US6133623A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Resin sealing type semiconductor device that includes a plurality of leads and method of making the same
Assignee: Seiko Epson Corp
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Filing: 1997-06-27
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Granted: 2000-10-17
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Expires: 2017-06-27
Abstract
Abstract A resin sealing type semiconductor device comprises an element mounting member (10) having an element mounting surface (12), a semiconductor element (20) bonded to the element mounting surface (12), a plurality of leads (30) provided and separated from the semiconductor element (20), a frame lead (36) disposed between these leads (30) and the semiconductor element (20), various wires (40) and a resin sealing portion which seals the element mounting member (10), the semiconductor element (20), parts of the leads (30) and the frame lead (36). The leads (30) include first inner leads (32a) disposed discontinuously with the frame lead (36) and second leads (32b) disposed integrally with the frame lead (36). The resin sealing type semiconductor device has good heat radiation characteristics and high reliability. Wire bonding with a highly flexible wiring arrangement design is provided by using leads commonly.
Inventors
- 👤 Tetsuya Otsuki
- 👤 Kenzo Yoshimori
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 11:50
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/01; H10W74/016; H10W40/00; H10W40/70; H10W40/77; H10W40/778; H10W72/00; H10W72/50; H10W74/10; H10W74/111; H10W74/121; H10W90/00; H10W90/811; H10W72/071; H10W72/075; H10W72/07551; H10W72/07554; H10W72/541; H10W72/5449; H10W72/547; H10W72/551; H10W72/552; H10W72/5522; H10W72/90; H10W72/931; H10W72/932; H10W74/127; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 28
Claim 1
Independent Claim
220 words
A resin sealing type semiconductor device, comprising: an element mounting member having an element mounting surface for mounting a semiconductor element; a semiconductor element bonded to said element mounting surface of said element mounting member; a frame lead disposed around a periphery of said semiconductor element and separated from said semiconductor element and said element mounting surface, said frame lead being continuous around said periphery of said semiconductor element; a plurality of leads disposed on and insulated from said element mounting member by an insulating lead support, said leads being separated from said semiconductor element; a plurality of wires including wires electrically connecting said leads with the electrodes of said semiconductor element and wires electrically connecting said frame lead with the electrodes of said semiconductor element; and a plurality of support bars supporting said frame lead at the corners of said frame lead; a resin sealing portion for sealing said element mounting member, said semiconductor element, parts of said leads and said frame lead, and wherein said plurality of leads comprises: first leads disposed discontinuously with said frame lead; and second leads disposed integrally with said frame and between adjacent support bars; said frame lead is supported by said support bars and said second leads, so as to be in non-contact with said element mounting member and said semiconductor element.
Claim 2
Dependent Claim
220 words
A resin sealing type semiconductor device, comprising: an element mounting member having an element mounting surface for mounting a semiconductor element; a semiconductor element bonded to said element mounting surface of said element mounting member; a frame lead disposed around a periphery of said semiconductor element and separated from said semiconductor element and said element mounting surface, said frame lead being continuous around said periphery of said semiconductor element; a plurality of leads disposed on and insulated from said element mounting member by an insulating lead support, said leads being separated from said semiconductor element; a plurality of wires including wires electrically connecting said leads with the electrodes of said semiconductor element and wires electrically connecting said frame lead with the electrodes of said semiconductor element; and a plurality of support bars supporting said frame lead at the corners of said frame lead; a resin sealing portion for sealing said element mounting member, said semiconductor element, parts of said leads and said frame lead, and wherein said plurality of leads comprises: first leads disposed discontinuously with said frame lead; and second leads disposed integrally with said frame and between adjacent support bars; said frame lead is supported by said support bars and said second leads, so as to be in non-contact with said element mounting member and said semiconductor element.
Claim 3
Dependent Claim
24 words
The resin sealing type semiconductor device as defined in claim 1, wherein said frame lead and second leads are used as power supply leads.
Claim 4
Dependent Claim
35 words
The resin sealing type semiconductor device as defined in claim 1, wherein said first leads comprise an inner lead, an end of said inner lead overlapping said element mounting surface of said element mounting member.
Claim 5
Dependent Claim
78 words
The resin sealing type semiconductor device as defined in claim 3, wherein said insulating lead support is bonded to said element mounting member and said leads so that a portion of said insulating lead support is in-between said element mounting member and said leads, said insulating lead support allowing free ends of said inner lead of each of said first leads to contact said element mounting surface of said element mounting member within the limit of resilient deformation.
Claim 6
Dependent Claim
28 words
The resin sealing type semiconductor device as defined in claim 4, wherein said insulating lead support is continuously formed around an entire periphery of said element mounting surface.
Claim 7
Dependent Claim
27 words
The resin sealing type semiconductor device as defined in claim 4, wherein said insulating lead support is formed partially around the periphery of said element mounting surface.
Claim 8
Dependent Claim
23 words
The resin sealing type semiconductor device as defined in claim 1, wherein said element mounting member comprises a substance having high thermal conductivity.
Claim 9
Dependent Claim
20 words
The resin sealing type semiconductor device as defined in claim 1, wherein said element mounting member comprises a conductive material.
Claim 10
Dependent Claim
34 words
The resin sealing type semiconductor device as defined in claim 8, wherein said element mounting member comprises at least one of copper, aluminum, silver, gold and an alloy having these metals as principal component.
Claim 11
Dependent Claim
58 words
The resin sealing type semiconductor device as defined in claim 1, wherein at least one of a first conducting layer and a second conducting layer is formed on said element mounting surface, said first conducting layer providing a ground for the electrodes of said semiconductor element and said second conducting layer providing a ground for said first leads.
Claim 12
Dependent Claim
28 words
The resin sealing type semiconductor device as defined in claim 10, wherein said first and second conducting layers comprise at least one of silver, gold, palladium and aluminum.
Claim 13
Dependent Claim
25 words
The resin sealing type semiconductor device as defined in claim 10, wherein said first and second conducting layers are formed in a mutually separated manner.
Claim 14
Dependent Claim
24 words
The resin sealing type semiconductor device as defined in claim 10, wherein said first and second conducting layers are formed in a continuous manner.
Claim 15
Dependent Claim
46 words
The resin sealing type semiconductor device as defined in claim 10, wherein an insulating layer is formed on the surface of said element mounting member, said insulating layer and said first and second conductive layers being mutually exclusive on the surface of said element mounting member.
Claim 16
Dependent Claim
30 words
The resin sealing type semiconductor device as defined in claim 14, wherein said insulating layer comprises a metal oxide film obtained by oxidizing the metal constituting said element mounting member.
Claim 17
Dependent Claim
52 words
The resin sealing type semiconductor device as defined in claim 1, wherein said element mounting member comprises a large portion and a small portion projecting from said large portion, a surface of said large portion being said element mounting surface, a cross-section of said large and small portions having an inverted T-shape.
Claim 18
Dependent Claim
33 words
The resin sealing type semiconductor device as defined in claim 16, wherein said resin seals said element mounting member except for a top surface of said small portion of said element mounting member.
Claim 19
Dependent Claim
23 words
The resin sealing type semiconductor device as defined in claim 16, wherein said small portion has an undercut extending in the thickness direction.
Claim 20
Dependent Claim
44 words
The resin sealing type semiconductor device as defined in claim 16, wherein said large portion of said element mounting member has a resin penetration hole, said resin penetration hole being formed in said large portion extending in the thickness direction except said small portion.
Claim 21
Dependent Claim
30 words
The resin sealing type semiconductor device as defined in claim 17, wherein a solder layer is formed on said top surface of said small portion of said element mounting member.
Claim 22
Dependent Claim
32 words
The resin sealing type semiconductor device as defined in claim 1 , wherein said frame lead has identify in g projections or notches which provide a marking for wire bonding image recognition.
Claim 23
Dependent Claim
34 words
The resin sealing type semiconductor device as defined in claim 1, wherein said frame lead has substantially rectangular or square ring-shaped planar configuration, said frame lead being supported by support bars at four corners.
Claim 24
Dependent Claim
37 words
The resin sealing type semiconductor device as defined in claim 1, wherein the external diameter of the frame lead is in the range of 15% to 80% relative to the external diameter of the resin sealing portion.
Claim 25
Independent Claim
197 words
A method of making a resin sealing type semiconductor device, comprising the steps of: (a) bonding a semiconductor element to a fixed position of on an element mounting surface of an element mounting member using an adhesive; (b) disposing an insulating lead support portion on said element mounting surface of said element mounting member, disposing a lead frame comprising integrally at least a frame lead, first leads discontinuous with said frame lead, second leads and support bars continuous with said frame lead, and bonding with adhesive said element mounting member and said lead frame with said lead support portion interposed therebetween; said second lead interposed between adjacent support bars; said frame lead is supported by said support bars and second leads so as to be in non-contact with said element mounting member and said semiconductor element; (c) forming wires including wires electrically connecting said first leads and electrodes of the semiconductor element, and wires electrically connecting said frame lead and the electrodes of said semiconductor element, using a wire bonding means; and (d) disposing the components formed in said steps (a) to (c) in a metal mold, and forming a resin sealing portion by a molding process.
Claim 26
Independent Claim
197 words
A method of making a resin sealing type semiconductor device, comprising the steps of: (a) bonding a semiconductor element to a fixed position of on an element mounting surface of an element mounting member using an adhesive; (b) disposing an insulating lead support portion on said element mounting surface of said element mounting member, disposing a lead frame comprising integrally at least a frame lead, first leads discontinuous with said frame lead, second leads and support bars continuous with said frame lead, and bonding with adhesive said element mounting member and said lead frame with said lead support portion interposed therebetween; said second lead interposed between adjacent support bars; said frame lead is supported by said support bars and second leads so as to be in non-contact with said element mounting member and said semiconductor element; (c) forming wires including wires electrically connecting said first leads and electrodes of the semiconductor element, and wires electrically connecting said frame lead and the electrodes of said semiconductor element, using a wire bonding means; and (d) disposing the components formed in said steps (a) to (c) in a metal mold, and forming a resin sealing portion by a molding process.
Claim 27
Dependent Claim
18 words
The method as defined in claim 24, wherein an adhesive used in said step (a) is electrically conductive.
Claim 28
Dependent Claim
54 words
The method as defined in claim 24, wherein at said step (c), wires connecting said first leads and the electrodes of said semiconductor element are formed by depressing said first leads with lead pressers so that ends of said first leads are in contact with said element mounting surface of said element mounting member.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-10-17 | 2004-04-17 | 2004-10-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-10-17 | 2008-04-17 | 2008-10-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-10-17 | 2012-04-17 | 2012-10-17 | $7700.00 | Window Closed / Lapsed |