Package for high-speed device

Abstract

Abstract PURPOSE:To transmit a high-frequency signal efficiently by arranging and forming a plurality of via fills connected as being longitudinally crossed in a plurality of layer members to the layer members near a signal conductor while shaping a conductor circuit connecting a plurality of the via fills onto the surfaces of a plurality of the layer members. CONSTITUTION:A plurality of via fills 40 connected while being longitudinally crossed in a plurality of layer members 12 and filled with a conductor such as tungsten metallized are disposed and shaped to a plurality of the layer members 12 near a longitudinal signal conductor 32 at small pitches in parallel with the longitudinal signal conductor 32. Conductor circuits 50 bonding a plurality of the via fills 40 and composed of tungsten metallized are formed onto the surfaces of a plurality of the lower members 12. Latticed dummy ground planes 60 are shaped in parallel with the signal conductor near the longitudinal signal conductor 32 in a plurality of the via fills 40 and the conductor circuits 50 connecting the via fills 40. The longitudinal signal conductor 32 is formed in a line close to a microstrip transmission line. Accordingly, the matching of characteristic impedance in the signal conductor and crosstalk between the adjacent signal conductors can be prevented accurately.

Inventors

• 👤 Fumio Miyagawa
• 👤 文雄 宮川
• 👤 Toshiichi Takenouchi
• 👤 竹之内　敏一

Bibliographic Details