US6509642B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Integrated circuit package
Assignee: Bell Semiconductor LLC
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Filing: 2000-07-28
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Granted: 2003-01-21
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Expires: 2020-07-28
Abstract
Abstract An integrated circuit package where the integrated circuit chip is mounted on a conductive slug and electrically coupled to the slug. Besides acting as a heat spreader, the conductive slug may also function as a ground plane. This reduces the need for additional conductive layers and plated through hole connections for forming connections to, for example, ground. As a result, the conductive paths in the internal ground planes are not necessarily cut off by the plated through holes used for interconnecting ground connections thus avoiding some of the electrical performance degradation suffered by prior techniques. In addition, the invention allows more signals to be added and/or the size of the integrated circuit chip to be reduced to enhance electrical performance. It is to be understood that both the foregoing general description and the following detailed description are exemplary, but are not restrictive, of the invention.
Inventors
- 👤 Charles Cohn
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 11:20
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/10; H10W72/00; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W70/682; H10W70/685; H10W72/071; H10W72/075; H10W72/07551; H10W72/07554; H10W72/50; H10W72/541; H10W72/547; H10W72/851; H10W72/874; H10W72/884; H10W74/00; H10W90/00; H10W90/701; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 21
Claim 1
Independent Claim
81 words
An integrated circuit package comprising: a conductive slug; a layer formed on the outer surfaces of the conductive slug, the layer having a first segment comprising a first material and a second segment comprising a second material different from the first material; an integrated circuit chip having a footprint on the first material; and an electrically conductive element extending from the integrated circuit chip to the conductive slug and contacting the second material to connect the integrated circuit chip to ground.
Claim 2
Dependent Claim
81 words
An integrated circuit package comprising: a conductive slug; a layer formed on the outer surfaces of the conductive slug, the layer having a first segment comprising a first material and a second segment comprising a second material different from the first material; an integrated circuit chip having a footprint on the first material; and an electrically conductive element extending from the integrated circuit chip to the conductive slug and contacting the second material to connect the integrated circuit chip to ground.
Claim 3
Dependent Claim
17 words
The integrated circuit package of claim 1 further comprising a substrate package coupled to the conductive slug.
Claim 4
Dependent Claim
31 words
The integrated circuit package of claim 2 wherein the substrate package includes at least a first conductive layer where the integrated circuit chip is electrically coupled to the first conductive layer.
Claim 5
Dependent Claim
28 words
The integrated circuit package of claim 3 wherein the substrate package includes a second conductive layer where the conductive slug is electrically coupled to the second conductive layer.
Claim 6
Dependent Claim
24 words
The integrated circuit package of claim 4 wherein the first conductive layer is electrically isolated from the second conductive layer in the substrate package.
Claim 7
Dependent Claim
30 words
The integrated circuit package of claim 4 wherein the substrate package includes at least three conductive layers and the integrated circuit chip is electrically coupled to the third conductive layer.
Claim 8
Dependent Claim
19 words
The integrated circuit package of claim 2 wherein the substrate package is configured to be mounted on a motherboard.
Claim 9
Dependent Claim
14 words
The integrated circuit package of claim 7 wherein the substrate is a circuit board.
Claim 10
Dependent Claim
30 words
The integrated circuit package of claim 2 wherein the substrate package has plated through holes and the conductive slug is electrically coupled to at least one of the through holes.
Claim 11
Dependent Claim
22 words
The integrated circuit package of claim 1 wherein the integrated circuit chip is both mechanically and electrically coupled to the conductive slug.
Claim 12
Dependent Claim
15 words
The integrated circuit package of claim 1 wherein the conductive slug forms a heat sink.
Claim 13
Dependent Claim
29 words
The integrated circuit package recited in claim 1 wherein the second material comprises one or more conductive layers selected from the group consisting of nickel, gold and alloys thereof.
Claim 14
Dependent Claim
106 words
An integrated circuit package comprising: a conductive slug; a layer formed on the outer surfaces of the conductive slug, the layer having a first segment comprising a first material and a second segment comprising a second material different from the first material; an integrated circuit chip having a footprint on the first material; a substrate package having a plurality of conductive layers, at least one of the plurality of conductive layers electrically coupled to the integrated circuit chip; and an electrically conductive element extending from the integrated circuit chip to the conductive slug and contacting the second material to connect the integrated circuit chip to ground.
Claim 15
Dependent Claim
106 words
An integrated circuit package comprising: a conductive slug; a layer formed on the outer surfaces of the conductive slug, the layer having a first segment comprising a first material and a second segment comprising a second material different from the first material; an integrated circuit chip having a footprint on the first material; a substrate package having a plurality of conductive layers, at least one of the plurality of conductive layers electrically coupled to the integrated circuit chip; and an electrically conductive element extending from the integrated circuit chip to the conductive slug and contacting the second material to connect the integrated circuit chip to ground.
Claim 16
Dependent Claim
19 words
The integrated circuit package of claim 13 wherein the substrate package is configured to be mounted on a motherboard.
Claim 17
Dependent Claim
14 words
The integrated circuit package of claim 14 wherein the substrate is a circuit board.
Claim 18
Dependent Claim
30 words
The integrated circuit package of claim 13 wherein the substrate package has through holes and the conductive slug is electrically coupled to at least one of the plated through holes.
Claim 19
Dependent Claim
22 words
The integrated circuit package of claim 13 wherein the integrated circuit chip is both mechanically and electrically coupled to the conductive slug.
Claim 20
Dependent Claim
15 words
The integrated circuit package of claim 13 wherein the conductive slug forms a heat sink.
Claim 21
Dependent Claim
29 words
The integrated circuit package recited in claim 13 wherein the second material comprises one or more conductive layers selected from the group consisting of nickel, gold and alloys thereof.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2006-01-20 | 2006-07-22 | 2007-01-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2010-01-20 | 2010-07-22 | 2011-01-21 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2014-01-20 | 2014-07-22 | 2015-01-21 | $7700.00 | Window Closed / Lapsed |