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US20020105068A1
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US
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Stacked semiconductor device structure
Assignee: Renesas Technology Corp
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Filing: 2001-09-07
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Granted: —
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Expires: 2021-09-07
Abstract
Abstract A stacked semiconductor device structure comprising: a plurality of semiconductor modules each of which includes a substrate and at least one semiconductor device mounted on the substrate; a stacking device for stacking the semiconductor modules on one another; and a surface mount device for surface mounting on a further substrate for a system appliance the semiconductor modules stacked on one another by the stacking device.
Inventors
- 👤 Takakazu Fukumoto
- 👤 Muneharu Tokunaga
- 👤 Tetsuya Matsuura
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 12:57
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/14; H05K1/144; H05K1/141; H10; H10W; H10W90/00; H05K1/18; H05K1/182; H05K1/183; H05K2201/00; H05K2201/04; H05K2201/049; H05K2201/10; H05K2201/10227; H05K2201/10378; H05K2201/10386; H05K2201/10431; H05K2201/10439; H05K2201/10477; H05K2201/10507; H05K2201/10515; H05K2201/10613; H05K2201/10621; H05K2201/10689; H05K2203/00; H05K2203/15; H05K2203/1572; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3421; H05K3/3431; H05K3/3436; H10W70/00; H10W70/40; H10W70/60; H10W72/00; H10W72/834; H10W90/20; H10W90/22; H10W90/297
Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
67 words
1 . A stacked semiconductor device structure comprising: a plurality of semiconductor modules each of which includes a substrate and at least one semiconductor device mounted on the substrate; a stacking means for stacking the semiconductor modules on one another; and a surface mount means for surface mounting on a further substrate for a system appliance the semiconductor modules stacked on one another by the stacking means.
Claim 2
Dependent Claim
67 words
1 . A stacked semiconductor device structure comprising: a plurality of semiconductor modules each of which includes a substrate and at least one semiconductor device mounted on the substrate; a stacking means for stacking the semiconductor modules on one another; and a surface mount means for surface mounting on a further substrate for a system appliance the semiconductor modules stacked on one another by the stacking means.
Claim 3
Dependent Claim
27 words
2 . A stacked semiconductor device structure according to claim 1 , wherein the stacking means and the surface mount means are constituted by clip type leads.
Claim 4
Dependent Claim
27 words
3 . A stacked semiconductor device structure according to claim 1 , wherein the stacking means and the surface mount means are constituted by pin type leads.
Claim 5
Dependent Claim
30 words
4 . A stacked semiconductor device structure according to claim 1 , wherein the stacking means includes solder balls provided between the substrates of neighboring ones of the semiconductor modules.
Claim 6
Dependent Claim
57 words
5 . A stacked semiconductor device structure according to claim 4 , wherein the stacking means includes an interconnection substrate formed with only a wiring pattern and having a through-hole and the interconnection substrate is provided between the substrates of neighboring ones of the semiconductor modules such that the semiconductor device is partially fitted into the through-hole.
Claim 7
Dependent Claim
68 words
6 . A stacked semiconductor device structure according to claim 4 , wherein the stacking means includes an interconnection substrate formed with only a wiring pattern and split into a plurality of substrate sections and the interconnection substrate is provided between the substrates of neighboring ones of the semiconductor modules such that the semiconductor device is partially fitted into a clearance between neighboring ones of the substrate sections.
Claim 8
Dependent Claim
36 words
7 . A stacked semiconductor device structure according to claim 1 , wherein the stacking means includes a flexible wiring board and a fixing pin provided between the substrates of neighboring ones of the semiconductor modules.
Claim 9
Dependent Claim
32 words
8 . A stacked semiconductor device structure according to claim 1 , wherein the surface mount means includes solder balls provided beneath the substrate of a lowermost one of the semiconductor modules.
Claim 10
Dependent Claim
59 words
9 . A stacked semiconductor device structure according to claim 8 , wherein the surface mount means includes an interconnection substrate formed with only a wiring pattern and having a through-hole and the interconnection substrate is provided under the substrate of the lowermost one of the semiconductor modules such that the semiconductor device is partially fitted into the through-hole.
Claim 11
Dependent Claim
70 words
10 . A stacked semiconductor device structure according to claim 8 , wherein the surface mount means includes an interconnection substrate formed with only a wiring pattern and split into a plurality of substrate sections and the interconnection substrate is provided under the substrate of the lowermost one of the semiconductor modules such that the semiconductor device is partially fitted into a clearance between neighboring ones of the substrate sections.
Claim 12
Dependent Claim
42 words
11 . A stacked semiconductor device structure according to claim 8 , wherein the solder balls are arranged in a rectangular array and a dummy solder ball is provided outside each of four comers of the rectangular array of the solder balls.
Claim 13
Dependent Claim
43 words
12 . A stacked semiconductor device structure according to claim 8 , wherein a distance between one of the solder balls and each of the remaining ones of the solder balls is set at a product of a desired pitch and an integer.
Claim 14
Dependent Claim
31 words
13 . A stacked semiconductor device structure according to claim 1 , wherein the substrate is formed with a recess such that the semiconductor device is partially fitted into the recess.
Claim 15
Dependent Claim
31 words
14 . A stacked semiconductor device structure according to claim 1 , wherein the substrate is formed with a through-hole such that the semiconductor device is partially fitted into the through-hole.
Claim 16
Dependent Claim
41 words
15 . A stacked semiconductor device structure according to claim 1 , wherein the substrate is split into a plurality of substrate sections such that the semiconductor device is partially fitted into a clearance between neighboring ones of the substrate sections.
Claim 17
Dependent Claim
62 words
16 . A stacked semiconductor device structure according to claim 1 , wherein in one of the semiconductor modules, the semiconductor device includes a package and a plurality of L-shaped leads for mounting the package on the substrate and an upper face of a distal end portion of each of the L-shaped leads is attached to a lower face of the substrate.
Claim 18
Dependent Claim
82 words
17 . A stacked semiconductor device structure according to claim 1 , wherein in one of the semiconductor modules, a plurality of the semiconductor devices are mounted on the substrate and each include a package and a plurality of leads for mounting the package on the substrate such that the leads of the semiconductor devices are arranged at an identical pitch; wherein centers of the packages of the semiconductor devices are spaced an interval not more than the pitch from one another.
Claim 19
Dependent Claim
43 words
18 . A stacked semiconductor device structure comprising: a semiconductor module which includes a substrate and a plurality of semiconductor devices mounted on the substrate; and an interconnection substrate which is formed with only a wiring pattern and is provided under the substrate.
Claim 20
Dependent Claim
43 words
18 . A stacked semiconductor device structure comprising: a semiconductor module which includes a substrate and a plurality of semiconductor devices mounted on the substrate; and an interconnection substrate which is formed with only a wiring pattern and is provided under the substrate.
Claim 21
Dependent Claim
41 words
19 . A stacked semiconductor device structure according to claim 18 , wherein an outer contour of the substrate of the semiconductor module as observed from above is surrounded by an outer contour of the interconnection substrate as observed from above.
Claim 22
Dependent Claim
60 words
20 . A stacked semiconductor device structure comprising: a semiconductor module which includes a substrate formed with a recess and a plurality of semiconductor devices mounted on the substrate; and a surface mount means for surface mounting the semiconductor module on a further substrate for a system appliance such that one of the semiconductor devices is fitted into the recess.
Claim 23
Dependent Claim
60 words
20 . A stacked semiconductor device structure comprising: a semiconductor module which includes a substrate formed with a recess and a plurality of semiconductor devices mounted on the substrate; and a surface mount means for surface mounting the semiconductor module on a further substrate for a system appliance such that one of the semiconductor devices is fitted into the recess.
References Cited (Backward Citations)
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