Crack-preventive semiconductor package

Claim 1

A semiconductor package, comprising: a lead frame having a plurality of leads, each of the leads being formed at an inner end thereof with a protruding portion that is dimensioned smaller in thickness than the rest part of the lead, wherein the protruding portion has at least a first surface and a second surface opposed to the first surface, and wherein the first surface is defined with at least a first bonding region and a conductive-element corresponding region free of overlap with the first bonding region, and the second surface is defined with a second bonding region that is vertically aligned with the conductive-element corresponding region, wherein the second bonding region is not vertically aligned with the first bonding region formed on the first surface of the protruding portion; at least a first semiconductor chip having an active surface and a non-active surface opposed to the active surface, wherein the active surface faces downwardly and is connected to the first bonding regions by a plurality of bonding wires, so as to allow the first semiconductor chip to be electrically coupled to the leads; at least a second semiconductor chip having an active surface and a non-active surface opposed to the active surface, and mounted on the first semiconductor chip, wherein the active surface is electrically connected to the second bonding regions by a plurality of conductive elements; and an encapsulant for encapsulating the first and second semiconductor chips, the bonding wires and the conductive elements.