US6046499A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Heat transfer configuration for a semiconductor device
Assignee: Toshiba Corp
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Filing: 1997-03-26
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Granted: 2000-04-04
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Expires: 2017-03-26
Abstract
Abstract Disclosed is a semiconductor package having: a semiconductor chip; a package substrate; a wire connected to the semiconductor chip; and an electric connection member formed on the package substrate to electrically connect the wire to a printed board when the package substrate is mounted on the printed board. One surface of the package substrate has a first area in which the semiconductor chip is mounted and a second area in which the wire are arranged, and the other surface has a third area which is located in the rear of the second area and in which the electric connection member connects the wire to the printed board and a fourth area which is located in the rear of the first area. A heat-transfer member is provided in the fourth area and transmits heat generated by the semiconductor chip to the printed board through the package substrate.
Inventors
- 👤 Keiichi Yano
- 👤 Hironori Asai
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 12:14
CPC Classifications
H; H10; H10W; H10W90/00; H10W90/701; H10W40/00; H10W40/20; H10W40/22; H10W40/226; H10W40/228; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/075; H10W72/07551; H10W72/07552; H10W72/20; H10W72/50; H10W72/521; H10W72/522; H10W72/851; H10W72/874; H10W72/884; H10W72/90; H10W72/951; H10W74/00; H10W74/10; H10W74/15; H10W90/721; H10W90/724; H10W90/731; H10W90/734; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 21
Claim 1
Independent Claim
211 words
A semiconductor package comprising: a semiconductor chip; a package substrate composed of ceramic on which the semiconductor chip is mounted; a wire formed on the package substrate and connected to the semiconductor chip; and an electric connection member formed on the package substrate to electrically connect the wire to a printed board when the package substrate is mounted on the printed board, wherein one surface of the package substrate has a first area in which the semiconductor chip is mounted and a second area in which the wire is arranged, and the other surface of the package substrate has a third area which is located in the rear of the second area and in which the electric connection member connects the wire to the printed board and a fourth area which is located in the rear of the first area, and wherein the fourth area has neither a wire nor an electric connection for connecting the package substrate and the printed board, the package substrate between the first area and the fourth area has no inner wire, and a heat-transfer member for transmitting heat generated by the semiconductor chip to the printed board through the package substrate is mounted on said other surface of the package substrate in the fourth area.
Claim 2
Dependent Claim
211 words
A semiconductor package comprising: a semiconductor chip; a package substrate composed of ceramic on which the semiconductor chip is mounted; a wire formed on the package substrate and connected to the semiconductor chip; and an electric connection member formed on the package substrate to electrically connect the wire to a printed board when the package substrate is mounted on the printed board, wherein one surface of the package substrate has a first area in which the semiconductor chip is mounted and a second area in which the wire is arranged, and the other surface of the package substrate has a third area which is located in the rear of the second area and in which the electric connection member connects the wire to the printed board and a fourth area which is located in the rear of the first area, and wherein the fourth area has neither a wire nor an electric connection for connecting the package substrate and the printed board, the package substrate between the first area and the fourth area has no inner wire, and a heat-transfer member for transmitting heat generated by the semiconductor chip to the printed board through the package substrate is mounted on said other surface of the package substrate in the fourth area.
Claim 3
Dependent Claim
20 words
The semiconductor package of claim 1, wherein the heat-transfer member is electrically disconnected from the semiconductor chip and the wire.
Claim 4
Dependent Claim
16 words
A semiconductor device produced by mounting the semiconductor package of claim 2, on the printed board.
Claim 5
Dependent Claim
23 words
The semiconductor package of claim 1, wherein the heat-transfer member includes a plurality of spherical balls which are made of a low-melting-point alloy.
Claim 6
Dependent Claim
28 words
The semiconductor package of claim 4, wherein the low-melting-point alloy is selected from the group consisting of tin-lead alloy, tin-zinc alloy, tin-silver alloy, tin-copper alloy and tin-bithmus alloy.
Claim 7
Dependent Claim
16 words
A semiconductor device produced by mounting the semiconductor package of claim 4, on the printed board.
Claim 8
Dependent Claim
44 words
The semiconductor package of claim 1, wherein the electric connection member includes a bump which is formed in the third area on the other surface of the package substrate and a via which penetrates the package substrate to connect the wire and the bump.
Claim 9
Dependent Claim
20 words
The semiconductor package of claim 7, wherein the bump includes a spherical ball which is made of a low-melting-point alloy.
Claim 10
Dependent Claim
28 words
The semiconductor package of claim 8, wherein the low-melting-point alloy is selected from the group consisting of tin-lead alloy, tin-zinc alloy, tin-silver alloy, tin-copper alloy and tin-bithmus alloy.
Claim 11
Dependent Claim
13 words
The semiconductor package of claim 7, wherein the via is formed of copper.
Claim 12
Dependent Claim
28 words
The semiconductor package of claim 1, wherein the package substrate is composed of a material which is selected from the group consisting of aluminum nitride and silicon nitride.
Claim 13
Dependent Claim
16 words
A semiconductor device produced by mounting the semiconductor package of claim 11, on the printed board.
Claim 14
Dependent Claim
15 words
The semiconductor package of claim 1, wherein the package substrate is a single-layer ceramic substrate.
Claim 15
Dependent Claim
14 words
The semiconductor package of claim 1, wherein the wire is formed by using copper.
Claim 16
Dependent Claim
48 words
The semiconductor package of claim 1, wherein the wire has a pattern layer which is formed of tungsten and a plate layer which laminated on the pattern layer, and the plate layer is formed of a material which is selected from the group consisting of gold and copper.
Claim 17
Dependent Claim
16 words
The semiconductor package of claim 1, wherein the wire further has a layer which contains nickel.
Claim 18
Dependent Claim
32 words
The semiconductor package of claim 1, wherein the wire and the semiconductor chip are connected by a bonding wire, and the semiconductor chip and the bonding wire are sealed with a resin.
Claim 19
Dependent Claim
32 words
The semiconductor package of claim 1, wherein the wire and the semiconductor chip are connected by means of flip-chip connection using a bump, and the flip-chip connection is sealed with a resin.
Claim 20
Dependent Claim
21 words
The semiconductor package of claim 1, wherein the semiconductor chip includes a circuit element which is operated with high frequency signal.
Claim 21
Dependent Claim
16 words
A semiconductor device produced by mounting the semiconductor package of claim 1, on the printed board.
References Cited (Backward Citations)
US5239198A
Cited
US5216278A
Cited
US5703397A
Cited
US5272375A
Cited
US5311059A
Cited
US5506755A
Cited
US5285352A
Cited
US5397917A
Cited
US5455456A
Cited
US5698896A
Cited
US5468995A
Cited
US5640048A
Cited
US5907187A
Cited
US5508556A
Cited
US5581122A
Cited
US5561322A
Cited
US5598036A
Cited
US5729432A
Cited
US5909058A
Cited
US5909633A
Cited
US5834848A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-04-04 | 2003-10-04 | 2004-04-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-04-04 | 2007-10-04 | 2008-04-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-04-04 | 2011-10-04 | 2012-04-04 | $7700.00 | Window Closed / Lapsed |