US6593660B2
Expired / Lapsed
US
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Plasma treatment to enhance inorganic dielectric adhesion to copper
Assignee: International Business Machines Corp
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Filing: 2001-05-29
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Granted: 2003-07-15
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Expires: 2021-05-29
Abstract
Abstract The present invention utilizes a reducing plasma treatment step to enhance the adhesion of a subsequently deposited inorganic barrier film to a copper wire or via present in a semiconductor interconnect structure such as a dual damascene structure. Interconnect structure including a material layer of Cu, Si and O, as essential elements, is formed between said copper wire or via and the inorganic barrier film.
Inventors
- 👤 Leena P. Buchwalter
- 👤 Barbara Luther
- 👤 Paul D. Agnello
- 👤 John P. Hummel
- 👤 Terence Lawrence Kane
- 👤 Dirk Karl Manger
- 👤 Paul Stephen McLaughlin
- 👤 Anthony Kendall Stamper
- 👤 Yun Yu Wang
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 08:43
CPC Classifications
H; H10; H10W; H10W20/00; H10W20/01; H10W20/071; H10D; H10D64/00; H10D64/01; H10D64/011; H10W20/074; H10W20/077; H10D62/00; H10D62/80; H10D62/83; H10D62/832; H10D62/8325; H10P; H10P14/00; H10P14/60; H10P14/63; H10P14/6326; H10P14/6328; H10P14/6334; H10P14/6336; H10P14/66; H10P14/668; H10P14/6681; H10P14/6682; H10P14/68; H10P14/683; H10P14/687; H10P14/69; H10P14/6902; H10P14/6903; H10P14/6905; H10P14/692; H10P14/6921; H10P14/69215; H10P14/6922; H10P14/694; H10P14/6943; H10P14/69433; H10W20/081; H10W20/084
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
39 words
An interconnect structure comprising at least one copper line or via; a material layer comprising Cu, Si and O located atop said at least on copper line or via; and an inorganic barrier layer located atop said material layer.
Claim 2
Dependent Claim
39 words
An interconnect structure comprising at least one copper line or via; a material layer comprising Cu, Si and O located atop said at least on copper line or via; and an inorganic barrier layer located atop said material layer.
Claim 3
Dependent Claim
21 words
The interconnect structure of claim 1 wherein said material layer further includes at least one of C, H, N and F.
Claim 4
Dependent Claim
14 words
The interconnect structure of claim 1 wherein said material layer is a continuous layer.
Claim 5
Dependent Claim
18 words
The interconnect structure of claim 1 wherein said material layer has a thickness of less than 10 nm.
Claim 6
Dependent Claim
20 words
The interconnect structure of claim 4 wherein said material layer has a thickness of from 1 to about 5 nm.
Claim 7
Dependent Claim
14 words
The interconnect structure of claim 1 wherein said material layer has a variable thickness.
Claim 8
Dependent Claim
26 words
The interconnect structure of claim 1 wherein barrier layer is composed of Si 3 N 4 , SiC, hydrogenated Si 3 N 4 or hydrogenated SiC.
Claim 9
Dependent Claim
20 words
The interconnect structure of claim 7 wherein said inorganic barrier film is hydrogenated Si 3 N 4 or hydrogenated SiC.
Claim 10
Dependent Claim
20 words
The interconnect structure of claim 1 further comprising a dielectric material about said at least one copper line or via.
Claim 11
Dependent Claim
41 words
The interconnect structure of claim 9 wherein said dielectric material is selected from the group consisting of SiO 2 , fluorinated SiO 2 , S 3 N 4 , polyimides, diamond, diamond-like carbon, silicon polymers, paralyene polymers and fluorinated diamond-like carbon.
Claim 12
Dependent Claim
14 words
The interconnect structure of claim 10 wherein said dielectric material is SiO 2 .
Claim 13
Dependent Claim
47 words
The interconnect structure of claim 1 wherein said inorganic barrier film is Si 3 N 4 and said material layer contains Cu, Si, O and N, whereby said material layer improves the adhesion of said copper line or via and said Si 3 N 4 barrier film.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2006-07-14 | 2007-01-13 | 2007-07-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2010-07-14 | 2011-01-13 | 2011-07-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2014-07-14 | 2015-01-13 | 2015-07-15 | $7700.00 | Window Closed / Lapsed |