High density multichip module packaging structure

Claim 1

A multichip module packaging structure comprising: a mother board having a plurality of first pads provided on a peripheral region of a top surface thereof; a substrate having a plurality of second pads provided on a peripheral region of a bottom surface thereof, said substrate being mounted over said mother board through a frame member, said frame member being provided to extend successively on a peripheral region of said bottom surface of said substrate and further extend downward from said bottom surface of said substrate so as to surround a sealing resin material, said frame member having a top portion mechanically bonded with said bottom surface of said substrate; a plurality of terminals, each of said terminals comprising: a side portion extending on an outside face of said frame member between top and bottom portions of said frame member; and a bottom portion extending on a bottom portion of said frame member, said bottom portion being united with said side portion, said frame member being mechanically connected through said bottom portions of said terminals to said mother board so as to form a three dimensional space surrounded by said frame member, said terminals electrically connecting said first pads and said second pads; and a plurality of semiconductor integrated circuit chips being provided on said bottom surface of said substrate so that said chips are completely embedded within said sealing resin material surrounded by said frame, within said three dimensional space, wherein each of said semiconductor integrated circuit chips is electrically connected to a part of said second pads, said part is positioned relatively closer to said chip than the remaining part of said second pads, whereby each said chip is electrically connected to said second pads via said first pads and said terminals which are closer to each said chip.