US6184580B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Ball grid array package with conductive leads
Assignee: Siliconware Precision Industries Co Ltd
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Filing: 1999-09-10
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Granted: 2001-02-06
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Expires: 2019-09-10
Abstract
Abstract A ball grid array package with conductive leads comprising a silicon chip, a heat sink, a plurality of conductive leads, bonding wires, and solder balls, a substrate and a molding compound. The conductive leads and the substrate are positioned below the heat sink such that the conductive leads are sandwiched between one surface of the substrate and the heat sink. The heat sink has a die-attach region for attaching the silicon chip. The silicon chip is electrically connected to contact points on another surface of the substrate and the conductive leads by bonding wires. The conductive leads are directly mounted to a printed circuit board. The contact points on the other surface of the substrate are electrically connected to the printed circuit board through trace lines inside the substrate and the solder balls attached to some of the contact points. The bonding wires, a portion of the conductive leads, and the silicon chip are enclosed by the molding compound for better protection.
Inventors
- 👤 Shih-Hao Lin
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 11:52
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/70; H10W40/77; H10W40/778; H10W70/00; H10W70/40; H10W70/479; H10W74/00; H10W74/10; H10W74/111; H10W74/114; H10W74/117; H10W70/60; H10W70/67; H10W70/68; H10W70/682; H10W72/00; H10W72/071; H10W72/075; H10W72/07551; H10W72/07554; H10W72/50; H10W72/541; H10W72/547; H10W72/851; H10W72/874; H10W72/884; H10W72/90; H10W72/951; H10W90/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/754; H10W90/756
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
307 words
A ball grid array package with conductive leads, comprising: a first heat sink having an exposed surface, a bottom surface, and a die-attach region on the bottom surface of the first heat sink; a plurality of conductive leads with each lead divided into an inner lead portion and an outer lead portion, wherein the inner lead portion of the conductive leads are in contact with the bottom surface of the first heat sink and surrounding the die-attach region and the outer lead portion of the conductive leads extend away from the bottom surface of the first heat sink; a substrate having a first surface and a second surface, wherein the first surface is in contact with the conductive leads so that the inner lead portion of the conductive leads are sandwiched between the first heat sink and the substrate, and the second surface has a plurality of contact points; a silicon chip attached on the die-attach region on the bottom surface of the first heat sink, wherein the silicon chip has an active surface and a back surface, and the back surface is in contact with the bottom surface of the first heat sink; a plurality of bonding wires electrically connecting the inner lead portion of the conductive leads and some of the contact points on the second surface of the substrate to the active surface of the silicon chip; a plurality of solder balls mounted on some of the contact points on the second surface of the substrate, wherein the outer lead portion of the conductive leads are further used to support the ball array package when the ball array package is attached to a circuit board; and a molding compound enclosing the bonding wires, the silicon chip, the inner lead portion of the conductive leads, and the contact points electrically connected to the silicon chip.
Claim 2
Dependent Claim
307 words
A ball grid array package with conductive leads, comprising: a first heat sink having an exposed surface, a bottom surface, and a die-attach region on the bottom surface of the first heat sink; a plurality of conductive leads with each lead divided into an inner lead portion and an outer lead portion, wherein the inner lead portion of the conductive leads are in contact with the bottom surface of the first heat sink and surrounding the die-attach region and the outer lead portion of the conductive leads extend away from the bottom surface of the first heat sink; a substrate having a first surface and a second surface, wherein the first surface is in contact with the conductive leads so that the inner lead portion of the conductive leads are sandwiched between the first heat sink and the substrate, and the second surface has a plurality of contact points; a silicon chip attached on the die-attach region on the bottom surface of the first heat sink, wherein the silicon chip has an active surface and a back surface, and the back surface is in contact with the bottom surface of the first heat sink; a plurality of bonding wires electrically connecting the inner lead portion of the conductive leads and some of the contact points on the second surface of the substrate to the active surface of the silicon chip; a plurality of solder balls mounted on some of the contact points on the second surface of the substrate, wherein the outer lead portion of the conductive leads are further used to support the ball array package when the ball array package is attached to a circuit board; and a molding compound enclosing the bonding wires, the silicon chip, the inner lead portion of the conductive leads, and the contact points electrically connected to the silicon chip.
Claim 3
Dependent Claim
28 words
The package of claim 1 , wherein the first heat sink further includes a first projection device that extends from the first heat sink into the molding compound.
Claim 4
Dependent Claim
55 words
The package of claim 1 , wherein the package further includes a second heat sink having a mounting surface, a rugged surface and an exposed surface, with the mounting surface in contact with the active surface of the silicon chip, the rugged surface in contact with the molding compound, and the exposed surface exposed outside.
Claim 5
Dependent Claim
14 words
The package of claim 3 , wherein the rugged surface includes a roughened surface.
Claim 6
Dependent Claim
34 words
The package of claim 3 , wherein the second heat sink further includes a second projection device at the junction between the exposed surface and the rugged surface, and extends into the molding compound.
Claim 7
Dependent Claim
26 words
The package of claim 1 , wherein the substrate is formed as laminated layers of a plurality of trace layers and at least one insulating layer.
Claim 8
Dependent Claim
14 words
The package of claim 6 , wherein the insulating layer is made of cyanate.
Claim 9
Dependent Claim
16 words
The package of claim 6 , wherein the insulating layer is made of glass epoxybased resin.
Claim 10
Dependent Claim
14 words
The package of claim 6 , wherein the insulating layer is made of polyimide.
Claim 11
Dependent Claim
24 words
The package of claim 1 , wherein the first and the second heat sinks are made of copper, copper alloy, aluminum, or aluminum alloy.
Claim 12
Dependent Claim
322 words
A ball grid array package with conductive leads, comprising: a first heat sink having an exposed surface, a bottom surface, and a die-attach region on the bottom surface of the first heat sink; a plurality of conductive leads with each lead divided into an inner lead portion and an outer lead portion, wherein the inner lead portion of the conductive leads are in contact with the bottom surface of the first heat sink and surrounding the die-attach region and the outer lead portion of the conductive leads extend away from the bottom surface of the first heat sink; a substrate having a first surface and a second surface, wherein the first surface is in contact with the conductive leads so that the inner lead portion of the conductive leads are sandwiched between the first heat sink and the substrate, and the second surface has a plurality of contact points; a silicon chip attached on the die-attach region on the bottom surface of the first heat sink, wherein the silicon chip has an active surface and a back surface, and the back surface is in contact with the bottom surface of the first heat sink; a plurality of bonding wires electrically connecting the inner lead portion of the conductive leads and some of the contact points on the second surface of the substrate to the active surface of the silicon chip; a plurality of solder balls mounted on some of the contact points on the second surface of the substrate; a molding compound enclosing the bonding wires, the silicon chip, the inner lead portion of the conductive leads, and the contact points electrically connected to the silicon chip; and a second heat sink having a mounting surface, a rugged surface and an exposed surface, with the mounting surface in contact with the active surface of the silicon chip, the rugged surface in contact with the molding compound, and the exposed surface exposed outside.
Claim 13
Dependent Claim
322 words
A ball grid array package with conductive leads, comprising: a first heat sink having an exposed surface, a bottom surface, and a die-attach region on the bottom surface of the first heat sink; a plurality of conductive leads with each lead divided into an inner lead portion and an outer lead portion, wherein the inner lead portion of the conductive leads are in contact with the bottom surface of the first heat sink and surrounding the die-attach region and the outer lead portion of the conductive leads extend away from the bottom surface of the first heat sink; a substrate having a first surface and a second surface, wherein the first surface is in contact with the conductive leads so that the inner lead portion of the conductive leads are sandwiched between the first heat sink and the substrate, and the second surface has a plurality of contact points; a silicon chip attached on the die-attach region on the bottom surface of the first heat sink, wherein the silicon chip has an active surface and a back surface, and the back surface is in contact with the bottom surface of the first heat sink; a plurality of bonding wires electrically connecting the inner lead portion of the conductive leads and some of the contact points on the second surface of the substrate to the active surface of the silicon chip; a plurality of solder balls mounted on some of the contact points on the second surface of the substrate; a molding compound enclosing the bonding wires, the silicon chip, the inner lead portion of the conductive leads, and the contact points electrically connected to the silicon chip; and a second heat sink having a mounting surface, a rugged surface and an exposed surface, with the mounting surface in contact with the active surface of the silicon chip, the rugged surface in contact with the molding compound, and the exposed surface exposed outside.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2004-02-06 | 2004-08-07 | 2005-02-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2008-02-06 | 2008-08-07 | 2009-02-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2012-02-06 | 2012-08-07 | 2013-02-06 | $7700.00 | Window Closed / Lapsed |