US4827082A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Ceramic package
Assignee: Shinko Electric Industries Co Ltd
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Filing: 1988-06-16
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Granted: 1989-05-02
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Expires: 2008-06-16
Abstract
Abstract A ceramic package includes a high thermal conductive ceramic substrate (AlN or SiC sintered substrate) on which a semiconductor element is mounted, and a mullite sintered frame having metal conductive paths therein and joined to the substrate.
Inventors
- 👤 Michio Horiuchi
- 👤 Kihou Mizushima
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 10:37
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/69; H10W70/692; H10W70/68; H10W70/682; H10W70/685; H10W72/00; H10W72/071; H10W72/073; H10W72/07331; H10W72/07336; H10W72/30; H10W72/351; H10W72/352; H10W72/851; H10W72/874; H10W72/884; H10W90/00; H10W90/701; H10W90/731; H10W90/734; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
55 words
A ceramic package comprising: a substrate made of a highly thermal conductive ceramic material selected from the group consisting of sintered aluminum nitride and sintered silicon carbide; at least one semiconductor element mounted on the substrate; and a frame made of a mullite sintered body having metal conductive paths therein and joined to said substrate.
Claim 2
Dependent Claim
55 words
A ceramic package comprising: a substrate made of a highly thermal conductive ceramic material selected from the group consisting of sintered aluminum nitride and sintered silicon carbide; at least one semiconductor element mounted on the substrate; and a frame made of a mullite sintered body having metal conductive paths therein and joined to said substrate.
Claim 3
Dependent Claim
33 words
A ceramic package according to claim 1, wherein said frame is a multilayer body and said paths have opposite end pads, one of which is connectable to said at least one semiconductor element.
Claim 4
Dependent Claim
35 words
A ceramic package according to claim 2, further comprising a lid placed on said frame over the at least one semiconductor element, and hermetic sealing means for joining said lid to said frame hermetic sealing.
Claim 5
Dependent Claim
23 words
A ceramic package according to claim 2, further comprising wires for connecting said at least one semiconductor element and said opposite end pad.
Claim 6
Dependent Claim
43 words
A ceramic package according to claim 1, further comprising a bonding medium for bonding said frame to said substrate, said bonding medium being selected from the group consisting of glass and a brazing metal and being placed between said frame and said substrate.
Claim 7
Dependent Claim
23 words
A ceramic package according to claim 5, further comprising a nickel-phosphorus plating layer selectively formed on said substrate and under said bonding medium.
Claim 8
Dependent Claim
16 words
A ceramic package according to claim 1, wherein said frame is directly joined to said substrate.
Claim 9
Dependent Claim
22 words
A ceramic package according to claim 1, wherein said frame is joined to said substrate by a magnesium oxide-containing layer formed therebetween.
Claim 10
Dependent Claim
22 words
A ceramic package according to claim 1, wherein said frame is joined to said substrate by a yttrium oxide-containing layer formed therebetween.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-05-01 | 1992-10-31 | 1993-05-02 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-05-01 | 1996-10-31 | 1997-05-02 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-05-01 | 2000-10-31 | 2001-05-02 | $7700.00 | Window Closed / Lapsed |