surfaces of said substrates, and said semiconductor chips of adjoining ones of said substrates being bonded to each other.
Claim 2
Dependent Claim
47 words
A semiconductor module comprising a plurality of substrates connected serially through a common flexible cable and stacked together, wherein semiconductor chips are mounted on at least mutually facing surfaces of said substrates, and said semiconductor chips of adjoining ones of said substrates being bonded to each other.
Claim 3
Dependent Claim
41 words
The semiconductor module according to claim 1 , further comprising a motherboard, wherein at least one of an outermost substrate in said stacked substrates is provided with external connecting terminals by which said outermost substrate can be mounted on said motherboard.
Claim 4
Dependent Claim
32 words
The semiconductor module according to claim 1 , wherein said flexible cable penetrates each of the substrates, and said semiconductor chips are each connected to the flexible cable within the corresponding substrates.
Claim 5
Dependent Claim
21 words
The semiconductor module according to claim 2 , wherein said external connecting terminals are leads extending outward from said outermost substrate.
Claim 6
Dependent Claim
49 words
The semiconductor module according to claim 2 , wherein a plurality of sockets corresponding to said external connecting terminals of said substrates are provided on said motherboard, and said external connecting terminals are connector pins that can be inserted into or removed from said sockets provided on said motherboard.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2007-04-06 | 2007-10-06 | 2008-04-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2011-04-06 | 2011-10-06 | 2012-04-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2015-04-06 | 2015-10-06 | 2016-04-06 | $7700.00 | Window Closed / Lapsed |