Patent US6560109B2 successfully refreshed from Google Patents.
US6560109B2
Expired / Lapsed
US
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Stack of multilayer modules with heat-focusing metal layer
Assignee: Nytell Software LLC
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Filing: 2001-09-07
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Granted: 2003-05-06
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Expires: 2021-09-07
Abstract
Abstract A stack of multilayer modules has a segmentation layer disposed between neighboring multilayer modules. The segmentation layer facilitates the separation of neighboring multilayer modules. The stack of multilayer modules includes a first multilayer module and a second multilayer module. Each multilayer module includes a plurality of active layers each comprising a substrate, at least one electronic element, and a plurality of electrically-conductive traces. The second multilayer module is disposed to be neighboring the first multilayer module with at least one segmentation layer between the first and second multilayer modules. The segmentation layer includes a metal layer and at least one thermoplastic adhesive layer. When heat is applied, the metal layer conducts heat to the thermoplastic adhesive layer.
Inventors
- 👤 James Satsuo Yamaguchi
- 👤 Angel Antonio Pepe
- 👤 Volkan H. Ozguz
- 👤 Andrew Nelson Camien
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 03:27
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/0097; H10; H10W; H10W90/00; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/0129; H05K2203/00; H05K2203/11; H05K2203/1105; H05K2203/15; H05K2203/1536; H05K2203/16; H05K2203/167; H05K3/0011; H05K3/0044; H05K3/0052; H05K3/40; H05K3/403; H10W40/00; H10W40/20; H10W40/25; H10W40/251; H10W40/255; H10W70/00; H10W70/60; H10W72/00; H10W72/801; H10W90/701; H10W90/721; H10W90/722
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
134 words
A stack of multilayer modules with a segmentation layer disposed between neighboring multilayer modules, the segmentation layer facilitating the separation of neighboring multilayer modules, the stack of multilayer modules comprising: a first multilayer module comprising, a plurality of active layers each comprising a substrate, at least one electronic element, and a plurality of electrically-conductive traces; a second multilayer module comprising a plurality of active layers each comprising a substrate, at least one electronic element, and a plurality of electrically-conductive traces, the second multilayer module disposed to be neighboring the first multilayer module; and at least one segmentation layer between the first and second multilayer modules, the segmentation layer comprising a metal layer and at least one thermoplastic adhesive layer wherein when heat is applied, the metal layer conducts heat to the thermoplastic adhesive layer.
Claim 2
Dependent Claim
134 words
A stack of multilayer modules with a segmentation layer disposed between neighboring multilayer modules, the segmentation layer facilitating the separation of neighboring multilayer modules, the stack of multilayer modules comprising: a first multilayer module comprising, a plurality of active layers each comprising a substrate, at least one electronic element, and a plurality of electrically-conductive traces; a second multilayer module comprising a plurality of active layers each comprising a substrate, at least one electronic element, and a plurality of electrically-conductive traces, the second multilayer module disposed to be neighboring the first multilayer module; and at least one segmentation layer between the first and second multilayer modules, the segmentation layer comprising a metal layer and at least one thermoplastic adhesive layer wherein when heat is applied, the metal layer conducts heat to the thermoplastic adhesive layer.
Claim 3
Dependent Claim
17 words
The stack of multilayer modules of claim 1 , wherein the metal layer comprises copper or aluminum.
Claim 4
Independent Claim
123 words
A method of releasably adhering together neighboring multilayer modules of a stack of multilayer modules, the method comprising: providing a first multilayer module comprising a plurality of active layers each comprising a substrate, at least one electronic element, and a plurality of electrically-conductive traces; providing a second multilayer module comprising a plurality of active layers each comprising a substrate, at least one electronic element, and a plurality of electrically-conductive traces, the second multilayer module disposed to be neighboring the first multilayer module; and disposing a segmentation layer between the first multilayer module and second multilayer module, the segmentation layer comprising a metal layer and a thermoplastic adhesive layer wherein when heat is applied, the metal layer conducts heat to the thermoplastic adhesive layer.
Claim 5
Independent Claim
123 words
A method of releasably adhering together neighboring multilayer modules of a stack of multilayer modules, the method comprising: providing a first multilayer module comprising a plurality of active layers each comprising a substrate, at least one electronic element, and a plurality of electrically-conductive traces; providing a second multilayer module comprising a plurality of active layers each comprising a substrate, at least one electronic element, and a plurality of electrically-conductive traces, the second multilayer module disposed to be neighboring the first multilayer module; and disposing a segmentation layer between the first multilayer module and second multilayer module, the segmentation layer comprising a metal layer and a thermoplastic adhesive layer wherein when heat is applied, the metal layer conducts heat to the thermoplastic adhesive layer.
Claim 6
Dependent Claim
114 words
A stack of multilayer modules, each multilayer module having a plurality of layers wherein each layer has a substrate therein, the stack of multilayer modules comprising: a first multilayer module comprising a first layer having a top side and bottom side, the first layer comprising a substrate, at least one electronic element, and a plurality of electrically-conductive traces; a second multilayer module comprising a second layer having a top side and bottom side, the second layer comprising a substrate, at least one electronic element, and a plurality of electrically-conductive traces; and a metal layer disposed between and adhered to the top side of the first layer and the bottom side of the second layer.
Claim 7
Dependent Claim
114 words
A stack of multilayer modules, each multilayer module having a plurality of layers wherein each layer has a substrate therein, the stack of multilayer modules comprising: a first multilayer module comprising a first layer having a top side and bottom side, the first layer comprising a substrate, at least one electronic element, and a plurality of electrically-conductive traces; a second multilayer module comprising a second layer having a top side and bottom side, the second layer comprising a substrate, at least one electronic element, and a plurality of electrically-conductive traces; and a metal layer disposed between and adhered to the top side of the first layer and the bottom side of the second layer.
Claim 8
Dependent Claim
26 words
The stack of multilayer modules of claim 4 , further comprising a thermoplastic adhesive which releasably adheres the first multilayer module to the second multilayer module.
Claim 9
Dependent Claim
17 words
The stack of multilayer modules of claim 4 , wherein the metal layer comprises copper or aluminum.
Claim 10
Independent Claim
140 words
A method of providing a stack of multilayer modules, each multilayer module having a plurality of layers wherein each layer has a substrate therein, the method comprising: providing a first multilayer module comprising a first layer having a top side and bottom side, the first layer comprising a substrate, at least one electronic element, and a plurality of electrically-conductive traces; providing a second multilayer module comprising a second layer having a top side and bottom side, the second layer comprising a substrate, at least one electronic element, and a plurality of electrically-conductive traces; adhering a metal layer to the top side of the first layer and the bottom side of the second layer; and releasably adhering the first multilayer module to the second multilayer module with the metal layer disposed between the first multilayer module and the second multilayer module.
Claim 11
Independent Claim
140 words
A method of providing a stack of multilayer modules, each multilayer module having a plurality of layers wherein each layer has a substrate therein, the method comprising: providing a first multilayer module comprising a first layer having a top side and bottom side, the first layer comprising a substrate, at least one electronic element, and a plurality of electrically-conductive traces; providing a second multilayer module comprising a second layer having a top side and bottom side, the second layer comprising a substrate, at least one electronic element, and a plurality of electrically-conductive traces; adhering a metal layer to the top side of the first layer and the bottom side of the second layer; and releasably adhering the first multilayer module to the second multilayer module with the metal layer disposed between the first multilayer module and the second multilayer module.
Claim 12
Dependent Claim
136 words
A stack of multilayer modules with a segmentation layer disposed between neighboring multilayer modules, the segmentation layer facilitating the separation of neighboring multilayer modules, the stack of multilayer modules comprising: a first multilayer module comprising a plurality of active layers each comprising a substrate, at least one electronic element, and a plurality of electrically-conductive traces; a second multilayer module comprising a plurality of active layers each comprising a substrate, at least one electronic element, and a plurality of electrically-conductive traces, the second multilayer module disposed to be neighboring the first multilayer module; and at least one segmentation layer between the first and second multilayer modules, the segmentation layer comprising a plurality of metal layers and at least one thermoplastic adhesive layer wherein when heat is applied, the metal layers conducts heat to the thermoplastic adhesive layer.
Claim 13
Dependent Claim
136 words
A stack of multilayer modules with a segmentation layer disposed between neighboring multilayer modules, the segmentation layer facilitating the separation of neighboring multilayer modules, the stack of multilayer modules comprising: a first multilayer module comprising a plurality of active layers each comprising a substrate, at least one electronic element, and a plurality of electrically-conductive traces; a second multilayer module comprising a plurality of active layers each comprising a substrate, at least one electronic element, and a plurality of electrically-conductive traces, the second multilayer module disposed to be neighboring the first multilayer module; and at least one segmentation layer between the first and second multilayer modules, the segmentation layer comprising a plurality of metal layers and at least one thermoplastic adhesive layer wherein when heat is applied, the metal layers conducts heat to the thermoplastic adhesive layer.
Claim 14
Independent Claim
142 words
A method of providing a stack of multilayer modules with a segmentation layer disposed between neighboring multilayer modules, the method comprising: providing a first multilayer module comprising a plurality of active layers each comprising a substrate, at least one electronic element, and a plurality of electrically-conductive traces; providing a second multilayer module comprising a plurality of active layers each comprising a substrate, at least one electronic element, and a plurality of electrically-conductive traces, the second multilayer module disposed to be neighboring the first multilayer module; and releasably adhering the first multilayer module and the second multilayer module by disposing at least one segmentation layer between the first and second multilayer modules, the segmentation layer comprising a plurality of metal layers and at least one thermoplastic adhesive layer wherein when heat is applied, the metal layers conducts heat to the thermoplastic adhesive layer.
Claim 15
Independent Claim
142 words
A method of providing a stack of multilayer modules with a segmentation layer disposed between neighboring multilayer modules, the method comprising: providing a first multilayer module comprising a plurality of active layers each comprising a substrate, at least one electronic element, and a plurality of electrically-conductive traces; providing a second multilayer module comprising a plurality of active layers each comprising a substrate, at least one electronic element, and a plurality of electrically-conductive traces, the second multilayer module disposed to be neighboring the first multilayer module; and releasably adhering the first multilayer module and the second multilayer module by disposing at least one segmentation layer between the first and second multilayer modules, the segmentation layer comprising a plurality of metal layers and at least one thermoplastic adhesive layer wherein when heat is applied, the metal layers conducts heat to the thermoplastic adhesive layer.
Claim 16
Dependent Claim
130 words
A stack of multilayer modules with a segmentation layer disposed between neighboring multilayer modules, the segmentation layer facilitating the separation of neighboring multilayer modules, the stack of multilayer modules comprising: a first multilayer module comprising a first active layer comprising a substrate, at least one electronic element, and a plurality of electrically-conductive traces; a second multilayer module comprising a second active layer comprising a substrate, at least one electronic element, and a plurality of electrically-conductive traces, the second active layer disposed to be neighboring the first active layer; and at least one segmentation layer between the first and second active layers, the segmentation layer comprising a metal layer and at least one thermoplastic adhesive layer wherein when heat is applied, the metal layer conducts heat to the thermoplastic adhesive layer.
Claim 17
Dependent Claim
130 words
A stack of multilayer modules with a segmentation layer disposed between neighboring multilayer modules, the segmentation layer facilitating the separation of neighboring multilayer modules, the stack of multilayer modules comprising: a first multilayer module comprising a first active layer comprising a substrate, at least one electronic element, and a plurality of electrically-conductive traces; a second multilayer module comprising a second active layer comprising a substrate, at least one electronic element, and a plurality of electrically-conductive traces, the second active layer disposed to be neighboring the first active layer; and at least one segmentation layer between the first and second active layers, the segmentation layer comprising a metal layer and at least one thermoplastic adhesive layer wherein when heat is applied, the metal layer conducts heat to the thermoplastic adhesive layer.
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